The Future of Organic Electronics Manufacturing

Table of Contents

Executive Summary

• E.1 Summary of Organic Manufacturing Methods
  • E.1.1 Printing vs. Blanket Deposition
  • E.1.2 Major Deposition Methods
  • E.1.3 Major Device Categories and Requirements
• E.2 Opportunities for Equipment Producers
• E.3 Opportunities for Materials Suppliers
• E.4 Major Equipment Suppliers
• E.5 Summary of Capacity Forecasts for Organic Electronics

Chapter One: Introduction

• 1.1 Background to this Report
  • 1.1.1 Perspective #1: Availability of Equipment
  • 1.1.2 Perspective #2: Availability of Materials
  • 1.1.3 Perspective #3: Device and Process Readiness
  • 1.1.4 Perspective #4: Market Readiness
• 1.2 Objectives and Scope
• 1.3 Methodology
• 1.4 Plan of this Report

Chapter Two: Key Manufacturing Trends in Organic Electronics

• 2.1 Current and Future Manufacturing Technologies for Organic Electronics
  • 2.1.1 Classical and Novel Vapor Deposition Techniques
  • 2.1.2 Printing
  • 2.1.3 Patterning Techniques
  • 2.1.4 Other Relevant Techniques
  • 2.1.5 Note on Crystallinity
• 2.2 Manufacturing Requirements by Product Category
  • 2.2.1 OLED
  • 2.2.2 Organic Thin Film Transistors
  • 2.2.3 Organic Photovoltaics
  • 2.2.4 Organic Photodetectors
• 2.3 Enhancement of Stability
• 2.4 Key Points Made in This Chapter

Chapter Three: Organic Electronics Manufacturing Technologies

• 3.1 Introduction
• 3.2 OLEDs
  • 3.2.1 Evaporated Small Molecule (Kodak and UDC)
  • 3.2.2 Small Molecule Solution Processing (DuPont)
  • 3.2.3 Printed Polymer (CDT/Sumitomo)
  • 3.2.4 Roll-to-Roll Polymer (GE)
  • 3.2.5 Market Context, Competition
• 3.3 OTFT
  • 3.3.1 Pentacene-OLED Backplane (Sony)
  • 3.3.2 Pentacene-E-Paper Backplane (Polymer Vision)
  • 3.3.3 Printed Polymer-E Paper Backplane (Plastic Logic)
  • 3.3.4 Printed Organic RFID Chips (PolyIC, IMEC)
  • 3.3.5 Other Processes (Infineon, 3M, ORFID, etc.)
  • 3.3.6 Notes on Stability
  • 3.3.7 Competitors to OTFTs by Target Market Application
• 3.4 Solar Cells
  • 3.4.1 Printed Bulk Heterojunction (Konarka)
  • 3.4.2 Transparent Cell Technology (Solarmer)
  • 3.4.3 Printed Dye Solar Cells (G24i)
  • 3.4.4 Market Risk and Competitors
• 3.5 Photodetectors and Sensors
  • 3.5.1 X-Ray Detector (Siemens)
  • 3.5.2 Printed Biodetector (NANOIDENT)
  • 3.5.3 PARC
  • 3.6 Specialized Materials
  • 3.6.1 Substrates
  • 3.6.2 Semiconductors
  • 3.6.3 Barrier Materials
• 3.7 Equipment
  • 3.7.1 Generic Equipment
  • 3.7.2 Printers
• 3.8 Key Points Made in this Chapter

Chapter Four: Organic Semiconductor-Based Device Capacity Forecasts

• 4.1 Introduction and Forecasting Methodology
  • 4.1.1 Forecasting Capacity
  • 4.1.2 Forecasting Equipment
  • 4.1.3 Changes from Previous NanoMarkets Reports
  • 4.1.4 Data Sources
• 4.2 Eight-year Capacity Forecasts by Type of Device Produced
  • 4.2.1 Organic Light Emitting Diodes (OLEDs)
  • 4.2.2 Organic Thin-Film Transistors (OTFTs)
  • 4.2.3 Organic Photovoltaics (OPVs)
  • 4.2.4 Organic Photodetectors and Sensors (OPDs)
• 4.3 Eight-year Equipment Forecasts by Type of Device Produced
  • 4.3.1 Methodology
  • 4.3.2 OLED
  • 4.3.3 OTFT
  • 4.3.4 OPV
  • 4.3.5 OPD
• 4.4 Eight-year Capacity Forecasts by Type of Manufacturing Equipment Used
• Abbreviations and Acronyms Used in This Report

List of Exhibits

• Exhibit E-1: Worldwide Organic Manufacturing Capacity (million sq.meters/yr)
• Exhibit E-2: Worldwide Organic Manufacturing Equipment Outlay ($ millions/yr)
• Exhibit 4-1: Worldwide OLED Capacity
• Exhibit 4-2: Worldwide Capacity for OTFT-Based Backplanes
• Exhibit 4-3: Worldwide Capacity for OTFT-Based RFID
• Exhibit 4-4: Worldwide Capacity for OTFT-Based Backplanes and RFID
• Exhibit 4-5: Worldwide Capacity for OPV- and DSC- Based Solar
• Exhibit 4-6: Worldwide OPD Device Capacity
• Exhibit 4-7: OLED Display Process Comparison*
• Exhibit 4-8: Unit Operations Capacity Costs (US$ per square meter per year annual capacity)
• Exhibit 4-9: Capacity Demand for Benchmark Devices by Unit Operation
• Exhibit 4-10: Equipment Costs by Device (US$ per square meter per annual capacity)
• Exhibit 4-11: OLED Display Capital Expenditure
• Exhibit 4-12: OLED Lighting Capital Expenditure
• Exhibit 4-13: OTFT-based Backplanes Capital Expenditure
• Exhibit 4-14: OTFT-based RFID Capital Expenditure
• Exhibit 4-15: Worldwide OPV and DSC Capital Expenditure
• Exhibit 4-16: Worldwide Capacity by Equipment Type (Millions m2/yr)
• Exhibit 4-17: Worldwide Capital Expenditure by Equipment Type ($ Millions/yr)
• Exhibit 4-18: Worldwide Organic Manufacturing Capacity (million square meters/yr)
• Exhibit 4-19: Worldwide Organic Manufacturing Equipment Outlay ($ millions/yr)