Table of Contents
1 EXECUTIVE SUMMARY
- Scope and Methodology
- Overview and Study Highlights
- Overview
- Study Highlights
2 TECHNOLOGY PRIMER
- Introduction to TCP
- What are TCPs?
- Significance of TCP Materials
- Different TCP Materials
- Polypropylene
- Acrylonitrile Butadiene Styrene
- Polycarbonate
- Nylon
- Liquid Crystalline Polymers
- Polyphenylene Sulfide
- Polyetheretherketone
3 CLASSIFICATION AND APPLICATIONS OF THERMALLY CONDUCTIVE POLYMER COMPOUNDS
- Thermally Conductive Polymer Compounds Variants
- Thermal Conductive Greases
- Thermal Conductive Adhesives
- Thermally Conductive Tapes
- Thermal Conductive Coatings
- Thermally Conductive Encapsulants
- Applications
- Electronics and Lighting Sectors
- Appliances
- Fibers and Fabrics
- Medical
- Food Contact Material and Processing
4 KEY INNOVATIONS/BREAKTHROUGHS
- Key Innovations/Breakthroughs in the North American Region
- Improved Dispersion of Aluminum Nitride Particles in Epoxy Resin by
Adsorption of Two-Layer Surfactants
- Advanced Thermal Interface Materials
- A New Line of Thermally Conductive Compounds for Thermal Management
Systems
- Effect of Single-Walled Carbon Nanotube Purity on the Performance of
Nanotube-Based Composites for Thermal Management
- Modification of Polymers to Provide Thermal Solutions in Heat Generating
Applications
- High-Thermal Conductivity in Organic Adhesives
- Liquid Crystalline Polymer for Preparation and Storage of Foodstuff
- Other Key Developments
- Key Innovations/Breakthroughs in the European Region
- Thermally Conductive Interface Materials-Achieving Optimal Thermal
Discharge
- Thermally Conductive Adhesives for Microelectronics--Barriers of Heat
Transport
- Temperature Dependent Thermal Conductivity of Carbon Nanotube/Epoxy
Composites
- Reduction of Energy Consumption by Using High-Performance Thermoplastics
in Light Emitting Devices
- Key Innovations/Breakthroughs in the Asia Pacific Region
- Novel Heat-Conductive Composite Silicone Rubber and its Properties
- Thermal Characterization of Thermally Conductive Underfill for a
Flip-Chip Package Using Novel Temperature Sensing Technique
- Thermally Conductive Silicone Rubber Sheet with Super-Low Hardness
5 TECHNOLOGY ADOPTION FACTOR ANALYSIS
- Technology Drivers
- Advanced Properties of Thermally Conductive Polymers
- Metal or Ceramic Filler Content Makes Polymers Better
- Easy Processibility of Custom-Made Products
- Heat Sink Technology and Packaging of Microprocessor Components
- Energy Losses
- Thermal Modeling and Prototyping
- Low-CTE Mismatch in IC Packages
- Industry Challenges
- Elevated Temperature--A Concern for Passive Component Manufacturers
- Silicone-Based Materials Technology
- Lack of New Materials
- Cost Considerations in Manufacturing Process
- Trends
- Current Trends
- Future Trends
- Application Trend Analysis
- Introduction
- Electronics Sector
- Automotive Sector
- Aerospace Sector
6 KEY PATENTS AND CONTACTS
7 DECISION SUPPORT DATABASE
- Critical Reference Tables
- Printed Circuit Board (PCB) Sales--World (2002 to 2012)
- Office Equipment Contribution to Electronic Industry (2002 to 2012)
- Semiconductor Market and Semiconductor Equipment Market (2002 to 2012)
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