Abstract
The SEMI World Fab Forecast provides high level summaries, charts, and graphs;
in-depth analyses of capital expenditure, capacity, technology and products,
down to the detail of each fab; and forecasts for the next 18 months.
The database includes over 1,000 records of front-end fabs and foundries
such as TSMC, UMC, Chartered Semiconductor, SMIC, Samsung, Intel, AMD,
Toshiba, Micron Hynix, Powerchip, Texas Instruments, Renesas, Inotera, Elpida,
STMicro, Fujitsu, NEC Electronics, ProMOS, Nanya, Matsushita, NXP, Winbond,
IBM Micro, Sharp, Freescale, Infineon, Spansion, Magna Chip, X-Fab, and more...
Benefits
These tools are invaluable for understanding the trends of the fabs, and
learning more about capex for construction projects, fab equipping, technology
level, and products.
With the World Fab Forecast report, you can conduct more efficient market
research, identify target customers, and analyze quarterly fab trends more
easily.
Highlights
- Of the 1075 facilities listed, 973 facilities are in operations while the
others are planned fabs (with various probabilities).
- Since our last publication (May ' 09 edition):
- We' ve made 369 changes on 272 facilities.
- We' ve added 45 facilities: more than half are LED facilities.
- We' ve noted that 16 facilities were closed or cancelled.
- Fab construction spending in 2010 is expected to increase by about 74% to
about US $2.8B (May ' 09 edition reported US$3.5B), with about 23 construction
projects.
- Fab spending on equipping fabs is expected to increase by about 63% to
about US $21.5B in 2010 with about 95 projects spending on equipment.
- Overall installed fab capacity for 2009 will decline by about 2.6%, to
about 15.3 million wafers per month, due to closure of some fabs. In 2010,
total capacity is expected to increase by about 4.4% to over 16.0 million
wafers per month.
- In 2009, seven facilities (including MEMS, LEDs and R&D) are expected to
begin (or have begun) construction with three in the Europe/Mideast region,
three in the Americas, and one in China.
- In 2010, 15 facilities are expected to begin operations [11 volume fabs
plus one Back-End-Of-Line (BEOL)]. - These consist of two memory fabs, four
foundries, and four discrete related fabs.
- Nineteen facilities closed in 2008. About 31 facilities are expected to
close in 2009 and about 16 facilities will close in 2010.
Methodology
World Fab Forecast is compiled from publicly available information, including
capital spending plans, announced fab plans and ream schedules. SEMI verifies
this information by making up to 50 inquiries a week and periodic visits to
semiconductor companies.
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