Abstract
This analysis covers the 2008 silicon wafer reclaim for the semiconductor
market and provides a forecast to 2011. Reclaim is defined as the removal of
several microns of the silicon wafer and subsequent re-polishing of the wafer
surface. A questionnaire, which summarizes all of the desired information, was
developed and sent to reclaim suppliers.
Seven regions of the world are covered in this report including North America,
Japan, Europe, Korea, Taiwan, China, and Rest of World (ROW). All market size
estimates reflect U.S. dollars at current exchange rates. Market estimates for
reclaim wafers include semiconductor applications including equipment and IC
manufacturing markets.
Methodology and Scope
Two methodologies were used in the development of this information. First,
major suppliers were interviewed and contacted for the purpose of this
analysis. A questionnaire, which summarizes all of the desired information,
was developed and sent to all of the suppliers. Of the companies contacted, 10
responded representing 58 percent of the market by revenue.
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