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Electronic Components

Semiconductor Manufacturing Equipments

Semiconductor Material

Lighting and LED

Printed Electronics

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Market Research Report

CREE XLamp LED Lamp Teardown and Technology Analysis

Published by	MuAnalysis
Published	2008/04	Content info
Product code	MUAN79900
Price	From US $ 3000

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Table of Contents

Product Identification

2. External Appearance and Principal Dimensions

3. Package General Description

Substrate structure and material
Phosphor and encapsulation
Die configuration and attach
Electrical protection
Table of package parameters

4. Semiconductor Die

Materials, dimensions, and singulation
Appearance
- Lower level contact
- Upper level contact
Epi-stack
Table of die process parameters

5. Summary

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