Abstract
The device is a surface mount gull wing device containing a GaN LED chip. Considerable attention has been paid to current distribution, heat dissipation, and to reflectivity in this device.
MuAnalysis has used a large variety of analytical techniques including electron microscopy with photochemical delineation, EDX and FTIR spectroscopy to probe the insides of this LED lamp and reveal its secrets. Back-side appearance, front-side interconnect, redistribution layer, lower & upper level contact, table of die process parameters, Epi-stack are described in detail with plenty of photos, tables and graphs. | 
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