Seoul Semiconductor Z-Power LED P9 Series Teardown and Technology Analysis

Table of Contents

1. Product Identification

2. External Appearance and Principal Dimensions

3. Package General Description

• Fluorescent medium and encapsulation
• Die configuration and attach
• Electrical protection
• Table of package parameters

4. Semiconductor Die

• Materials, dimensions, and singulation
• Appearance
  • Lower level contact
  • Upper level contact
• Epi-stack
• Process sequence
• Table of die process parameters

5. Summary