Lumileds Luxeon Rebel LED Lamp Teardown and Technology Analysis

Table of Contents

• 1. Product Identification
• 2. External Appearance and Principal Dimensions
• 3. Package General Description
  • Substrate structure and material
  • Phosphor and encapsulation
  • Die configuration and attach
  • Electrical protection
  • Table of package parameters
• 4. Semiconductor Die
  • Materials, dimensions, and singulation
  • Back-side appearance
  • Front-side interconnect
• Redistribution layer
• Lower level contact
• Upper level contact
  • Table of die process parameters
  • Epi-stack
• 5. Summary