Table of Contents
1.0 Introduction
- 1.1 General
- 1.2 NFC Specifics
- 1.3 Short-reach Radio Specifics
- 1.4 Report Structure
- 1.5 Methodology
- 1.6 Intended Audience
2.0 UWB: Technology and Market Specifics
- 2.1 History
- 2.2 Definition
- 2.3 Spectrum Allocation
- 2.4 Major Features
- 2.4.1 Communications Features
- 2.5 Standards and Regulations
- 2.5.1 Multiband OFDM
- 2.5.2 DS-UWB
- 2.5.3 Comparison
- 2.5.4 IEEE
- 2.5.5 FCC and ETSI
- 2.5.6 ECMA International
- 2.5.7 European Regulators
- 2.5.7.1 EUWB
- 2.5.8 Worldwide
- 2.5.9 Comparison
- 2.5.9.1 Impulse Radio- Pulse Link, Time Domain
- 2.5.9.2 DS-CDMA - Motorola and other
- 2.5.9.3 Multi-Band OFDM (FH) - MBOA
- 2.6 Applications
- 2.7 Issues
- 2.8 Applications Summary
- 2.9 UWB Market
- 2.9.1 General
- 2.9.2 Forecast
- 2.9.2.1 Conditions
- 2.9.2.2 Drivers
- 2.9.2.3 Analysis
- 2.9.3 Comments
- 2.10 Industry: UWB
- Alereon (chipsets)
- Artimi (merged with Staccato - November 2008)
- BBN (UWB radio, first responders)
- Belkin (USB)
- Camero (radar, equipment for first responders)
- Fujitsu Components (antenna, filter)
- General Atomics (chipsets)
- GeFen (HDMI Extender)
- Intel (ICs)
- Parco (RFID-Health Care)
- Pulse~ Link (chipsets)
- Sigma Designs
- Staccato (chipsets)
- Time Domain (chipsets-fusion of communications & radar)
- Toshiba (Wireless USB)
- Ubisense (RFID-tracking)
- Wisair (chipsets)
- Zebra (Real Time Locating Systems)
3.0 ZigBee
- 3.1 General
- 3.2 Details
- 3.2.1 Major Features
- 3.2.2 Device Types
- 3.3 Protocol Stack
- 3.3.1 Physical and MAC layers - IEEE802.15.4
- 3.3.2 Frame
- 3.3.3 Upper Layers
- 3.4 Interoperability
- 3.5 Security
- 3.6 Platform Considerations
- 3.7 Battery Life
- 3.8 ZigBee Technology Benefits and Limitations
- 3.9 Standardization Process
- 3.9.1 ZigBee Alliance
- 3.9.2 Example: Smart Energy Profile-ICT for Smart Grid
- 3.10 ZigBee IP
- 3.11 IEEE 802.15.4 - ZigBee Basis
- 3.12 Application Specifics - Profiles
- 3.13 Applications
- 3.13.1 General
- 3.13.2 Home
- 3.13.3 PC
- 3.13.4 Manufacturing
- 3.13.5 WSN-UGS and ZigBee
- 3.14 “Green” ZigBee
- 3.15 Market
- 3.15.1 Expectations
- 3.15.2 Segments
- 3.15.3 Forecast
- 3.16 Industry
- Airbee (Software)
- Amber (RF Modules)
- Arch Rock (IP)
- Atmel (Chipsets)
- Atmel and TazTag (NFC+ZigBee)
- CEL (Modules; NFC+ZigBee)
- Chipcon - TI (Chipsets)
- Cirronet-RFM (Modules-Industrial Applications)
- Crossbow (WSN, Environment Monitoring, motes)
- Digi (Radios, Routers, Energy Management)
- Duolog (Transceivers)
- Ember (Chipsets, HAN applications)
- EnergyHub (Smart Home)
- GreenPeak (WSN)
- Helicomm (Modules)
- Jennic (Chipsets-Modules)
- Freescale (Chipsets)
- Nuri Telecom (AMR Application)
- Oki (Chipsets)
- Open Peak (Power Management)
- Renesas (Platforms, AMR)
- Silicon Laboratories (Chipsets, Modules)
- Synapse (Module, Protocols)
- Telegesis (Integrator, Modules)
- TI (Chipsets)
4.0 IEEE 802.15.1 (Bluetooth)
- 4.1 Protocol Stack
- 4.1.2 Transport layer
- 4.1.2.1 Radio Layer
- 4.1.2.2 Baseband and Link Layers
- 4.1.3 Middleware Layer
- 4.2 Bluetooth Security
- 4.3 Highlights
- 4.4 Market
5.0 802.11n Technology
- 5.1 Advanced Technologies and IEEE 802.11n: MIMO and Others
- 5.1.1 General
- 5.1.2 MIMO
- 5.1.2.1 “True MIMO”
- 5.1.2.2 BeamFlex
- 5.1.2.3 Atheros
- 5.1.3 Spatial Multiplexing
- 5.1.4 OFDM
- 5.1.5 Channel Bonding
- 5.1.6 Packet Aggregation
- 5.2 Features
- 5.2.1 Specifics
- 5.2.2 Channel Bandwidth
- 5.3 Adaptation
- 5.4 Benefits and Applications
- 5.4.1 Benefits
- 5.4.2 Applications
- 5.5 Market
- 5.5.1 General: Drivers
- 5.5.2 Market Forecast
- 5.5.2.1 Model Assumptions
- 5.5.2.2 Forecast
- 5.5.2.2.1 Chipsets
- 5.5.2.2.2 Equipment
- 5.6 Industry
- Aerohive (AP)
- Aruba (AP)
- Asus (Router)
- Atheros (Chipsets; combo BT-802.1n)
- Buffalo (Router, AP)
- Belkin (Router, Adaptors)
- Broadcom (Chipsets; combo)
- Cisco (AP)
- Colubris-HP ProCurve (AP)
- CSR (Chips)
- D-Link (Router)
- Encore (Adapter)
- Edimax (Router, Adapter)
- Extreme (AP)
- Extricom (AP)
- Gemtek (Router)
- Intel (Chipsets)
- Linksys (Routers)
- Marvell (Chipsets)
- Meru (Family of Products)
- Metalink (Chipsets)
- Motorola (Tools, AP)
- NEC (Router)
- Netgear (Router, AP)
- RedPine (Chipsets)
- Ruckus (AP)
- Ralink (Chipsets)
- Product Line Brief
- Siemens (AP)
- SiGe (Chipsets)
- TopCom (Router)
- Trapeze (Controller)
- TrendNet (Routers, AP)
- ZyXel (AP, Router, Adapter)
6.0 Near Field Communications
- 6.1 General
- 6.2 Characteristics
- 6.3 Standards
- 6.3.1 General
- 6.3.2 ECMA (Near Field Communication Interface and Protocol (NFCIP-1)
- 6.3.3 ISO
- 6.3.4 NFC Forum
- 6.3.4.1 General
- 6.3.4.2 Specifications
- 6.3.4.3 Summary
- 6.3.5 Single Wire Protocol
- 6.3.6 NFC and ETSI
- 6.4 Security
- 6.5 Comparison
- 6.5.1 Bluetooth
- 6.5.2 RFID
- 6.6 Applications
- 6.6.1 General
- 6.6.2 Primary Users
- 6.6.3 Mobile Phone - Major Application
- 6.6.3.1 Example
- 6.6.3.2 Danger
- 6.6.4 WPAN Applications
- 6.6.5 Payment and Ticketing
- 6.6.6 Smart Poster
- 6.6.7 NFC and WiFi
- 6.6.8 NFC and UWB
- 6.6.9 Trials
- 6.7 NFC Market
- 6.7.1 General
- 6.7.2 Market Drivers
- 6.7.3 Estimate
- 6.8 Vendors
- Alvin
- Arygon
- Infineon
- Innovision
- Inside Contactless
- Legic
- Mocapay
- Motorola
- NEC
- Nokia
- Nexperts
- NXP
- OTI
- Reslink
- Sagem Orga
- Sony
- STmicroelectronics
- StolPan
- Toppan Forms
- Twinlinx
- UPM Raflatac
- Venyon
- VivoTech
- Wireless Dynamics
- Zenius
7.0 Conclusions
FIGURES:
- Figure 1: UWB Spectrum
- Figure 2: OFDM Frequency Segments
- Figure 3: DS-UWB Spectrum Characteristics
- Figure 4: Spectrum Regulations-UWB
- Figure 5: Spectrum Illustration
- Figure 6: Europe
- Figure 7: Japan and Korea
- Figure 8: Canada
- Figure 9: Market Estimate: UWB Circuitry ($B)
- Figure 10: Market Estimate: UWB IC Shipments (Unit M)
- Figure 11: Estimate of UWB Market - Communications Applications ($B)
- Figure 12: UWB IC-WSN-UGS Market Segment ($M)
- Figure 13: ZigBee Protocol Stack
- Figure 14: Profiles
- Figure 15: Estimate: ZigBee Modules Market Worldwide ($M)
- Figure 16: Estimate: ZigBee Modules Market Worldwide (M Units)
- Figure 17: ZigBee Market Segmentation (2009)
- Figure 18: ZigBee Market Segmentation (2013)
- Figure 19: Bluetooth Protocol Stack
- Figure 20: Piconets Illustration
- Figure 21: Global Bluetooth Revenue Market Forecast ($B)
- Figure 22: Two-antenna MIMO system with two-stream SDM example
- Figure 23: 802.11 Protocol Family MAC Frame Structure
- Figure 24: Addressable Market: Worldwide WiFi Chipsets Shipping (Unit M)
- Figure 25: Addressable Market: 802.11n Chipsets Worldwide Shipping (Unit M)
- Figure 26: Addressable Market: WiFi Chipsets Worldwide Shipping ($B)
- Figure 27: Addressable Market: 802.11n Chipsets Worldwide Shipping ($B)
- Figure 28: Market Geography: 802.11 Chipsets Production
- Figure 29: Addressable Market Estimate: 802.11n Equipment Shipping ($B)
- Figure 30: Addressable Market: 802.11n Equipment Sales (Unit M)
- Figure 31: Standardization
- Figure 32: NFC ECMA and ISO Standards
- Figure 33: ISO Protocols
- Figure 34: NFC Forum Activities
- Figure 35: Mobile Phone with NFC
- Figure 36: Cell Phones Addressable Market (Millions Units)
- Figure 37: Cell Phones and Accessories-Addressable market ($B)
- Figure 38: NFC-able Cell Phones: Addressable Market (Units Million)
- Figure 39: NFC-able Cell Phones: Addressable Market ($M)
- Figure 40: NFC-able Cell Phone Rate of Penetration
- Figure 41: NFC Electronics Market Estimate ($M)
- Figure 42: Market Estimate: UWB-NFC Electronics Sales ($M).
- Figure 43: NFC Market Geography
TABLES:
- Table 1: Comparison: DS-UWB and MB-OFDM
- Table 2: FCC Emission Limits
- Table 3: Comparison
- Table 4: UWB Applications: Summary
- Table 5: UWB Market Segments
- Table 6: ZigBee Parameters
- Table 7: ZigBee Smart Energy Profile Feature Set
- Table 8: BT Advanced Characteristics
- Table 9: Comparison of Different 802.11 Members Transfer Rates
- Table 10: 802.11n Advantages
- Table 11: NFC Features
- Table 12: NFC History
- Table 13: NFC Development
- Table 14: Bluetooth and NFC
- Table 15: NFC-based Payment Systems -Trials
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