Table of Contents
1.0 Introduction
- 1.1 General
- 1.2 Scope
- 1.3 Research Methodology
- 1.4 Target Audience
2.0 ICT Features: Benefits and Limitations
- 2.1 General
- 2.2 IEEE Work
- 2.2.1 P2030
- 2.2.2 IEEE 802.3az
- 2.2.3 Wireless
- 2.3 Leveraging ICT Features
- 2.3.1 Considerations
- 2.3.2 Data
- 2.3.3 Design
- 2.4 ICT: Contributors
- 2.4.1 ICT Growth
- 2.4.2 Strategy
- 3.5 ICT Applications
- 3.6 ICT Impact
3.0 UWB: Technology and Market Specifics
- 3.1 General
- 3.2 Benefits and Obstacles
- 3.3 Definition
- 3.4 Spectrum Allocation
- 3.5 Major Features
- 3.6 Standards and Regulations
- 3.6.1 Multiband OFDM
- 3.6.2 DS-UWB
- 3.6.3 Comparison
- 3.6.4 Standards Bodies
- 3.6.5 FCC and ETSI
- 3.6.6 ECMA International
- 3.6.7 European Regulators
- 3.6.8 Comparison
- 3.6.8.1 Impulse Radio- Pulse Link, Time Domain
- 3.6.8.2 DS-CDMA - Motorola and other
- 3.6.8.3 Multi-Band OFDM (FH) - MBOA
- 3.7 Applications
- 3.7.1 General
- 3.7.2 Home Security-UGS
- 3.7.3 Voice Communications
- 3.7.4 RFID
- 3.7.5 Communications and Imaging
- 3.7.6 WPAN
- 3.7.7 Imaging systems
- 3.7.8 Ranging
- 3.7.9 Public Safety
- 3.8 WSN and UWB
- 3.8.1 General
- 3.8.2 UWB Role
- 3.8.2.1 UWB-structured WSN
- 3.8.2.2 Features
- 3.9 Issues
- 3.10 Applications Summary
- 3.10.1 Specifics of Power Consumption
- 3.11 UWB Market
- 3.11.1 General
- 3.11.2 Forecast
- 3.12 Industry
- Aether Wire & Location (localization sensors)
- Alereon (chipsets)
- Artimi (merge with Staccato - November 2008)
- BBN (radio, first responders)
- Belkin (UWB-USB)
- Camero (radar, equipment for first responders)
- Focus Enhancement (chipsets)-Filed for Bankruptcy in 2009
- Fujitsu Components (antenna, filter)
- General Atomics (chipsets)
- Intel (chipsets)
- Multispectral- was acquired by Zebra Technologies in 2008 (RFID and others)
- Parco (RFID-Health Care)
- Pulse~ Link (chipsets)
- Sigma Designs (Chipsets)
- Staccato (chipsets)
- Time Domain (chipsets-fusion of communications & radar)
- Tzero (chipsets)-Closed doors in 2009
- Ubisense (RFID-tracking)
- Wisair (chipsets)
4.0 ZigBee
- 4.1 General
- 4.2 Technology
- 4.2.1 Major Features
- 4.2.2 Device Types
- 4.2.3 Protocol Stack
- 4.2.3.1 Physical and MAC layers - IEEE802.15.4
- 4.2.3.2 Upper Layers
- 4.2.3.2.1 Interoperability
- 4.2.3.2.2 Security
- 4.2.4 Platform Considerations
- 4.2.5 ZigBee Technology Benefits and Limitations
- 4.3 Standardization Process
- 4.3.1 ZigBee Alliance
- 4.3.1.1 Objectives
- 4.3.1.2 Smart Energy Profile
- 4.3.1.3 ZigBee IP
- 4.3.2 802.15.4- ZigBee Basis
- 4.3.2.1 IEEE 802.15.4 Radio
- 4.3.2.2 Application Specifics - Profiles
- 4.4 Applications
- 4.4.1 General
- 4.4.2 Home
- 4.4.3 Manufacturing
- 4.4.4 WSN-UGS and ZigBee
- 4.4.5 “Green” ZigBee
- 4.5. Market
- 4.5.1 Expectations
- 4.5.2 Segments
- 4.5.3 Forecast
- 4.6 Industry
- Airbee (Software; Includes Medical Applications)
- Amber (RF Systems)
- Arch Rock (WSN)
- Atmel (Chipsets)
- CEL (modules)
- Chipcon - TI (Chipsets)
- Cirronet-RFM (Modules-Industrial Applications)
- Crossbow (WSN, Environment Monitoring, motes)
- Digi (Radio, Medical Application)
- Duolog (Transceivers)
- Ember (Chipsets)
- Falcom (Modules)
- GreenPeak (WSN)
- Helicomm (Modules)
- Jennic (Chipsets-Modules-Health Care)
- Freescale (Chipsets)
- Oki (Chipsets)
- Renesas (Platforms)
- Silicon Laboratories (Chipsets, Modules, Medical)
- Synapse (Module, Protocols)
- Telegesis (Integrator)
- TI (Chipsets)
5.0 IEEE 802.15.1 (Bluetooth-BT)
- 5.1 BT Protocol Stack
- 5.1.1 Transport layer
- 5.1.1.1 Radio Layer
- 5.1.1.2 Baseband and Link Manager Layers
- 5.1.1.2.1 Power Consumption
- 5.1.2 Middleware Layer
- 5.1.3 Bluetooth Security
- 5.1.4 Highlights
- 5.1.4.1 The Standard:
- 5.1.4.2 The Technology:
- 5.1.5 Evolution
- 5.1.6 Profiles
- 5.1.6.1 Power Consumption-ULP
- 5.1.7 Market Estimate
6.0 Non-traditional Power Sources - Friends of Environment
- 6.1 Methods
- 6.2 Batteries
- 6.3 New Technologies
- 6.3.1 Energy Sources
- 6.3.2 Industry
- Advanced Cerametrics
- Advanced Linear Devices
- AD Hoc Electronics
- AmbioSystems
- Ambient Micro
- Cymbet
- EnOcean
- GreenPeak
- GreyStone
- JDL
- Jennic
- Micropelt
- Nokia
- Perpetuum
- Perpetua
- Powercast
- Schneider Electric
- Sentilla
- TI
- Zarlink Semiconductor
7.0 Power Consumption Comparison
8.0 Conclusions
Appendix I: ZigBee Pro Major Features
Appendix II: Requirements-Ultra Low Power Consumption Radio
Appendix III: Wibree
FIGURES:
- Figure 1: Estimated Distribution of Global CO2 Emissions from ICTs
- Figure 2: UWB Spectrum
- Figure 3: OFDM Frequency Segments
- Figure 4: DS-UWB Spectrum Characteristics
- Figure 5: Spectrum Regulations-UWB
- Figure 6: Spectrum Illustration
- Figure 7: WSN-UGS and UBW
- Figure 8: Power Consumption
- Figure 9: Market Estimate: UWB Circuitry ($B)
- Figure 10: Market Estimate: UWB IC Shipments (Unit M)
- Figure 11: Estimate of UWB Market - Communications Applications ($B)
- Figure 12: UWB IC-WSN-UGS Market Segment ($M)
- Figure 13: ZigBee Protocol Stack
- Figure 14: Profiles
- Figure 15: Estimate: ZigBee Modules Market Worldwide ($M)
- Figure 16: Estimate: ZigBee Modules Market Worldwide (M Units)
- Figure 17: ZigBee Market Segmentation (2009)
- Figure 18: ZigBee Market Segmentation (2013)
- Figure 19: Bluetooth Protocol Stack
- Figure 20: Piconets Illustration
- Figure 21: Estimate - BT Market (Unit Shipped in Million)
- Figure 22: Estimate - BT Market ($B)
- Figure 23: BT Market Geographical Segmentation
- Figure 24: Normalized Energy Consumption (Tx)
- Figure 25: Normalized Energy Consumption (Rx)
TABLES:
- Table 1: Comparison: DS-UWB and MB-OFDM
- Table 2: FCC Emission Limits
- Table 3: Comparison
- Table 4: UWB Applications: Summary
- Table 5: UWB Market Segments
- Table 6: ZigBee Parameters
- Table 7: ZigBee Smart Energy Profile Feature Set
- Table 8: Bluetooth Profiles
- Table 9: Illustration-Bluetooth Profiles
- Table 10: Parameters
- Table 11: Sources
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