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Electronic Components

Semiconductor Manufacturing Equipments

Semiconductor Material

Lighting and LED

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Market Research Report

Infineon vs. CREE 6 Amp SiC Schottky Diode Teardown and Technology Analysis

Published by	MuAnalysis
Published	2008/02	Content info
Product code	MUAN79905
Price	From US $ 2000

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Table of Contents

1. Product Identification

2. External appearance and Principal Dimensions

3. Package

Encapsulation
Leadframe structure and material
Die attach
Wirebonding

4. Semiconductor Die

Dimensions, Thickness, Die photo
Materials and Structure
Substrate/epi-layer
Schottky contact
Passivation
Edge structure
Back contact

5. Electronic Structure

OBIC Analysis
Raman Spectroscopy

6. Summary

Related Report

SiC'10 - How SiC will impact electronics: A 10 year projection The GaAs IC Market Sapphire Substrate Market 2008 Compound Semiconductor Materials: Technology, Developments and Markets GaN RF '08

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