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Market Research Report
Unattended Ground Sensors: Communications Technologies and Markets, Issue II
Published by
Practel, Inc.
Published
2008/07
Content info
REPORT UPDATED ANNUALLY!
Product code
PRA50986
Price
From
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Table of Contents
1.0 Introduction
1.1 General
1.1.1 Developments
1.2 UWB
1.2.1 Brief Description
1.3 ZigBee
1.4 UGS-based WSN
1.4.1 Unattended Ground Sensors (UGS)
1.5 Scope
1.6 Structure
1.7 Research Methodology
1.8 Target Audience
2.0 UWB: Technology and Market Specifics
2.1 General
2.1.2 History
2.1.3 Obstacles
2.2 Definition
2.2.1 Rates
2.3 Spectrum Allocation
2.3.1 Choices
2.4 Major Features
2.4.1 Communications Features
2.5 Standards and Regulations
2.5.1 Multiband OFDM
2.5.2 DS-UWB
2.5.3 Comparison
2.5.4 Standards Bodies
2.5.5 FCC and ETSI
2.5.6 ECMA International
2.5.7 European Regulators
2.5.8 Comparison
2.5.8.1 Impulse Radio- Pulse Link, Time Domain
2.5.8.2 DS-CDMA - Motorola and other
2.5.8.3 Multi-Band OFDM (FH) - MBOA
2.6 Applications
2.6.1 General
2.6.2 Home Security-UGS
2.6.3 Phones
2.6.4 RFID
2.6.5 Communications and Imaging
2.6.6 WPAN
2.6.7 Imaging systems
2.6.8 Vehicular radar systems
2.6.9 Ranging
2.6.10 Public Safety
2.7 WSN-UGS and UWB
2.7.1 General
2.7.2 UWB Role
2.7.2.1 UWB-structured WSN-UGS
2.7.2.2 Features
2.8 Issues
2.9 Applications Summary
2.10 UWB Market
2.10.1 General
2.10.1.1 Major Segments
2.10.2 Forecast
2.10.3 Comments
2.11 Industry: UWB and WSN
Aether Wire & Location (localization sensors)
AirGate (sensors)
Alereon (chipsets)
BBN (radio, first responders)
Belkin
Camero (radar, equipment for first responders)
Focus Enhancement (chipsets)
Fujitsu Components (antenna, filter)
General Atomics (chipsets)
Intel
Multispectral (RFID and others)
Parco (RFID-Health Care)
Pulse~ Link (chipsets)
Staccato (chipsets)
TriQuint (chipsets - homeland security applications)
Time Domain (chipsets-fusion of communications & radar)
Tzero (chipsets)
Ubisense (RFID-tracking)
Wisair (chipsets)
WiQuest (chipsets)
3.0 ZigBee
3.1 General
3.2 Technology
3.2.1 Major Features
3.2.2 Device Types
3.2.3 Protocol Stack
3.2.3.1 Physical and MAC Layers - IEEE802.15.4
3.2.3.1.1 Frame
3.2.3.2 Upper Layers
3.2.3.2.1 Interoperability
3.2.3.2.2 Security
3.2.4 Platform Considerations
3.2.4.1 Battery Life
3.2.5 ZigBee Technology Benefits and Limitations
3.3 Standardization Process
3.3.1 ZigBee Alliance
3.3.1.1 Objectives
3.3.2 802.15.4- ZigBee Basis
3.3.2.1 IEEE 802.15.4 Radio
3.3.2.2 Application Specifics
3.4 Applications
3.4.1 General
3.4.2 Home
3.4.2.1 PC
3.4.3 Manufacturing
3.4.4 WSN-UGS and ZigBee
3.4.4.1 General
3.4.4.2 ZigBee Role
3.4.4.2 ZigBee-structured WSN-UGS
3.5. Market
3.5.1 Expectations
3.5.2 Segments
3.5.3 Forecast
3.6 Industry
Airbee (Software)
Amber (RF Systems)
Arch Rock (WSN-UGS-ZigBee)
Atmel (Chipsets)
Chipcon - TI (Chipsets)
Cirronet (Modules)
Crossbow (WSN, motes)
Digi (Radio)
Duolog (Transceivers)
Eazix (Modules)
Ember (Chipsets)
Falcom (Modules)
GreenPeak
Helicomm (Modules)
Jennic (Chipsets-Modules)
Freescale (Chipsets)
MeshNetics (Modules)
Moteiv- Sentila (Modules, SW)
Nanotron (Chipsets)
Oki (Chipsets)
Renesas (Platforms)
Silicon Laboratories (Chipsets, Modules)
Synapse
Telegesis (Integrator)
4.0 Competition Landscape
4.1 Climate of Competition
4.1.1 Bluetooth and ZigBee
4.1.1.1 Air Interface
4.1.1.2 Battery Drain
4.1.1.3 Timing Considerations
5.0 UGS Technology- Specifics and Applications
5.1 Smart Sensor Structure
5.1.1 Classification
5.1.2 Details
2.7.2.1 WSN-UGS
2.7.2.2 Requirements
5.2 Networking
5.2.1 WSN-UGS: Examples
5.3 UGS Functioning
5.3.1 Parameters and Requirements
5.3.2 Details
5.3.2.1 Examples Of Functioning
5.3.3 Future Combat Systems
5.3.3.1 Subgroups
5.3.3.1.1 Tactical Subgroup
5.3.3.1.2 Urban/MOUT Advanced Sensor Systems
5.3.4 Intelligent Munitions System (IMS)
5.4 Standardization: IEEE 1451
5.4.1 General
5.4.2 Family
5.4.3 Description
5.5 Applications
5.5.1 General
5.5.2 Applications Examples
5.5.2.1 Military Example: REMBASS Family
5.5.2.2 Military: Future
5.6 Challenges
5.7Market Characteristics
5.7.1 Trends
6.0 UGS Vendors
BAE Systems
BBN
Crossbow (WSN)
Crane (WSN-ZigBee)
Dust Networks (USG-Mesh)
Elta
Exensor
Intel (Chipsets)
Freescale (sensors)
Harris (UGS)
IWT (Mesh)
L3 (UGS)
McQ (UGS)
MeshDynamics (Mesh)
Millennial Net (Mesh-UGS)
Moteiv-Sentilla (WSN)
MeshNetics (WSN Software)
Newtrax (WSN-mesh, UGS)
Nelco
NRL (UGS)
NorthropGrumman (UGS)
Octave Technologies (SW, WSN)
Plextek (Communications Platform for UGS)
Qual-Tron
Rheinmetall (UGS)
Selex (UGS)
Sensicast (WSN)
Strix (Mesh)
Telonics
TextRon (UGS)
Thales (UGS)
Trident (UGS-UWB)
Zeltech
7.0 Conclusions
FIGURES:
Figure 1: UWB Spectrum
Figure 2: OFDM Frequency Segments
Figure 3: DS-UWB Spectrum Characteristics
Figure 4: Spectrum Regulations-UWB
Figure 5: Spectrum Illustration
Figure 6: WSN-UGS and UBW
Figure 7: Market Estimate: UWB Circuitry ($B)
Figure 8: Market Estimate: UWB IC Shipments (Unit M)
Figure 9: Estimate of UWB Market - Communications Applications ($B)
Figure 10: UWB IC-WSN-UGS Market Segment ($M)
Figure 11: ZigBee Protocol Stack
Figure 12: Estimate: ZigBee Chipsets Market Worlwide ($M)
Figure 13: ZigBee Market Segmentation (2008)
Figure 14: ZigBee Market Segmentation (2013)
Figure 15: Two Groups
Figure 16: UGS-Functions
Figure 17: UGS Technologies
Figure 18: Distribution Factor
Figure 19: WSN-UGS Node
Figure 20: Market Estimate: UGS Nodes Sale ($M)
Figure 21: Market Estimate: UGS Nodes Shipped (Million Units)
Figure 22: UGS Market Geographical Segmentation
Figure 23: UGS Network Sizing
TABLES:
Table 1: Comparison: Conventioanl Ad Hoc Network and WSN
Table 2: Comparison: DS-UWB and MB-OFDM
Table 3: FCC Emission Limits
Table 4: Comparison
Table 5: UWB Applications: Summary
Table 6: UWB Market Segments
Table 7: ZigBee Parameters
Table 8: Comparison
Table 9: UGS Node-Price Components
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