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Market Research Report

Wireless Universal Serial Bus Radio Technologies and Markets

Published by Practel, Inc. Contact us : +1-860-674-8796
Published 2009/04 Content info  
Product code PRA86423
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Description TOC

Table of Contents

1.0 Introduction

  • 1.1 General
  • 1.2 Acceptance
  • 1.3 Structure and Goal
  • 1.4 Research Methodology
  • 1.5 Target Audience

2.0 Universal Serial Bus

  • 2.1 General
  • 2.2 Major Features
  • 2.3 Market Estimate

3.0 Evolution to Wireless

  • 3.1 General
  • 3.2 Major Features
  • 3.3 Protocol
  • 3.4 Issues
  • 3.5 Bluetooth v3 and WUSB
  • 3.6 Market
    • 3.6.1 General
    • 3.6.2 Market Estimate
  • 3.7 Vendors
    • Belkin (BT, Cable-free and 802.11n)
    • D-Link (CW-UWB)
    • Dell (WUSB)
    • IOgear-Realtek Semiconductor (CWUSB, WUSB)
    • Icron (802.11g WUSB)
    • Freescale WUSB
    • Magic Control Technology (CWUSB)
    • NEC Electronics (CWUWB)
    • NXP (CWUSB)
    • Olidata (CWUSB)
    • Realtec-Fujitsu (CWUSB)
    • Samsung Techwin/Samsung (CWUSB)
    • Skycom (CWUSB)
    • Synopsys (CWUSB)
    • Wisair-Cables Unlimited (CWUSB)

4.0 UWB: Technology and Market Specifics

  • 4.1 History
    • 4.1.1 Obstacles
  • 4.2 Definition
    • 4.2.1 Rates
  • 4.3 Spectrum Allocation
    • 4.3.1 Choices
  • 4.4 Major Features
    • 4.4.1 Communications Features
  • 4.5 Standards and Regulations
    • 4.5.1 Multiband OFDM
    • 4.5.2 DS-UWB
    • 4.5.3 Comparison
    • 4.5.4 IEEE
    • 4.5.5 FCC and ETSI
    • 4.5.6 ECMA International
    • 4.5.7 European Regulators
    • 4.5.8 Worldwide
    • 4.5.9 Comparison
      • 4.5.9.1 Impulse Radio- Pulse Link, Time Domain
      • 4.5.9.2 DS-CDMA - Motorola/Freescale and other
      • 4.5.9.3 Multi-Band OFDM (FH) - MBOA
  • 4.6 Applications
    • 4.6.1 General
    • 4.6.2 Home Security-UGS
    • 4.6.3 Phones
    • 4.6.4 RFID
    • 4.6.5 Communications and Imaging
    • 4.6.6 WPAN
    • 4.6.7 Imaging systems
    • 4.6.8 Vehicular Radar Systems
    • 4.6.9 Ranging
    • 4.6.10 Public Safety
  • 4.7 Applications Summary
  • 4.8 Issues
  • 4.9 UWB Market
    • 4.9.1 General
      • 4.9.1.1 Major Segments
    • 4.10.2 Forecast
      • 4.10.2.1 Conditions
      • 4.10.2.2 Drivers
      • 4.10.2.3 Analysis
    • 4.10.3 Comments
  • 4.11 Industry: UWB
    • Aether Wire & Location (localization sensors)
    • AirGate (sensors)
    • Alereon (chipsets, WUSB)
    • Artimi (merged with Staccato - November 2008; WUSB)
    • BBN (UWB radio, first responders)
    • Camero (radar, equipment for first responders)
    • Faraday Technologies (Chipsets, WUSB)
    • Focus Enhancement (WUSB, chipsets; in 2009, filed for bankruptcy)
    • Fujitsu Components (antennas, filters)
    • Gemtek(CWUSB)
    • General Atomics (chipsets, WUSB)
    • Intel (ICs)
    • Multispectral (RFID and others; acquired by Zebra Technologies in 2008)
    • Parco (RFID-Health Care)
    • Pulse~ Link (chipsets)
    • Sigma Designs (chipsets)
    • Staccato (chipsets, WUSB)
    • Stonestreet One (SW, WUSB)
    • Time Domain (chipsets-fusion of communications & radar)
    • Toshiba (Wireless USB)
    • Tzero (chipsets; shut the doors in 2009)
    • Ubisense (RFID-tracking)
    • Wisair (chipsets, WUSB)
    • WiQuest (chipsets, WUSB)-Closed Doors in 2008

5.0 IEEE 802.15.1 (Bluetooth-BT)

  • 5.1 BT Protocol Stack
    • 5.1.1 Transport layer
      • 5.1.1.1 Radio Layer
      • 5.1.1.2 Baseband and Link Manager Layers
      • 5.1.1.3 Middleware Layer
  • 5.2 Profiles
    • 5.2.1 Power Consumption-ULP
  • 5.3 Bluetooth Security
  • 5.4 Highlights
    • 5.4.1 The Standard:
    • 5.4.2 The Technology:
    • 5.4.3 Evolution
  • 5.5 Market Estimate

6.0 IEEE 802.11n

  • 6.1 WLAN Standardization
    • 6.1.1 History- Phased Approach
  • 6.2 802.11n Status
  • 6.3 Enhanced Wireless Consortium (EWC)
  • 6.4 Standard Evolution
    • 6.4.1 Draft v. 1.0
    • 6.4.2 Draft v. 2.0
    • 6.4.3 Draft v.3.0-v. 4.0 and Other
  • 6.5 WiFi Alliance
  • 6.6 802.11n Technology
    • 6.6.1 Advanced Technologies: MIMO and Others
      • 6.6.1.1 General
      • 6.6.1.2 MIMO
      • 6.6.1.3 Directions
        • 6.6.1.3.1 “True MIMO”
        • 6.6.1.3.2 BeamFlex
        • 6.6.1.3.3 Atheros
    • 6.6.2 Spatial Multiplexing
    • 6.6.3 OFDM
    • 6.6.4 Channel Bonding
    • 6.6.5 Packet Aggregation
  • 6.7 Major Features
    • 6.7.1 Specifics
    • 6.7.2 Channel Bandwidth
    • 6.7.3 Security
    • 6.7.4 Adaptation
  • 6.8 Benefits and Applications
    • 6.8.1 Benefits
    • 6.8.2 Applications
  • 6.9 Market
    • 6.9.1 General: Drivers
    • 6.9.2 Market Forecast
      • 6.9.2.1 Model Assumptions
      • 6.9.2.2 Forecast
        • 6.9.2.2.1 Chipsets
        • 6.9.2.2.2 Equipment
  • 6.10 Industry
    • Aerohive (APs)
    • Aruba (AP)
    • Asus (Router)
    • Atheros (Chipsets, WUSB)
    • Buffalo (Router, AP)
    • Belkin (Routers, Adaptors, WUBS)
    • Broadcom (Chipsets, WUSB)
    • Cisco (AP)
    • Colubris (AP)
    • D-Link (Routers, WUSB)
    • Encore (WUSB Adapter)
    • Edimax (Router, WUSB Adapter)
    • Extreme (AP)
    • Extricom (AP)
    • Gemtek (Router)
    • Intel (Chipsets)
    • Linksys (Routers, WUSB)
    • Marvell (Chipsets)
    • Meru (Family of Products)
    • Metalink (Chipsets)
    • Motorola (Tools, AP)
    • NEC (Router)
    • Netgear (Router, AP)
    • RedPine (Chipsets)
    • Ruckus (AP)
    • Ralink (Chipsets)
    • Qualcomm (Chipsets)
    • Siemens (AP)
    • SiGe (Chipsets)
    • TopCom (Router)
    • Trapeze (SW, platforms)
    • TrendNet (Routers, AP, WUSB)
    • ZyXel (AP, Router, WUSB)

7.0 Conclusions

FIGURES:

  • Figure 1: Addressable Market - USB Products Shipments (Bil. Units)
  • Figure 2: Addressable Market: USB Products sale (US$B)
  • Figure 3: WUSB Connectivity
  • Figure 4: Addressable Market: WUSB Products Sales ($M)
  • Figure 5: Addressable Market: WUSB Products Sales (Mil. Units)
  • Figure 6: UWB Spectrum
  • Figure 7: OFDM Frequency Segments
  • Figure 8: DS-UWB Spectrum Characteristics
  • Figure 9: Spectrum Regulations-UWB
  • Figure 10: ETSI Documents (Examples)
  • Figure 11: Spectrum Illustration
  • Figure 12: Europe
  • Figure 13: Japan and Korea
  • Figure 14: Canada
  • Figure 15: Market Estimate: UWB Circuitry ($B)
  • Figure 16: Market Estimate: UWB IC Shipments (Unit M)
  • Figure 17: Estimate of UWB Market - Communications Applications ($B)
  • Figure 18: UWB IC-WSN-UGS Market Segment ($M)
  • Figure 19: Bluetooth Protocol Stack
  • Figure 20: Piconets Illustration
  • Figure 21: Estimate - BT Market (Modules Shipped in Million)
  • Figure 22: BT Market Estimate - Modules Sales ($US M)
  • Figure 23: BT Market Geographical Segmentation
  • Figure 24: Basic two-antenna MIMO system with two-stream SDM example
  • Figure 25: 802.11 Protocol Family MAC Frame Structure
  • Figure 26: Addressable Market: Worldwide WiFi Chipsets Shipping (Unit M)
  • Figure 27: Addressable Market: 802.11n Chipsets Worldwide Shipping (Unit M)
  • Figure 28: Addressable Market: WiFi Chipsets Worldwide Shipping ($B)
  • Figure 29: Addressable Market: 802.11n Chipsets Worldwide Shipping ($B)
  • Figure 30: Market Geography: 802.11 Chipsets Production
  • Figure 31: Market Estimate: 802.11n Equipment Shipping ($B)
  • Figure 32: Addressable Market: 802.11n Equipment Sales (Unit M)

TABLES:

  • Table 1: Comparison: DS-UWB and MB-OFDM
  • Table 2: FCC Emission Limits
  • Table 3: Comparison
  • Table 4: UWB Applications: Summary
  • Table 5: UWB Market Segments
  • Table 6: Bluetooth Profiles
  • Table 7: 802.11 Standards Characteristics
  • Table 8: Comparison of Different 802.11 Members Transfer Rates
  • Table 9: 802.11n Advantages
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