Wireless Personal Area Networks: Applications, Assessment Technologies and Markets, Issue II

Table of Contents

1.0 Introduction

• 1.1Beginning
• 1.2 Networking
• 1.3 Definition
• 1.4 4G and WPAN
• 1.5 Scope
• 1.6 Research Methodology
• 1.7 Target Audience

2.0 WPAN and Radio Technologies

• 2.1 Ultra Wide Band
  • 2.1.1 General: History
  • 2.1.2 Obstacles
  • 2.1.3 Benefits
  • 2.1.4 Definition
  • 2.1.5 Rates
  • 2.1.6 Spectrum Allocation
  • 2.1.7 Choices
  • 2.1.8 Major Features
  • 2.1.9 Standards and Regulations
    • 2.1.9.1 Multiband OFDM
    • 2.1.9.2 DS-UWB
    • 2.1.9.3 Groups
    • 2.1.9.4 ECMA
    • 2.1.9.5 WiNET
    • 2.1.9.6 EC
  • 2.1.10 Major Applications
  • 2.1.11 Market Estimate
    • 2.1.11.1 General
    • 2.1.11.2 Geographical Segmentation
    • 2.1.11.3 Forecast
  • 2.1.12 UWB and WLAN
  • 2.1.13 Comments
  • 2.1.14 Industry
    • Aether (localization devices-ITS)
    • Alereon (chipsets)
    • Artimi (chipsets)
    • BBN (radio, first responders applications)
    • Camero (radar, equipment for first responders)
    • decaWave (chipsets)
    • Focus Enhancement (chipsets)
    • Freescale (chipsets, systems)
    • General Atomics (chipsets)
    • Multispectral (RFID and others)
    • Parco (RFID)
    • Pulse~ Link (chipsets)
    • RealTek (IC)
    • Staccato (chipsets)
    • TriQuint (chipsets - homeland security applications)
    • Time Domain (chipsets-fusion of communications & radar)
    • Tzero (chipsets)
    • Ubisense (RFID-tracking)
    • Wisair (chipsets)
• 2.2 ZigBee
  • 2.2.1 General
  • 2.2.2 Device Types
  • 2.2.3 Protocol Stack
    • 2.2.3.1 Physical and MAC Layers - IEEE802.15.4
      • 2.2.3.1.1 Frame
  • 2.2.4 Upper Layers
  • 2.2.5 Interoperability
  • 2.2.6 Security
  • 2.2.7 Platform Considerations
    • 2.2.7.1 Battery Life
  • 2.2.8 Technology Benefits and Limitations
  • 2.2.9 Standardization Process
    • 2.2.9.1 ZigBee Alliance
      • 2.2.9.1.1 Objectives
    • 2.2.9.2 802.15.4- ZigBee Basis
    • 2.2.9.3 IEEE 802.15.4 Radio
    • 2.2.9.4 Application Specifics
  • 2.2.10 ZigBee Role
  • 2.2.11 Market
    • 2.2.11.1 Expectations
    • 2.2.11.2 Segments
    • 2.2.11.3 Forecast
  • 2.2.12 Industry
    • AeroComm (acquired by Laird Technologies)
    • Airbee (Software)
    • Amber (RF Systems)
    • Alektrona (Gateways)
    • Atmel (Chipsets)
    • Chipcon - TI (Chipsets)
    • Cirronet-RFM (Modules Industrial Automation)
    • Duolog (Transceivers)
    • Eazix (Modules)
    • Ember (Chipsets)
    • Falcom (Modules)
    • Helicomm (Modules)
    • Jennic (Chipsets-Modules)
    • Freescale (Chipsets)
    • Luxoft Labs (Integration-MeshNetics)
    • M&R Lawugger GmbH (Software)
    • Maxstream (WSN Modules)-Digi
    • Nanotron (Chipsets)
    • Oki (Chipsets)
    • RadioPulse (Chips)
    • Renesas (Platforms)
    • Silicon Laboratories (Chipsets, Modules)
    • Telegesis (Integrator)
    • Trilliant (Gateway)
    • ZMD (Chipsets)
• 2.3 IEEE 802.15.1 (Bluetooth)
  • 2.3.1 General
  • 2.3.2 Transport layer
    • 2.3.2.1 Radio Layer
  • 2.3.3 Baseband and Link Layers
  • 2.3.4 Middleware Layer
  • 2.3.5 Bluetooth Security
  • 2.3.6 Highlights
  • 2.3.7 Market
• 2.4 Near Field Communications (NFC)
  • 2.4.1 General
  • 2.4.2 Characteristics
  • 2.4.3 Standards
    • 2.4.3.1 General
    • 2.4.3.2 ECMA (Near Field Communication Interface and Protocol: NFCIP-1)
    • 2.4.3.3 ISO
    • 2.4.3.4 NFC Forum
      • 2.4.3.4.1 General
      • 2.4.3.4.2 Specifications
  • 2.4.4 Applications
    • 2.4.4.1 General
    • 2.4.4.2 Primary Users
    • 2.4.4.3 Mobile Phone - Major Application
      • 2.4.4.3.1 Example
      • 2.4.4.3.2 Danger
  • 2.4.5 WPAN Applications
  • 2.4.6 Payment and Ticketing
  • 2.4.7 NFC Market
    • 2.4.7.1 Market Drivers
    • 2.4.7.2 Estimate
  • 2.4.8 Vendors
    • Alvin
    • Arygon
    • Infineon
    • Innovision
    • Inside Contactless
    • Legic
    • Mocapay
    • Motorola
    • Nokia
    • Nexperts
    • NXP
    • OTI
    • Reslink
    • Sagem Orga
    • Sony
    • STmicroelectronics
    • StolPan
    • Toppan Forms
    • Twinlinx
    • UPM Raflatac
    • Venyon
    • VivoTech
    • Wireless Dynamics

3.0 Standardization Process for WPAN

• 3.1 IEEE 802.15 WPAN Task Group 3 (TG3)
• 3.2 IEEE 802.15.4
  • 3.2.1 Requirements
  • 3.2.2 Properties
  • 3.2.3 IEEE 802.15.4 in Wireless Family
  • 3.2.4 Relationship between IEEE 802.15.4 and ZigBee
  • 3.2.5 Approaches
    • 3.2.5.1 UWB and Bluetooth
• 3.3 ECMA - 368
• 3.4 IEEE 802.15 WPAN Millimeter Wave Alternative PHY Task Group 3c (TG3c)
• 3.5 IEEE 802.15 WPAN Low Rate Alternative PHY Task Group 4a (TG4a)
• 3.6 IEEE 802.15 WPAN Task Group 4b (TG4b)
• 3.7 IEEE 802.15 WPAN Task Group 5 (TG5)
• 3.8 The Impact of Standards

4.0 WPAN Specifics: Summary

• 4.1 Definition
• 4.2 Types
  • 4.2.1 Bands and Geography
• 4.3 WPAN and WLAN
• 4.4 Networking
• 4.5 Details
• 4.6 ZigBee and Bluetooth: Comparison

5.0 WPAN Applications

• 5.1 Retailers
• 5.2 Route Delivery
• 5.3 Industrial/Commercial Applications
• 5.4 Ad Hoc Networking
  • 5.4.1 Sharing Data in Meetings
• 5.5 Body-Centric Communication
  • 5.5.1 Intra-Body Communications
• 5.6 Public Safety Communications (PSC)
• 5.7 Space
• 5.8 Healthcare
• 5.9 Military

6.0 Market: WPAN

• 6.1 Driving Forces
• 6.2 Market Estimate

7.0 Industry

• Airbee (Software)
• Dynastream Innovations Inc. (Acquired by Garmin in 2006)
• iDent (Skinplex)
• Nokia (Wibree)
• NTT (redtacton)
• POC (WPAN)

8.0 Conclusions

FIGURES:

• Figure 1: WPAN Place
• Figure 2: UWB Spectrum
• Figure 3: DS-UWB Spectrum Characteristics
• Figure 4: Spectrum Regulations-UWB
• Figure 5: Market Estimate: UWB Circuitry ($B)
• Figure 6: Market Estimate: UWB IC Shipments (Unit M)
• Figure 7: Estimate of UWB Market - Communications Applications ($B)
• Figure 8: ZigBee Protocol Stack
• Figure 9: Estimate: ZigBee Chipsets Market Worlwide ($M)
• Figure 10: Estimate: ZigBee Chipsets Market Worlwide (Million Units)
• Figure 11: ZigBee Market Segmentation (2006)
• Figure 12: ZigBee Market Segmentation (2013)
• Figure 13: Bluetooth Protocol Stack
• Figure 14: Piconets Illustration
• Figure 15: Global Bluetooth Revenue Market Forecast ($B)
• Figure 16: Standardization
• Figure 17: NFC ECMA and ISO Standards
• Figure 18: ISO Protocols
• Figure 19: NFC Forum Activities
• Figure 20: Mobile Phone with NFC
• Figure 21: Cell Phones Addressable Market (Millions Units)
• Figure 22: Cell Phones and Accessories-Addressable market ($B)
• Figure 23: NFC-able Cell Phones: Addressable Market (Units Million)
• Figure 24: NFC-able Cell Phones: Addressable Market ($M)
• Figure 25: NFC-able Cell Phone Rate of Penetration
• Figure 26: NFC Electronics Market Estimate ($M)
• Figure 27: NFC Market Geography
• Figure 28: WPAN Market Estimate ($B)
• Figure 29: WPAN Market- Radio Technology Sectors (2009-2013)
• Figure 30: WPAN Market- Geographical Segmentation (2009-2013)
• Figure 31: WPAN Market - Major Applications Segmentation

TABLES:

• Table 1: Comparison: DS-UWB and MB-OFDM
• Table 2: Parameters
• Table 3: NFC Features
• Table 4: NFC History
• Table 5: Current IEEE 802.15 Working Group Activities
• Table 6: Comparison
• Table 7: IEEE802.15.4 Standard Properties
• Table 8: IEEE 802.15.4 and Competition
• Table 9: IEEE 802.15.4 and ZigBee
• Table 10: Sample: WPAN Family of Standards
• Table 11: Regulations for Unlicensed Operation in the 2.45GHz Band
• Table 12: Regulations for Unlicensed Operations in the 5 GHz Band