Wireless Mesh Networks and Intelligent Transport Systems

Table of Contents

1.0 Introduction

• 1.1General
• 1.2 WMN: the Industry Efforts
• 1.3 New Tasks
• 1.4 Technologies
• 1.5 Definition
• 1.6 Features
  • 1.6.1 Ad-Hoc and Mesh
• 1.7 ITS - General
• 1.8 Scope
• 1.9 Research Methodology
• 1.10 Target Audience

2.0 Mesh Networks: Standards

• 2.1 General
• 2.2 IEEE 802.11s
  • 2.2.1 Standardization Process
    • 2.2.1.1 Wi-Mesh Alliance
    • 2.2.1.2 SEEMesh
    • 2.2.1.3 Selection

3.0 Radio Technologies

• 3.1 IEEE 802.11n
  • 3.1.1 Advanced Technologies: MIMO and Others
    • 3.1.1.1 General
    • 3.1.1.2 Spatial Multiplexing
    • 3.1.1.3 OFDM
  • 3.1.2 Directions
  • 3.1.3 Standard
    • 3.1.3.1 Ratification
      • 3.1.3.1.1 EWC
  • 3.1.4 Details: Technology
  • 3.1.5 Market
    • 3.1.5.1 General
    • 3.1.5.2 Market Forecast
      • 3.1.5.2.1 Model Assumptions
      • 3.1.5.2.2 Estimate
        • 3.1.5.2.2.1 Chipsets
        • 3.1.5.2.2.2 Platforms
  • 3.1.6 802.11n Industry Players
    • Apple
    • Atheros
    • Belkin
    • Broadcom
    • Buffalo
    • ESQube
    • Intel
    • Ruckus
    • Linksys
    • Marvell
    • Metalink
    • NEC
    • Netgear
    • SiGe
    • TrendNet
• 3.2 ZigBee
  • 3.2.1 General
  • 3.2.2 Device Types
  • 3.2.3 Protocol Stack
    • 3.2.3.1 Physical and MAC layers - IEEE802.15.4
      • 3.2.3.1.1 Frame
  • 3.2.4 Upper Layers
  • 3.2.5 Interoperability
  • 3.2.6 Security
  • 3.2.7 Platform Considerations
    • 3.2.7.1 Battery Life
  • 3.2.8 Technology Benefits and Limitations
  • 3.2.9 Standardization Process
    • 3.2.9.1 ZigBee Alliance
    • 3.2.9.2 Objectives
    • 3.2.9.3 802.15.4- ZigBee Basis
    • 3.2.9.4 IEEE 802.15.4 Radio
    • 3.2.9.5 Application Specifics
  • 3.2.10 ZigBee Role
  • 3.2.11 Market
    • 3.2.11.1 Expectations
    • 3.2.11.2 Segments
    • 3.2.11.3 Forecast
  • 3.2.12 Industry
    • AeroComm
    • Airbee (Software)
    • Amber (RF Systems)
    • Atmel (Chipsets)
    • Chipcon -TI (Chipsets)
    • Cirronet (Modules Industrial Automation)
    • CrossBow
    • Duolog (Transceivers)
    • Eazix (Modules)
    • Ember (Chipsets)
    • Falcom (Modules)
    • Helicomm (Modules)
    • Jennic (Chipsets-Modules)
    • Freescale (Chipsets)
    • Luxoft Labs (Integration)
    • M&R Lawugger GmbH (Software)
    • Maxstream (WSN Modules)
    • Nanotron (Chipsets)
    • Oki (Chipsets)
    • Renesas (Platforms)
    • Silicon Laboratories (Chipsets, Modules)
    • Telegesis (Integrator)
    • Uniband (Chipsets)
    • ZMD (Chipsets)
• 3.3 UWB
  • 3.3.1 General
  • 3.3.2 Obstacles
  • 3.3.3 Benefits
  • 3.3.4 Definition
  • 3.3.5 Rates
  • 3.3.6 Spectrum Allocation
  • 3.3.7 Choices
  • 3.3.8 Major Features
  • 3.3.9 Standards and Regulations
    • 3.3.9.1 Multiband OFDM
    • 3.3.9.2 DS-UWB
    • 3.3.9.3 Groups
    • 3.3.9.4 ECMA
    • 3.3.9.5 WiNET
  • 3.3.10 Major Applications
  • 3.3.11 Market Estimate
    • 3.3.11.1 General
    • 3.3.11.2 Geographical Segmentation
    • 3.3.11.3 Forecast
  • 3.3.12 Industry
    • Aether (localization devices-ITS)
    • Alereon (chipsets)
    • Artimi (chipsets)
    • BBN (radio, first responders applications)
    • Camero (radar, equipment for first responders)
    • decaWave (chipsets)
    • Focus Enhancement (chipsets)
    • Freescale (chipsets, systems)
    • General Atomics (chipsets)
    • Multispectral (RFID and others)
    • Parco (RFID)
    • Pulse~ Link (chipsets)
    • RealTek
    • Staccato (chipsets)
    • TriQuint (chipsets - homeland security applications)
    • Time Domain (chipsets-fusion of communications & radar)
    • Tzero (chipsets)
    • Ubisense (RFID-tracking)
    • Wisair (chipsets)
    • WiQuest (chipsets)

4.0 Technology: Mesh Networks Specifics

• 4.1 Features
  • 4.1.1 Subclasses
    • 4.1.1.1 General
    • 4.1.1.2 Urban WMN
    • 4.1.1.3 Car-to-Car
    • 4.1.1.4 Modes
• 4.2 Benefits and Limitations
  • 4.2.1 Benefits
  • 4.2.2 ITS Specifics
  • 4.2.3 Limitations
• 4.3 Architectures
  • 4.3.1 Major Applications
• 4.4 Routing Protocols
  • 4.4.1 Too Many
    • 4.4.1.1. Lack of Standardization
    • 4.4.1.2 Applications Variety
  • 4.4.2 Protocols
• 4.5 Security Issues
  • 4.5.1 General
  • 4.5.2 802.11
  • 4.5.3 UWB
  • 4.5.4 ZigBee
• 4.6 Market: Mesh Networks
  • 4.6.1 Major Segments
    • 4.6.1.1 Advanced Segments
  • 4.6.2 Market Estimate
    • 4.6.2.1 Market Leaders
  • 4.6.3 Forecast
• 4.7 Major WMN Vendors and their Products
  • Active Control (Building and Extreme Environments)
  • ArrowSpan (Mesh in Transportation)
  • BelAir (Nodes)
  • Cisco (Protocols, Nodes)
  • Coronis Systems (WMN Nodes)
  • Crossbow (nodes)
  • Dust Networks (WMN Nodes)
  • Eka Systems (WMN Utilities)
  • Ember (ZigBee chips for WMN)
  • Intel (Nodes)
  • IWT(Network Solution)
  • IPMobileNet (WMN)
  • Iteris
  • FireTide (Mesh network-Public safety applications)
  • MeshDynamics (Nodes)
  • Millennial Net (SW and Systems)
  • Moteiv (Nodes and SW)
  • MeshNetworks (Motorola)
  • Mitre (protocols)
  • Motorola (Nodes-Public Safety Communications-ITS)
  • Newtrax (WSN-mesh, UGS)
  • NexGen City (Mesh-Public Safety)
  • Northrop Grumman (Nodes)
  • Nortel (WMN Systems)
  • NovaRoam (Public Safety Communications -WMN)
  • Now Wireless (Nodes, ITS)
  • Octave Technologies (WSN)
  • PacketHop (WMN SW)
  • Proxim (WMN Nodes)
  • Rajant (WMN-Military, First Responders)
  • Sensoria (WMN for Public Safety Communications)
  • Sensicast (WMN for Industrial Automation)
  • SIAE (WMN for IA)
  • SkyPilot Networks (WMN Nodes)
  • Strix (Nodes)
  • SysMaster
  • Qorvus (WMN for IA)
  • Telepath (Sensors Networks)
  • Tropos (Routers, OS)
  • Ubiwave (Mesh Network)

5.0 ITS-Intelligent Transport Systems

• 5.1 General
• 5.2 History: U.S.
• 5.3 ITS Architecture: U.S.
• 5.4 Technologies
• 5.5 ITS Applications
• 5.6 National Transportation Communications for ITS Protocol (NTCIP)
• 5.7 WMN and ITS
  • 5.7.1 General
  • 5.7.2 Benefits
  • 5.7.3 WMN ITS Applications

6.0 Conclusions

• Figure 1: Wireless Communications: ITS Environment
• Figure 2: Mesh Network Diagram
• Figure 3: WiMesh Stack
• Figure 4: Basic two-antenna MIMO system with two-stream SDM Example
• Figure 5: 802.11 Protocol Family MAC Frame Structure
• Figure 6: 802.11n IC Market Estimate ($M)
• Figure 7: Market Estimate: 802.11n Equipment Shipping ($B)
• Figure 8: ZigBee Protocol Stack
• Figure 9: Estimate: ZigBee Chipsets Market Worlwide ($M)
• Figure 10: ZigBee Market Segmentation (2006)
• Figure 11: ZigBee Market Segmentation (2010)
• Figure 12: UWB Spectrum
• Figure 13: Market Estimate: UWB Circuitry ($B)
• Figure 14: Market Estimate: Multiband OFDM UWB Circuitry ($B)
• Figure 15: Market Estimate: DS UWB Circuitry ($B)
• Figure 16: Estimate of UWB Market - Communications Applications ($B)
• Figure 17: Mesh Network Equipment Sale: Market Estimate ($B)
• Figure 18: Mesh Network Radio Technologies
• Figure 19: Technology Segmentation: Mesh Network Market
• Figure 20: Mesh Network Market Geography (2006)
• Figure 21: Wireless Communications: ITS Environment
• Figure 22 ITS Architecture
• Figure 23: NTCIP Structure

• Table 1: 802.11 Family
• Table 2: 802.11 Family-Rates
• Table 3: Parameters
• Table 4: Comparison: DS-UWB and MB-OFDM