Table of Contents
SECTION ONE
- Summary
- 1.0 Introduction
- 1.1 Executive summary
- 1.2 What is a PCB?
- 1.3 Why PCBs are Used
- 1.4 PCB History
SECTION TWO
- 2.0 PCB technology
- 2.1 PCB Design Considerations
- 2.2 Steps in PCB Design and Manufacture
- 2.2.1 Component Mounting Techniques
- 2.2.1.1 Through-Hole PCBs
- 2.2.1.2 Surface-Mount PCBs
- 2.3 PCB Market by Layers
- 2.3.1 Single layer PCB
- 2.3.2 Double layer PCB
- 2.3.3 Multilayer PCB
- 2.3.3.1 Case Study - Plotech
- 2.3.4 Analysis
- 2.4 PCB Market by rigidity
- 2.4.1 Rigid PCBs
- 2.4.1.1 Advantages
- 2.4.1.2 Limitations
- 2.4.1.3 Popular End Applications
- 2.4.2 Flexible PCBs
- 2.4.2.1 Flex PCB Advantages
- 2.4.2.2 Flex PCB Limitations
- 2.4.2.3 Popular End Products for Flex PCBs
- 2.4.3 Rigid-Flex PCBs
- 2.4.3.1 Advantages of Rigid-Flex PCBs
- 2.4.3.2 Limitations of Rigid-Flex PCBs
- 2.4.3.3 Rigid-Flex PCB Popular End Applications
- 2.4.4 Analysis
- 2.5 PCB Market by Materials
- 2.5.1 Alumina Substrate
- 2.5.1.1 Advantages of Alumina as a Substrate
- 2.5.1.2 Limitations of Alumina as a Substrate
- 2.5.1.3 End Applications for PCBs with an Alumina Substrate
- 2.5.1.4 Alumina Substrate Application - Thin-Film Applications
- 2.5.1.5 Alumina Substrate Application - Facsimile Machines
- 2.5.2 FR4 Substrate
- 2.5.2.1 FR-4 Advantages
- 2.5.2.2 FR-4 Limitations
- 2.5.2.3 FR-4 Popular End Applications
- 2.5.3 Beryllium Oxide Substrate
- 2.5.3.1 Beryllium Oxide Advantages
- 2.5.3.2 Beryllium Oxide Limitations
- 2.5.3.3 Beryllium Oxide Popular End Uses
- 2.5.3.4 Beryllium Oxide Applications - Electro Hydraulics
- 2.5.4 BT - Epoxy Substrate
- 2.5.4.1 BT - Epoxy Advantages
- 2.5.4.2 BT - Epoxy Limitations
- 2.5.4.3 BT - Epoxy Popular End Applications
- 2.5.5 Polyimide
- 2.5.5.1 Polyimide Advantages
- 2.5.5.2 Polyimide Limitations
- 2.5.5.3 Polyimide Popular End Applications
- 2.5.6 PTFE/ Woven Fiberglass Substrate (Teflon)
- 2.5.6.1 PTFE Advantages
- 2.5.6.2 PTFE Limitations
- 2.5.6.3 PTFE Popular End Applications
- 2.5.6.4 PTFE Application - Precisionfab
- 2.5.6.5 PTFE Application - Arlon
- 2.5.7 Hybrid PCB Substrates
- 2.5.7.1 PTFE/Fiberglass/BT-Epoxy Hybrid Substrate
- 2.5.7.2 Montmorillonite (MMT)-filled brominated Epoxy Hybrid Substrate
- 2.5.8 Analysis
- 2.6 Today' s PCB Market Demands and Implications
- 2.6.1 Approaches for PCB Space Optimization
- 2.6.1.1 FPGA Space Optimization - Actel
- 2.6.1.2 LED Space Optimization - Maxim.
- 2.6.1.3 FPGA Space Optimization - Procon
SECTION THREE
- 3.0 The PCB Business Environment
- 3.1 Application Specific PCBs
- 3.1.1 Telecommunications
- 3.1.1.1 Mobile Phone
- 3.1.1.1.1 Omnidirectional Type PCB Antenna
- 3.1.1.2 Backplane
- 3.1.2 Computing Hardware
- 3.1.2.1 PC
- 3.1.2.1.1 Motherboard of a PC
- 3.1.2.1.2 Computer Keyboard
- 3.1.2.1.3 Storage and Other Computing Applications
- 3.1.3 CE and Automotive Applications
- 3.1.3.2 DVD, VCD
- 3.1.3.3 Camera (Infrared day and night camera)
- 3.1.3.4 Reed Switches
- 3.1.3.5 Position sensing application
- 3.1.3.6 Brake lever sensing application
- 3.1.3.7 Fuel level sensing application
- 3.1.3.8 Electronically-locked door sensors application
- 3.1.4 Other Applications
- 3.1.4.1 Photoelectric fire/smoke detector/alarm
- 3.1.4.2 Water boilers and Control units
- 3.1.4.2 Medical Ultrasound System
- 3.1.4.3 Pressure Sensors
- 3.1.5 Analysis
- 3.2 Business Drivers
- 3.2.1 High Speed and High Frequency Signals
- 3.2.1.1 High Speed and High Frequency Signal Challenges
- 3.2.1.2 Approaches to Counter Challenges
- 3.2.1.2.1 Microstrips
- 3.2.1.2.2 Striplines
- 3.2.2 Semiconductor Packaging technology innovations
- 3.2.2.1 CSP/WLP
- 3.2.2.2 PGA/BGA
- 3.2.2.3 FC
- 3.2.2.4 MCM
- 3.2.2.5 SiP
- 3.2.2.6 PoP
- 3.2.3 Packing integration technology/System on the Package
- 3.2.4 Advances in EDA
- 3.2.4.1 Initial EDA/CAD Tools
- 3.2.4.2 Conventional Procedure to Use CAD Tools
- 3.2.4.3 Contemporary PCB Design Tools
- 3.2.5 Miniaturization
- 3.2.5.1 Laser and Photonic Methods for Micro Vias
- 3.3 PCB Industry Issues and Challenges
- 3.3.1 Application Issues: Analog, Digital and Mixed Signal PCBs
- 3.3.1.1 Analog PCBs
- 3.3.1.1.1 Analog Design Challenges and Limitations
- 3.3.1.1.2 Technology Advances and Workarounds
- 3.3.1.1.3 Case Study - Blacet Research
- 3.3.1.2 Digital PCBs
- 3.3.1.2.1 Digital Design Challenges and Limitations
- 3.3.1.2.2 Technology Advances and Workarounds
- 3.3.1.3 Mixed Signal PCBs
- 3.3.1.3.1 Importance of Grounding in Mixed Signal PCBs
- 3.3.1.3.2 Other Design Considerations
- 3.3.1.3.3 Mixed Signal PCB Applications
- 3.3.1.3.4 Case Study - Maxim
- 3.3.2 Environmental Issues
- 3.4 Market Push and Pull
- 3.4.1 Impact of Raw Material Price Fluctuations
- 3.4.2 Outsourced Manufacturing Trends
- 3.5 The Geographical Distribution of PCB Manufacturers and Market
Realities Going Forward
- 3.5.1 Geographical Region Metrics
- 3.5.1.1 North American PCB Production Revenues and Market Demand
Expenditures
- 3.5.1.2 European PCB Production Revenues and Market Demand Expenditures
- 3.5.1.3 APAC Region PCB Production Revenues and Market Demand
Expenditures
- 3.5.1.4 ROW PCB Production Revenues and Market Demand Expenditures
- 3.5.1.5 Analysis
TABLES AND FIGURES
- Table 1-1: World PCB Revenues 2007-2012
- Table 2-1: Global Single Layer PCB Revenues 2007-2012
- Table 2-2: Global Double Layer PCB Revenues 2007-2012
- Table 2-3: Global Multi-Layer PCB Revenues 2007-2012
- Table 2-4: Shares of Layered PCBs vs. Global PCB Production 2007 and 2012
- Table 2-5: Global Rigid PCB Revenues 2007-2012
- Table 2-6: Global Flex and Rigid Flex PCB Revenues 2007-2012
- Table 2-7: Share of Rigid and Flex PCBs vs. Global PCB Production 2007 and
2012
- Table 2-8: Substrate Material Properties
- Table 2-9: Global Revenues for PCB Substrate Material 2007-2012
- Table 2-10: PCB Substrate Share of Global PCB Market 2007-2012
- Table 3-1: Global PCB Revenues for PCBs Used in Telecommunications
Applications 2007-2012
- Table 3-2: Global PCB Revenues for PCBs Used in Computing Hardware
Applications 2007-2012
- Table 3-3: Global PCB Revenues for PCBs Used in Automotive Applications
2007-2012
- Table 3-4: Global PCB Revenues for PCBs Used in Industrial, Medical,
Military and Other 2007-2012
- Table 3-5: Overall Shares of Global PCB Revenues by Application 2007 and
2012
- Table 3-6: Global Revenues for PCB/MCM EDA Tools 2007-2012
- Table 3-7: Global Revenues for HDI Microvia PCBs 2007-2012
- Table 3-8: HDI/Microvias Share of Global Multi-layer PCB Revenues 2007-2012
- Table 3-9: North American PCB Production Revenues and Market Demand
Expenditures 2007-2012
- Table 3-10: Europe PCB Productions Revenues and Market Demand Expenditures
2007-2012
- Table 3-11: APAC PCB Production Revenues and Market Demand Expenditures
2007-2012
- Table 3-12: The ROW PCB Production Revenues and Market Demand Expenditures
2007-2012
- Table 3-13: Regional PCB Revenues Share, NA, Europe, APAC and Other 2007
and 2012
- Table 3-14: Regional PCB Expenditures Share, NA, Europe, APAC and Other
2007 and 2012
- Table A-1: Cellular and NGN Base Station Deployments, All Technologies
World Market 2006-2012
- Table A-2: Telematics Users, World Market 2005-2011
- Table A-3: Total Vehicles Equipped with Navigational Devices, World Market
2005-2011
- Table A-4: Mobile Subscribers, All Technologies World Market 2006-2012
- Table A-5: Cellular Phone Shipments, World Market 2005-2011
- Table A-6: Mobil Television Users, World Market 2005-2011
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