Table of Contents
VOLUME 1: SLOT SINGLE BOARD COMPUTERS AND EMBEDDED CPU BLADES
I EXECUTIVE SUMMARY
- GENERAL
- Market Overview
- VME
- PCI
- ISA
- CompactPCI
- PCI-ISA
- ATCA
- AMC
- Vertical Markets
- CPU USE
- MULTI-CORE PROCESSOR USE
- OS VS. RTOS USE
- SELECTED RECOMMENDATIONS
- LEADING VENDORS
II SCOPE AND METHODOLOGY
- SCOPE
- Definitions of Terms
- Boards Excluded from the Study
- Blades
- Segmentation
- Other Report Content
- METHODOLOGY
- "Platinum" and "Gold"Vendor Ratings
III INDUSTRY STRUCTURE
- TRADE ASSOCIATINS
- Hyper Tanspoft™ Consortium
- lnfiniBand™ Trade Association(IBTA)
- PCI Industrial Computer Maufactuers Group(PICMG)®
- PCI Special lnterest Group (PCI SIG)®
- PXI Systems Alliance (PXISA)
- RapidlO® Trade Association
- VMEbus International Trade Association (VITA)®
- VXIbus Consortium
- SIGNIFICANT MERGER AND ACQUISITION ACTIVITIES IN SBC/BIADE
- SPACE
IV OVERVIEW
- GENERAL
- Blaes
- Bus and Blade Architectures
- MARKET OVERVIEW
- Comparisons with Historical Dates
- Geographic Distribution
- Sales/Distribution Channels
- Customer Classes
- Market Leaders
V VME
- TOTAL VME SBC/BLADE MARKET
- VERTICAL MARKETS
- GEOGRAPHIC DSTRIBUTION
- VME ARCHITECTURES
- SWITCH FABRIC USE
- BOARD SIZES
- DEGREES OF CUSTOMIZATION
- BOARD COOLING
- CPU INSTALLATION
- CPU TYPES
- MULTI-CORE PROCESSOR USE
- MULTIPLE DISCRETE PROCESSOR USE
- MEZZANINE SITES
- OPERATING SYSTEMS
- GENERAL COMMENTS
- INDUSTRY LEADERS
VI COMPACTPCI
- TOTALCOMPACTPCI SBC/BLADE MARKET
- VERTICAL MARKETSAL
- GEOGRAPHIC DSTRIBUTION
- COMPACTPCI ARCHITECTURES
- SWIT' CH FABRIC USE
- BOARD SIZES
- DEGREES OF CUSTOMIZATION
- BOARD COOLIG
- CPU INSTALLAON
- CPU TYPES
- MULTI-CORE PROCSSORE USE
- MULTIPLE DISCRETE PROCSSORE USE
- MEZZANINE SITES
- OPERATING SYSTEMS
- INDUSTRY LEADERS
VII PCI
- TOTAL PCI SBC/BLADE MARKET
- VERTICAL MARKETS
- GEOGRAPHIC DISTRIBUTION
- PCI ARCHITECTURES
- DEGREES OF CUSTOMIZATION
- CPU INSTALLATION
- CPU TYPES
- MULTI-CORE PROCESSOR USE
- MULTIPLE DISCRETE PROCESSOR USE
- OPERATING SYSTEMS
- INDUSTRY LEADERS
VIII ISA
- TOTAL ISA SBC MARKET
- VERTICAL MARKETS
- GEOGRAPHIC DISTRIBUTION
- DEGREES OF CUSTOMIZATION
- CPU INSTALLATION
- CPU TYPES
- MULTI-CORE PROCESSOR USE
- OPERATING SYSTEMS
- INDUSTRY LEADERS
IX PC-ISA
- TOTAL PCI-ISA SBC MARKET
- VERTICAL MARKETS
- GEOGRAPHIC DISTRIBUTION
- PII-ISA ARCHITECTURES
- DEGREES OF CUSTOMIZATION
- CPU INSTALLATION
- CPU TYPES
- MULTI-CORE PROCESSOR USE
- OPERATING SYSTEMS
- INDUSTRY LEADERS
X ATCA CPU BLADES
- TOTAL ATCA CPU BLADE MARKET
- VERTICAL MARKETS
- GEOGRAPHIC DISTRIBUTION
- SWITCH FABRIC USE
- DEGREEES OF CUSTOMIZATION
- CPU TYPES
- MULTI-CORE PROCESSOR USE
- MEZZANINE SITES
- OPERATING SYSTEMS
- INDUSTRY LEADERS
XI AMC CPU CARDS
- TOTAL AMC CPU CARD MARKET
- VERTICAL MARKETS
- GEOGRAPHIC DISTRIBUTION
- SWITCH FABRIC USE
- DEGREES OF CUSTOMIZATION
- CPU TYPES
- MULTI-CORE PROCESSOR USE
- MULTIPLE DISCRETE PROCESSOR USE
- OPERATING SYSTEMS
- INDUSTRY LEADERS
XII VERTICAL MARKETS
- OVERALL VERTICAL MARKET SEGMENTATION
- COMMUNICATIONS: EDGE
- COMMUNICATIONS: CORE
- INDUSTRIAL AUTOMATION AND CONTROL
- INSTRUMENTATION
- MEDICAL
- MILITARY/AEROSPACE
- TRANSPORTATION
- ENTERPRISE
XIII USER DATA
- SURVEY RESPONDENT DEMOGRAPHICS
- EVALUATION CRITERIA
- SLOT SBC/CPU BLADE ARCHITECTURES
- REASON FOR SELECTING SLOT SBCS/CPU BLADES
- EXPECTED CHANGES IN PURCHASES
- PROCESSORS USED
- SEGMENTATION BY ARCHITECTURE
- VME, VXS VPX
- CompactPCI
- PCI
- PCI-ISA
- ISA
- ATCA
- VERTICAL MARKETS
- Automotive
- Communications: Core
- Communications: Edge
- Industrial Automation
- Instrumentation
- Medical
- Military/Aerospace
- Transportation
XIV OBSERVATION AND RECOMMENDATIONS
- GENERAL
- VME SBCS AND BLADES
- Specific Recommendations
- COMPACT PCI SBCS AND BLADES
- Specific Recommendations
- EDGE-CONNECTED SBCS (PCI, ISA, PCI-ISA)
- PCI SBCS
- Specific Recommendations
- ISA SBCS
- Specific Recommendations
- PCI-ISA
- Specific Recommendations
- ATCA CPU BLADES
- Specific Recommendations
- AMC CPU Cards
- Specific Recommendations
XV VENDOR PROFILES
- ADLINK TECHNOLOGY, INC
- ADVANTECH
- AITECH
- CONCURRENT TECHNOLOGIES
- CONTINUOUS COMPUTING
- CURTISS WRIGHT CONTROLS EMBEDDED COMPUTING
- DIVERSIFIED TECHNOLOGY, INC
- EMERSON NETWORK POWER EMBEDDED COMPUTING
- GE FANUC INTELLIGENT PLATFORMS
- GENERAL MICRO SYSTEMS
- KONTRON AG
- MEN MIKRO
- MERCURY COMPUTER SYSTEMS, INC.
- PERFORMANCE TECHNOLOGIES, INC.
- RADISYS CORPORATION
- SUN MICROSYSTEMS, INC.
- THALES COMPUTERS
VOLUME 2: EMBEDDED MOTHERBOARDS
I EXECUTIVE SUMMARY
- MARKET OVERVIEW
- FORM FACTOR CLASSES
- VERTICAL MARKETS
- CPU USE
- MULTI-CORE PROCESSOR USE
- OS vs.RTOS USE
- SELECTED RECOMMENDATIONS
- LEADING MOTHERBOARD VENDORS
II SCOPE AND METHODOLOGY
- SCOPE
- Definitions of Terms
- Boards Excluded from the Study
- Segmentation
- Other Report Content
- METHODOLOGY
- "Platinum" and "Gold" Vendor Ratings
III INDUSTRY STRUCTURE
- INDUSTRY PARTICIPANTS
- TRADE ASSOCIATIONS
- The PC/104 Consortium: EBX and EPIC
- Small Form Factor Special Interest Group (SFF-SIG): Pico-ITX
- SIGNIFICANT MERGERS AND ACQUISITONS IN EMBEDDED MOTHERBOARD MARKET
IV INDUSTRY OVERVIEW
- FORM FACTOR CLASSES
- VERTICAL MARKETS
- GEOGRAPHIC DISTRIBUTION
- SALES AND DISTRIBUTION CHANNELS
- CONSUMING CUSTORMER CLASSES
- LEADING MOTHERBOARD VENDORS
V "DESKTOP FORM FACTOR" MOTHERBOARDS
- GENERAL OVERVIEW
- Form Factors
- Brief Technical Descriptions
- MARKET OVERVIEW
- Overall Market
- Form Factors
- Vertical Markets
- Degrees of Customization
- Processors
- Expansion Slot Architectures
- Operating Systems
- Integrated Features
- Leading Vendors
VI "DESKTOP FORM FACTOR" MOTHERBOARDS -VERTICAL MARKETS
- OVERALL VERTICAL MARKET SEGMENTATION
- COMMUNICATIONS: EDGE
- COMMUNICATIONS: CORE
- INDUSTRIAL AUTOMATION AND CONTROL
- INSTRUMENTATION
- MEDICAL
- MILITARY/AEROSPACE/DEFENSE
- TRANSPORTATION
VII "EMBEDDED FORM FACTOR" MOTHERBOARDS
- GENERAL OVERVIEW
- Form Factors
- Brief Technical Descriptions
- MARKET OVERVIEW
- Overall Market
- Form Factors
- Vertical Markets
- Degrees of Customization
- Processors
- Expansion Architectures
- Operating Systems
- Integrated Features
- Leading Vendors
VIII "EMBEDDED FORM FACTOR" MOTHERBOARDS -VERTICAL MARKETS
- OVERALL VERTICAL MARKET SEGMENTATION
- COMMUNICATIONS: EDGE
- COMMUNICATIONS: CORE
- INDUSTRIAL AUTOMATION AND CONTROL
- INSTRUMENTATION
- MEDICAL
- MILITARY/AEROSPACE/DEFENSE
- TRANSPORTATION
IX DEMAND SIDE DATA
- SURVEY RESPONDENT DEMOGRAPHICS: ALL MOTHERBOARDS
- NON-TECHNICAL VENDOR SELSECTION CRITERIA: ALL MOTHERBOARDS
- MOTHERBOARD FORM FACTORS
- REASON FORM SELECTING MOTHER BOARDS
- EXPECTED CHANGES IN MOTHERBOARD PURCHASES
- PROCESSORS USED ON MOTHERBOARDS
- SURVEY RESPONDENT DEMOGRAPHICS: DESKTOP FORM FACTOR MOTHERBOARDS
- NON-TECHNICAL VENDOR SELECTION CRITERIA: DESKTOP FORM FACTOR MOTHERBOARDS
- REASON FOR SELECTING DESKTIOP FORM FACTOR MOTHERBOARDS
- EXPECTED CHANGES IN DESKTOP FORM FACTOR MOTHERBOARD PURCHASES
- PROCESSORS USED ON DESKTOP FORM FACTOR MOTHERBOARDS
- SURVEY RESPONDENT DEMOGRAPHICS: EMBEDDED FORM FACTOR MOTHERBOARDS
- NON-TECNICAL VENDOR SELECTION CRITERIA: EMBEDDED FORM FACTOR MOTHERBOARDS
- REASON FOR SELECTIN EMBEDDED FORM FACTOR MOTHERBOARDS
- EXPECTED CHAGES IN EMBEDDED FODRM FACTOR MOTHERBOARD PURCHASES
- PROCESSORS USED ON EMBEDDED FORM FACTOR MOTHERBOARDS
- PROCESSORS USED ON "OTHER" FORM FACTOR MOTHERBOARDS
X OVSERVATIONS AND RECOMMENDATIONS
- MARKET POTENTIAL
- THE OVERALL EMBEDDED MOTHERBOARD MARKET - OBSERVATIONS
- FORM FACTORS
- Desktop Class Form Factors
- Embedded Class Form Factors
- CUSTOMIZATION
- MICROPROCESSORS
- OPERATING SYSTEMS
- EXPANSION CAPABILITY
- Desktop Class Form Factors
- Embedded Form Factors
- INTEGRATED FEATURES
- VERTICAL MARKETS
- SPECIFIC RECOMMENDATIONS
- Overall Embedded Motherboards
- Desktop Class Motherboard Vendors
- Embedded Class Motherboard Vendors
XI VENDOR PROFILES
- AAEON TECHNOLOGY, INC.
- ADLINK TECHNOLOGY, INC.
- ADVANTECH
- AMPROCOMPUTERS, INC.
- ANOVO CO., LTD.
- AVALUE TECHNOLOGY INC.
- AXIOMTEK CO., LTD.
- DFI, INC.
- EUROTECH S.P.A
- IBASE TECHNOLOGY, INC.
- IEI TECHNOLOGY CORPORATION
- KONTRON AG
- PORTWELL, INC.
- PADISYS CORPORATION
- SUN MICROSYSTEMS, INC.
- SUPER MICRO COMPUTER, INC.
- TYAN COMPUTER
- VIA TECHNOLOGIES, INC.
VOLUME 3: MEZZANINE CARDS AND COMS
I EXECUTIVE SUMMARY
- GENERAL OVERVIEW
- Segmentation by Product Class
- VERTICAL MARKETS
- SELECTED RECOMMENDATIONS
- LEADING VENDORS
II SCOPE & METHODOLOGY
- SCOPE
- DEFINITIONS OF TERMS
- BOARDS EXCLUDED FROM THE STUDY
- SEGMENTATION
- OTHER REPORT CONTENT
- METHODOLOGY
- "PLATINUM" AND "GOLD" VENDOR RATINGS
III INDUSTRY STRUCTURE
- INDUSTRY PARTICIPANTS
- TRADE ORGANIZATIONS
- ETX Industrial Group
- Mezzanines International, fka Group IPC
- PICMG
- VITA (VMEbus International Trade Association)
- XTX Consortium
- MERGERS AND ACQUISITIONS
IV INDUSTRY OVERVIEW
- CURRENT AND PROJECTED SHIPMENTS
- Segmentation by Product Class
- GEOGRAPHIC DISTRIBUTION, COMBINED PRODUCT CLASSES
- SALES AND DISTRIBUTION CHANNELS
- VERTICAL MARKETS
- LEADING VENDORS
V MEZZANNE CARDS AND CARRIERS
- DEFINITIONS
- "True" Mezzanine Cards vs. "Quasi" Mezzanine Cards
- TECHNICAL OVERVIEW
- Industry Pack (IP)
- PMC
- XMC
- AMC (Advanced Mezzanine Card)
- Micro TCA
- STUDY FINDINGS: GENERAL
- Over Market
- Market Growth and Segmentation by Mezzanine Architecture
- Geographic Distribution of Shipments
- Vertical Markets
- Degree of Customization
- Processor vs. Non-Processor Types
- PROCESSOR MEZZANINE CARDS
- Segmentation by Mezzanine Architecture
- Segmentation by Processor Use
- NON-PROCESSOR MEZZANINE CARDS
- OPERATING SYSTEM USE
- HIGH SPEED SERIAL INTERCONNECT USE
- NON-INTELLIGENT MEZZANINE CARD CARRIER BUS ARCHITECTURES
- LEADING VENDORS OF MEZZANINE CARDS AND CARRIERS, 2007
VI MEZZANINE CARD AND CARRIER VERTICAL MARKETS
- OVERALL VERTICAL MARKET SEGMENTATION
- COMMUNICATIONS: EDGE
- Mezzanine Architectures
- Degree of Customization
- Processor vs. Non-Processor Cards
- Primary Processor Types
- Multi-Core CPU Use
- Single us. Multiple Discrete CPU Use
- Non-Processor Functional Types
- Operating Systems
- Carrier Bus Architectures
- COMMUNICATIONS: CORE
- Mezzanine Architectures
- Degree of Customization
- Processor vs. Non-Processor Cards
- Primary Processor Types
- Multi-Core CPU Use
- Single us. Multiple Discrete CPU Use
- Non-Processor Functional Types
- Operating Systems
- Carrier Bus Architectures
- INDUSTRIAL AUTOMATION & CONTROL
- Mezzanine Architectures
- Degree of Customization
- Processor vs. Non-Processor Cards
- Primary Processor Types
- Multi-Core CPU Use
- Single vs. Multiple Discrete CPU Use
- Non-Processor Functional Types
- Operating Systems
- Carrier Bus Architectures
- INSTRUMENTATION
- Mezzanine Architectures
- Degree of Customization
- Processor vs. Non-Processor Cards
- Primary Processor Types
- Multi-Core CPU Use
- Single vs. Multiple Discrete CPU Use
- Non-Processor Functional Types
- Operating Systems
- Carrier Bus Architectures
- MEDICAL
- Mezzanine Architectures
- Degree of Customization
- Processor vs. Non-Processor Cards
- Primary Processor Types
- Multi-Core CPU Use
- Single vs. Multiple Discrete CPU Use
- Non-Processor Functional Types
- Operating Systems
- Carrier Bus Architectures
- MILITARY, AEROSPACE & DEFENSE
- Mezzanine Architectures
- Degree of Customization
- Processor vs. Non-Processor Cards
- Primary Processor Types
- Multi-Core CPU Use
- Single vs. Multiple Discrete CPU Use
- Non Processor Functional Types
- Operating Systems
- Carrier Bus Architectures
- TRANSPORTATION
- Mezzanine Architectures
- Degree of Customization
- Processor vs. Non-Processor Cards
- Primary Processor Types
- Multi-Core CPU Use
- Single vs. Multiple Discrete CPU Use
- Non-Processor Functional Types
- Operating Systems
- Carrier Bus Architectures
- "OTHER" VERTICALS
- Mezzanine Architectures
- Degree of Customization
- Processor vs. Non-Processor Cards
- Primary Processor Types
- Multi-Core CPU Use
- Single vs. Multiple Discrete CPU Use
- Non-Processor Functional Types
- Operating Systems
- Carrier Bus Architectures
VII MEZZANINE CARD DEMAND SIDE DATA
- DEMAND SIDE DATA
- SURVEY RESPONDENT DEMOGRAPHICS
- NON-TECHNICAL VENDOR SELECTION CRITERIA
- MEZZANINE ARCHITECTURES
- REASONS FOR SELECTING MEZZANINE CARDS
- EXPECTED CHANGES IN MEZZANINE CARD PURCHASES
- PROCESSORS USED ON MEZZANINE CARDS
- SURVEY RESPONDENT DEMOGRAPHICS: AMC CARD USERS
- NON-TECHNICAL VENDOR SELECTION CRITERIA: CARD USERS
- REASONS FOR SELECTING AMC CARDS
- EXPECTED CHANGES IN AMC CARD PURCHASES
- PROCESSORS USED ON AMC CARDS
- SURVEY RESPONDENT DEMOGRAPHICS: PMC CARD USERS
- NON-TECHNICAL VENDOR SELECTIOIN CRITERIA: PMC CARDS
- REASONS FOR SELECTING PMC CARDS
- EXPECTED CHANGES IN PMC CARD PURCHASES
- PROCESSORS USED ON PMC CARDS
- SURVEY RESPONDENT DEMOGRAPHICS: XMC CARD USERS
- NON-TECHNICAL VENDOR SELECTION CRITERIA: XMC CARDS
- REASONS FOR SELECTING XMC CARDS
- EXPECTED CHAGES IN XMC CARD PURCHASES
- PROCESSORS USED ON XMC CARDS
- SURVEY RESPONDENT DEMOGRAPHICS: "OTHER" CARDS
- REASONS FODR SELECTING "OTHER" CARD PURCHASES
- PROCESSORS USED ON "OTHER" CARDS
VIII COMS AND COM CARRIERS
- COMPUTERS-ON-MODULES (COMS)
- TECHNICAL OVERVIEW
- DIMM-PC
- COM Express
- ETX
- XTX
- Proprietary and Other Architectures
- Interchangeability Issues
- STUDY FINDINGS
- Overall Market
- Market Growth and Segmentation by Form Factor
- Geographic Distribution of Shipments
- Vertical Markets
- Degree of Customization
- DIMM-PC: Compliance with Specification
- COM Express Modules: Segmentation by Type
- COM Modules: Segmentation by Processor Type
- DIMM-PCs: Segmentation by Processor Type
- COM Express Modules: Segmentation by Processor Type
- ETX Modules: Segmentation by Processor Type
- XTX Modules: Segmentation by Processor Type
- COM Modules: Integrated Features
- COM Modules: Estimated Operating System Use
- COM: Carriers: Standard vs. Custom
- COM Carriers: Segmented by Form Factor/Architecture
- Slot Card COM Carriers: Segmented by Bus Architecture
- LEADING VENDORS OF COMS AND COM CARRIERS, 2007
IX COM MODULES VERTICAL MARKETS
- OVERALL VERTICAL MARKET SEGMENTATION
- COMMUNICATIONS: EDGE
- Form Factors
- Degree of Customization
- Processor Types
- Multi-Core CPU Use
- Operating Systems
- COMMUNICATIONS: CORE
- Form Factors
- Degree of Customization
- Processor Types
- Multi-Core CPU Use
- Operating Systems
- INDUSTRIAL AUTOMATION 6 CONTROL
- Form Factors
- Degree of Customization
- Processor Types
- Multi-Core CPU Use
- Operating Systems
- INSTRUCTION
- Form Factors
- Degree of Customization
- Processor Types
- Multi-Core CPU Use
- Operating Systems
- MEDICAL
- Form Factors
- Degree of Customization
- Processor Types
- Multi-Core CPU Use
- Operating Systems
- MILITARY, AEROSPACE & DEFENSE
- Form Factors
- Degree of Customization
- Processor Types
- Multi-Core CPU Use
- Operating Systems
- TRANSPORTATION
- Form Factors
- Degree of Customization
- Processor Types
- Multi-Core CPU Use
- Operating-Systems
- OTHER (UNDEFINED) VERTICALS
- Form Factors
- Degree of Customization
- Processor Types
- Multi-Core CPU Use
- Operating System
X COMS DEMAND SIDE DATA
- DEMAND-SIDE DATA
- SURVEY RESPONDENT DEMOGRAPHICS
- NON-TECHNICAL VENDOER SELECTION CRITERIA
- COM FORM FACTORS
- REASON FOR SELECTING COMS
- EXPECTED CHANGES IN COM PURCHASES
- PROCESSORS USED ON COMS
- SURVEY RESPONDENT DEMOGRAPHICS: COM EXPRESS USERS
- NON-TECHNICAL VENDOR SELECTION CRITERIA: COM EXPRESS MODULES
- REASONS FOR SELECTING COMS IN GENERAL (COM EXPRESS USERS)
- REASONS FOR SELECTING COM EXPRESS, IN PARTICULAR
- CHARACTERISTICS OF COM EXPRESS TARGET APPLICATION(S)
- BOARDS/FORM FACTORS BEING REPLACED BY COM EXPRESS
- EXPECTED CHAGES IN COM EXPRESS PURCHASES
- PROCESSORS USED ON COM EXPRESS MODULES
- SURVEY RESPONDENT DEMOGRAPHICS: DIMM-PC MODULES
- REASONS FOR SELECTING DIMM-PC MODULELS
- SURVEY RESPONDENT DEMOGRAPHICS: ETX MODULE USERS
- NON-TECHNICAL VENDOR SELECTION CRITERIA: ETX MODULES
- REASONS FOR SELECTING ETX MODULRES
- EXPECTED CHAGES ETX MODULE PURCHASES
- PROCESSORS USED ON ETX MODULRES
- SURVEY RESPONDENT DEMOGRAPHICS "OTHER COM USERS
- NON-TECHNICAL VENDOR SELECTION CRITERIA "OTHER COMS
- REASONS FOR SELECTING "OTHER COM FORM FACTORS
- EXPECTED CHAGES IN "OTHER COM PURCHASES
- PROCESSORS USED ON "OTHER COMS
XI OBSERVATIONS AND RECOMMENDATIONS
- MEZZANINE CARDS
- Industry Pack
- PMC
- XMC
- AMC
- COMPUTERS-ON-MODULES (COMs)
- ETX
- COM Express
- XTX
- COM Carriers
XII VENDOR PROFILES
- ADLINK TECHNOLOGY, INC.
- ADVANTECH CO., LTD.
- COMPULAB, LTD.
- CURTISS-WRIGHT CONTROLS EMBEDDED COMPUTIN (CWCEC)
- DIGITAL-LOGIC AG
- EMERSON NETWORK POWER EMBEDDED COMPUTING
- GE FANUC INTELLIGENT PLATFORMS
- INTERPHASE CORPORATIN
- KONTRON AG
- MEN MIKRO
- MERCURY COMPUTER SYSTEMS, INC
- MSC VERTRIEBS GMBH
- PORTWELL, INC.
- RADISYS
- WAYS TO WORK WITH US
VOLUME 4: STACKABLES
I EXECUTIVE SUMMARY
GENERAL OVERVIEW PLATFORM CLASSES VERTICAL MARKETS CPU TYPES OPERATING SYSTEMS
LEADING STACKABLE VENDORS
II SCOPE AND METHODOLOGY
- SCOPE
- DEFINITIONS OF TERMS
- BOARDS EXCLUDED FROM THE STUDY
- SEGMENTATION
- OTHER REPORT CONTENT
- METHODOLOGY
III INDUSTRY STRUCTURE
- INDUSTRY PARTICIPANTS
- TRADE ORGANIZATIONS AND STANDARDS
- The PC/104 Consortium
- Small Form Factor Special Interest Group (SFF-SIG)
- Stackable USB
- MERGERS AND ACQUISITIONS
IV INDUSTRY OVERVIEW
- PLATFORM CLASSES
- VERTICAL MARKETS
- GEOGRAPHIC DISTRIBUTION
- SALES AND DISTRIBUTION CHANNELS
- CONSUMING CUSTOMER CLASSED
- DEGREE OF CUSTOMIZATION
- PROCESSORTS
- OPERATING SYSTEMS
- LEADING STACKABLES VENDORS
V PC/104 FAMILY MODULES
- GENERAL OVERVIEW
- Expansion Architectures
- Technical Descriptions
- MARKET OVERVIEW
- Expansion Architectures
- Technical Descriptions
- MARKET OVERVIW
- Overall Market
- Architectures and Functional Classed
- Vertical Markets
- Geographic Distribution
- Sales & Distribution Channels
- Consuming Customer Classes
- Degree of Customization
- Processors
- Integrated features
- Operating Systems
- Functional Types
- Leading PC/104 Family Stackables Vendors, 2007
VI OTHER (NON PC/104) STACKABLES
- GENERAL OVERVIEW
- Form Factors
- Brief Technical Descriptions
- MARKET OVERVIEW
- Overall Market
- Form Factors
- Vertical Markets
- Degrees of Customization
- Processors
- Expansion Architectures
- Operating Systems
- Integrated Features
- Leading Vendors
VII DEMAND SIDE DATA
- DEMAND SIDE DATA
- SURVEY RESPONDENT DEMOGRAPHICS
- NON-TECHNICAL VENDOR SELECTION CRITERIA
- STACKABLES FORM FACTORS
- REASON FOR SELECTING STACKABLES
- EXPECTED CHANGES IN STACKABLES PURCHASES
- PROCESSORTS USED ON STACKABLES
- SURVEY RESPONDENT DEMOGRAPHICS; PC/104 FAMILY USERS
- NON-TECHNICAL VENDOR SELECTION CRITERIA: PC/104 FAMILY
- REASONS FOR SELECTING PC/104 FAMILY IN GENERAL
- EXPECTED CHAGES IN PC/104 FAMILY PURCHASE
- PROCESSORS USED ONPC/104 FAMILY STACKABLES
- SURVEY RESPONDENT DEMOGRAPHICS: NON-PC/104 FAMILY STACKABLES USERS
- NON-TECHNICAL VENDOR SELECTION CRITERIA: NON-PC/104 FAMILY STACKABLES USERS
- REASONS FOR SELECTING NON-PC/104 FAMILY STACKABLES
- EXPECTED CHANGES IN NON-PC/104 FAMILY STACKABLES PURCHASES
- PROCESSORS USED ON NON-PC/104 FAMILY STACKABLES
VIII OBSERVATIONS AND RECOMMENDATIONS
- SMALL SIZE, BIG OPPORTUNITY
- STACKABLE PLATFORMS
- PC/104 Family Modules
- "Other" Stackables
- CUSTOMIZATION
- MICROPROCESSORS
- OPERATING SYSTEMS
- HIGH-SPEED MODULE-TO-MODULE INTERCONNECTS
- EXPANSION CABABILITY
- "Other" Stackables
- PC/104 Family Modules
- INTEGRATED FEATURES
- VERTICAL MARKETS
- SPECIFIC RECOMMENDATIONS
- PC/104 Family Module Vendors
- "Other" Stackable Board Vendors
IX VENDOR PROFILES
- AAEON TECHNOLOGY, INC.
- ADVANTECH
- AMPRO COMPUTERS, INC.
- ARBOR TECHNOLOGY CORPORATION
- AXIOMTEK CO., LTD.
- DIAMOND SYSTEMS CORPORATION
- DIGITAL-LOGIC AG
- EUROTECH S.P.A.
- KONTRON AG
- MICRO/SYS, INC.
- RTD EMBEDDED TECHNOLOGIES, INC.
- TRI-M ENGINEERING
- VERSALOGIC CORPORATION
- WINSYSTEMS, INC.
- WAYS TO WORK WITH US
VOLUME 5: GLOBAL MARKET SUMMARY
I EXECUTIVE SUMMARY
- GENERAL MARKET OVERVIEW
- VERTICAL MARKETS
- NORMALIZED GROWTH CURVES BY PLATFORM AND ARCHITECTURE
- MARKET SHARE LEADERS
- "PLATINUM" CLASS MERCHANT BOARD VENDORS
II SCOPE AND METHODOLOGY
- SCOPE
- METHODOLOGY
- Supply Side Research
- Demand Side Research
- REPORT ORGANIZATION
III INDUSTRY STRUCTURE
- INDUSTR PARTICIPANTS
- TRADE ASSOCIATIONS
- Computer-On-Module Industrial Group
- ETX Industrial Group
- Hyper Transport™ Consortium
- InfiniBand™ Trade Association (IBTA)
- Mezzannines International, fka Group IPC
- PC/104 Consortium (a.k.a. PC/104 Embedded Consortium)
- PCI Industrial Computer Manufacturers Group (PICMG)®
- PCI Special Interest Group (PCI SIG)®
- PXI systems Alliance (PXISA)
- RapidlO® Trade Association
- Small Form Factor Special Interest Group (SFF-SIG)
- StackableUSB
- VMEbus International Trade Association (VIYTA)®
- VXIbus Consortium
- XTX Consortium
- SIGNIFICANT RECENT MERGERS AND ACQUISITIONS
IV OVERALL MERCHANT EMBEDDED BOARD MARKET
- GENERAL MARKET OVERVIEW
- PROJECTED GROWTH BY PLATFORM
- GEOGRAPHIC DISTRIBUTION
- CHANNELS OF DISTRIBUTION
- CONSUMING CUSTOMER CLASSES
- CPU USE
- TROS USE
- VERTICAL MARKETS
- General
- Communications
- Industrial Automation and Control
- Industrial Automation and Control
- Instrumentation
- Medical
- Military/Aerospace/Defense
- Transportation
- Other, Unspecified Vertical Markets
- LEADING VENDORS
- NON-PRODUCT VENDOR SELECTION CRITERIA
- PLATINUM AND GOLD VENDOR RATINGS
V SLOT SINGLE BOARD COMPUTERS AND EMVEDDED CPU BLADES
- SLOT SBCS VS, EMVEDDED CPU BLADES
- "Traditional" SBCs
- Blades
- Fabric-enabled SBCs
- BUS ARCHITECTURES
- MARKET OVERVIEW
- PROJECTED GROWTH BY ARCHITECTURE
- VERTICAL MARKETS
- General
- Communications
- Industrial Automation and Control
- Instrumentation
- Medical
- Military/Aerospace/Defense
- Transportation
- Other, Unspecified Vertical markets
- MEZZANINE SITES
- SWITCH FABRIC USE
- MULTI-CORE CPU USE
- RTOS USE
- LEADING VENDORS
- SELECTED RECOMMENDATIONS
VI "DESKTOP FORM FACTOR" EMBEDDED MOTHEBOARDS
- GENERAL OVERVIEW
- Form Factors
- Brief Technical Descriptions
- MARKET OVERVIEW
- PROJECTED GROWTH BY FORM FACTOR
- VERTICAL MARKETS
- General
- Communications
- Industrial Automation and Control
- Instrumentation
- Medical
- Military/Aerospace/Defense
- Transportation
- MULTI-CORE CPU USE
- EXPANSION SLOT ARCHITECTURES
- RTOS USE
- INTEGRA TED FEATURES
- LEADING VENDORS
- SELECTED RECOMMENDATIONS
VII "EMBEDDED FORM FACTOR" EMBEDDED MOTHERBOARDS, A.K.A "OTHER" (NON-PC/104 FAMILY) STACKABLES
- GENERAL OVERVIEW
- Form Factors
- Brief Technical Descriptions
- MARKET OVERVIEW
- Overall Market
- VERTICAL MARKETS
- General
- Communications
- Industrial Automation and Control
- Instrumentation
- Medical
- Military/Aerospace/Defense
- Transportation
- MULTI-CORE CPU USE
- EXPANSION ARCHITECTURES
- RTOS USE
- INTEGRATED FEATURES
- LEADING VENDORS
- SELECTED RECOMMENDATIONS
VIII MEZZANINE CARDS AND NON-INTELIGENT MEZZANINE CARD CARRIERS
- GENERAL OVERVIEW
- DEFINITIONS
- BRIEF TECHNICAL DESCRIPTIONS
- Industry Pack (IP)
- PMC
- XMC
- AMC (Advanced Mezzanine Card)
- MARKET OVERVIEW
- PROJECTED GROWTH BY MEZZANINE ARCHITECTURE
- NON-INTELLIGENT CARRIERS: BUS ARCHITECTURES
- VERTICAL MARKETS
- General
- Communications
- Industrial Automation and Control
- Instrumentation
- Medical
- Military/Aerospace/Defense
- Transportation
- Other Unspecified Verticals
- PROCESSOR VS. NON-PROCESSOR MEZZANINE CARDS
- PROCESSOR TYPES
- NON-PROCESSOR CARDS: FUNCTIONAL TYPES
- RTOS USE
- LEADING VENDORS
- SELECTED RECOMMENDATIONS
IX COMS (COMPUTERS-ON-MODULES) AND COM CARRIERS
- GENERAL OVERVIEW
- Form Factors
- Brief Technical Descriptions
- MARKET OVERVIEW
- Overall Market
- PROJECTED GROWTH BY FORM FACTOR
- CARRIER ARCHITECTURES
- VERTICAL MARKETS
- General
- Communications
- Industrial Automation and Control
- Instrumentation
- Medical
- Military/Aerospace/Defense
- Transportation
- Other Unspecified Verticals
- MULTI-CORE PROCESSOR USE
- RTOS USE
- INTEGDRATED FEATURES
- LEADING VENDORS
- SELECTED RECOMMENDATIONS
X PC/104 FAMILY MODULES
- GENERAL OVERVIEW
- Architectures
- Brief Technical Descriptions
- MARKET OVERVIEW
- Overall Market
- PROJECTED GROWTH BY ARCHITECTURES AND PRIMARY FUNCTIONAL CLASSES
- VERTICAL MARKETS
- General
- Communications
- Industrial Automation and Control
- Instrumentation
- Medical
- Military/Aerospace/Defense
- Transportation
- Other Unspecified Verticals
- MULTI-CORE PROCESSOR USE
- RTOS USE
- PC/104 FAMILY EXPANSION MODULES: FUNCTIONAL TYPES
- LEADING VENDORS
- SELECTED RECOMMENDATIONS
XI DEMAND SIDE DATA
- DEMAND SIDE DATA
- SURVEY RESPONDENT DEMOGRAPHICS
- BOARD TYPES USED / PURCHASED
- EXPECTED CHANGES IN BOARD PURCHASES
- PROCESSORS USED
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