Emerging Trends in SOI Technology

Table of Contents

1 EXECUTIVE SUMMARY

• Scope and Research Methodology
  • Scope
  • Research Methodology
• Introduction and Key Findings
  • Introduction
  • Key Findings

2 PRIMERS ON SOI TECHNOLOGY AND ITS APPLICATIONS

• Introducing SOI Technology
  • Why Do We Need SOI?
  • Explaining SOI
  • Types of Thin Film SOI Wafers
  • Techniques Used for Fabricating Thin-Film SOI Wafers
• Applications
  • Existing Applications
  • Emerging Applications

3 RECENT DEVELOPMENTS

• Industry
  • Zero Capacitor RAM-Innovative Silicon
  • World' s Thinnest RFID Chip-Hitachi
  • SOI Technology Enhances In-Vehicle Networking Performance-Philips Semiconductor
  • ITFET and sSOI technologies on SOI Wafers-Freescale Semiconductor
  • Fastest SOI Bipolar Devices for High-Speed Analog (HSA) Applications-Zarlink
  • Capacitorless Twin-Transistor RAM-Renesas
  • Ultralow Off-State Leakage Transistor-Oki Electric
  • Thick SOI for MEMS Applications-Tronic Microsystems and ELA Medical
  • High-Speed ADC with Ultralow Noise-Analog Device
  • First SOI-Based ASIC Devices-Soisic
  • First Demonstration of Capacitorless DRAM-Toshiba
  • European Partnership to Develop High-Performance SOI IC-SilOnIS
  • Development of 300 mm sSOI Wafer-Soitec and ASM
  • 65 nm SOI Technology with Enhanced Transistor Strain-IBM + AMD + Sony + Toshiba
• Academia
  • Transition from Wire Formation to Island Formation on SOI Wafer-Shizuoka University (Japan)
  • Silicon-on-Diamond for Future Electronic Applications-North Carolina State University (US)
  • Silicon-Carbon Source/Drain Devices-National University of Singapore (Singapore)
  • Sensors and Actuators Based on SOI Materials-Chalmers University of Technology (Sweden)
  • Large Grain Polysilicon-On-Insulator with High Temperature Sensing Capability-Hong Kong University (Hong Kong)
  • InP on Insulator Substrate-Institute of Materials Research and Engineering (Singapore)

4 ADOPTION FACTORS AND FORECASTS

• Driving Factors
  • AMD' s Success
  • Improvement in Cost and Supply of SOI Wafers
  • Bottleneck in Scaling and Soft-Error Radiation Problem in Memory Devices
  • The Push for Strained Silicon
  • III-V Materials-on-Insulator Technology
  • SOI MEMS Applications and Nanodevices
• Constraints and Challenges of SOI
  • Floating Body Potential Effect
  • Effects on CMOS Process
  • High Cost and Supply of SOI Wafers
  • Design SOI IPs
• SOI' s Future
  • Supporting Novel Devices
  • Complementing Strain Technology
  • SOI MEMS

5 KEY CONTACTS AND SELECTED PATENTS

• Key Contacts
  • Corporates
  • Universities and Institutes
• Selected Patents
  • Patents I
  • Patents II

6 DECISION SUPPORT DATABASE

• Semiconductor Applications Statistics--World
  • Business PC Installed Base (1999-2006)
  • PC Installed Base (1999-2006)
  • Educational PC Installed Base (1999-2006)
  • Laptops Installed Base (1999-2006)
  • Portable PC Install Base (1999-2006)
  • Consumer Electronic Contribution to Electronics Industry (1999-2006)
  • Control and Instrumentation Contribution to Electronics Industry (1999-2006)
  • Electronic Components Contribution to Electronics Industry (1999-2006)
  • Medical and Industrial Contribution to Electronics Industry (1999-2006)
  • Office Equipment Contribution to Electronics Industry (1999-2006)
  • Radio Communication and RADAR Contribution to Electronics Industry (1999-2006)
  • Telecommunication Contribution to Electronics Industry (1999-2006)
• Semiconductor Industry Statistics
  • Global Semiconductor and Semiconductor Equipment Market (1999-2006)
  • Number of Semiconductor Plants-USA (1988-2001)