Table of Contents
h4. Product Identification
2. External Appearance and Principal Dimensions
3. Package General Description
- Substrate structure and material
- Lens assembly
- Phosphor and encapsulation
- Die configuration and attach
- Electrical protection
- Table of package parameters
4. Semiconductor Die
- Materials, dimensions, and singulation
- Back-side appearance
- Front-side interconnect
- Redistribution layer
- Lower level contact
- Upper level contact
- Epi-stack
- Table of die process parameters
5. Summary |
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