2008 China Semiconductor Wafer Fab and Foundry Outlook

Table of Contents

EXECUTIVE SUMMARY

1 INTRODUCTION

• 1.1 Methodology
• 1.2 Assumptions

2 CHINA SEMICONDUCTOR FAB CAPEX AND CAPACITY OUTLOOK

• 2.1 Overview
• 2.2 Fab Investment Structure and Trend
• 2.3 Capital Spending Outlook
• 2.4 Capacity Development and Trend
• 2.5 Trend of Capacity Transferring from Overseas to China

3 FAB PROCESS EQUIPMENT AND MATERIAL SUPPLY

• 3.1 Overview
• 3.2 Fab Equipment and Material Market Outlook
• 3.3 China Used Fab Process Equipment Market and Forecast
• 3.4 Local Sourcing of Fab Equipment and Materials

4 TECHNOLOGY TREND OF SEMICONDUCTOR FAB IN CHINA

• 4.1 Overview
• 4.2 Technology Roadmaps of Leading Fabs in China
• 4.3 R&D Spending Trends by the Leading Fabs in China

5 SUMMARY AND CONCLUSIONS

• 5.1 Summary
• 5.2 Conclusions
• 5.1 Acknowledgements

6 APPENDICES

• A List of Acronyms and Abbreviations
• B Excel Workbook
• C Milestone of China' s Semiconductor Wafer Manufacturing History
• D Profile of Top-Tier Established Semiconductor Manufacturers in China Equipment Market in China
• E Additional Information of Used Fab Equipment Market in China

List of Figures and Tables

List of Figures

• Figure 2.1 China IC Market Demand vs. Domestic IC Supply in 2000-2010
• Figure 2.2 China Fab/Foundry Sales in 2000-2010
• Figure 2.3 Investment to China' s Fab in 2000-2007
• Figure 2.4 Fab Investment Structure (2000-2006)
• Figure 2.5 Fab Capital Spending Breaking down (2001-2010)
• Figure 2.6 Fab Capacity by Fab Categories (K wpm in 200 mm wafer equivalent, 2001-2010)
• Figure 2.7 Capacity Share by the Top 10 Manufacturers (K wpm in 200 mm wafer equivalent)
• Figure 2.8 Capacity by Wafer Size (K wpm in 200 mm wafer equivalent)
• Figure 2.9 200 mm-300 mm Wafer Capacity Transferring to China (K wpm in 200 mm wafer equivalent)
• Figure 2.10 150 mm Wafer Capacity Transferring to China (K wpm)
• Figure 3.1 Worldwide Semiconductor Wafer Processing Equipment Market (US$ Billion)
• Figure 3.2 Worldwide Fab Material Outlook by Region ($ Billion)
• Figure 3.3 Wafer Processing Equipment Spending in China ($ Million)
• Figure 3.4 Estimated Silicon Wafer Sales in China
• Figure 3.5 Estimated Market Size of Used Wafer Processing Equipment in China (in US$ millions)
• Figure 3.6 Geographic Distributions of Local Fab Material Suppliers in China
• Figure 4.1 Process Technology Progress by Semiconductor Manufacturers in China
• Figure 4.2 Number of IC Related Patent applications in China (1985-2006)
• Figure 4.3 Fab Capacity by Feature Size in China (2001-2010)
• Figure 4.4 Fab Technology Roadmap in China (2006-2010)
• Figure 4.5 SMIC' s R&D Spending vs. Sales Revenue (2003-2007)
• Figure 4.6 Leading Local Fab' s R&D Spending vs. Sales Revenue (2003-2010)

List of Tables

• Table 1.1 Companies Interviewed
• Table 1.2 Semiconductor Manufacturers under Investigation
• Table 1.3 Currency Exchange Rates
• Table 2.1 Example of China' s Electronic Product Output in 2006
• Table 2.2 Green Startup Fab Projects in China
• Table 2.3 Estimated Total Capital Expenditures in China
• Table 2.4 Company Categorization by Wafer Size
• Table 2.5 Estimated Fab Capacity in China 11 (K wpm in 200 mm wafer equivalent)
• Table 3.1 New Equipment Billings Trends in China in 2006 and 2007
• Table 3.2 Fab Materials Market in China by Segment (in US$ millions)
• Table 3.3 2007 Market Breakdown and Trends for Used Equipment by End User Category
• Table 3.4 2007 Market Breakdown and Trends for Used Equipment by Wafer Size and Market Trend
• Table 3.5 Domestic Equipment Suppliers and Products
• Table 3.6 Major Local Semiconductor Wafer Manufacturers in China
• Table 4.1 2006 Top 25 Patent Granted by Country of Origin from US Patent and Trademark Office
• Table 4.2 SMIC Fourth Quarter Revenue Share by Technology, 2002-2006
• Table 4.3 Leading Fabs R&D Spending Trends (2003-2007)