Table of Contents
List of figures
Glossary of Abbreviations
1. Executive Summary
2. Methodology
3. Industry Overview
- 3.1 Introduction to RF MEMS
- 3.2 RF MEMS Products
- 3.3 Market Players
- 3.4 Commercial Status of RF MEMS
4. The Total RF MEMS Market
- 4.1 The RF MEMS Market by Application
- 4.2 The RF MEMS Market by Component Type
- 4.3 2005 Forecasts in Comparison to 2002 Forecasts
5. The RF MEMS Market by Application
- 5.1 Mobile Telephony
- 5.2 Consumer electronics and IT peripherals
- 5.3 WLANs and WPANs
- 5.4 Base Stations (pdf)
- 5.5 Microwave Telecommunications
- 5.6 RF Instrumentation and ATE
- 5.7 Automotive
- 5.8 Satellites
- 5.9 Military Tactical Radios
- 5.10 Military Phased Array Antennas
6. The RF MEMS Market by Component
- 6.1 RF MEMS Switches
- 6.2 Tunable Capacitors
- 6.3 BAW Resonators
- 6.4 Micro-mechanical Resonators
- 6.5 Other RF MEMS Devices
7. Conclusions
8. Company Profiles
- 8.1 North American Companies (pdf)
- 8.2 European Companies
- 8.3 Asian Companies
List of Figures
- 1.1 Implementation of RF MEMS by Application, 2009
- 1.2 Total Turnover Forecasts for the RF MEMS Market by Application
- 3.1 Operating Frequency Ranges for RF MEMS
- 3.2 Mobile Communication Market Drivers
- 3.3 MEMS Switch packaged using Liquid Encapsulation, Courtesy of
MEMtronics
- 3.4 Ohmic Switch
- 3.5 Capacitive Switch
- 3.6 RF MEMS switch, TeraVicta
- 3.7 Parallel Plate MEMS Capacitor, Courtesy of Fraunhofer ISIT
- 3.8 Micro-machined Inter-digital Capacitor, Courtesy of CNR-IMM-M2T
- 3.9 Schematic view of a Film Bulk Acoustic Resonator (FBAR)
- 3.10 Schematic view of a Solidly Mounted Resonator (SMR)
- 3.11 BAWPCS duplexers chips, Courtesy of Infineon Technologies AG
- 3.12 A vertically drivenmicro-mechanical resonator, Clark T.-C.Nguyen,
University of Michigan
- 3.13 A two-port laterally driven micro-mechanical resonator, Clark T.-C.
Nguyen, University of Michigan
- 3.14 Micromachined Inductor, Courtesy of Fraunhofer ISIT
- 3.15 RF MEMS industrial chain
- 3.16 Estimation of Public Funding for RF MEMS R&D worldwide in 2004
- 3.17 List of Major Companies by Product Type
- 3.18 List of Major Research Institutions by Product Type
- 3.19 Commercialisation Status for RF MEMS Products
- 3.20 The RF MEMS Switch Hype Curve
- 4.1 Investigated RF MEMS Components
- 4.2 Investigated Applications
- 4.3 Implementation of RF MEMS by Application, 2009
- 4.4 Total Turnover Forecasts for the RF MEMS Market
- 4.5 Total Unit Forecasts for the RF MEMS Market
- 4.6 Implementation Potential for RF MEMS by Application
- 4.7 Roadmap for Implementation of RF MEMS by Application
- 4.8 Total Turnover Forecasts for the RF MEMS Market by Application
- 4.9 Total Unit Forecasts for the RF MEMS Market by Application
- 4.10 Total Turnover Forecasts for the RF MEMS Market for Non-Volume
Communications Applications
- 4.11 Total Unit Forecasts for the RF MEMS Market for Non-Volume
Applications
- 4.12 Roadmap for Implementation of RF MEMS by Component Type
- 4.13 Total Turnover Forecasts for the RF MEMS Market by Component
- 4.14 Total Unit Forecasts for the RF MEMS Market by Component
- 4.15 Turnover Forecasts from the 2002 Report in comparison with the 2005
Report
- 5.1 Schematic view of a SP8T band/mode switching module
- 5.2 Thermal Switch packaged using Thin Film Encapsulation at Wafer Level,
Courtesy of ST Microelectronics and CEA-Leti
- 5.3 BAW duplexer, Courtesy of Epcos
- 5.4 Schematic View of RF MEMS Switches integrated within the Wiring
Levels for SiGe or Analog CMOS IC's, Courtesy of IBM
- 5.5 Total Turnover Forecasts for the RF MEMS Market for Mobile Telephony
- 5.6 Total Unit Forecasts for the RF MEMS Market for Mobile Telephony
- 5.7 Discera resonator in wafer-level vacuum packaging, shown on top of
Kyocera oscillator
- 5.8 Schematic view of the Enpirion MEMS inductor for DC-DC converters
- 5.9 Total Turnover Forecasts for the RF MEMS Market for Consumer
Electronics and IT Peripherals
- 5.10 Total Unit Forecasts for the RF MEMS Market for Consumer Electronics
and IT Peripherals
- 5.11 Total Turnover Forecasts for the RF MEMS Market for WLAN & WPAN
- 5.12 Total Unit Forecasts for the RF MEMS Market for WLAN &WPAN
- 5.13 Architectural concept of a multiband/multistandard basestation
- 5.14 Synthesizer Radio Function Block
- 5.15 Total Turnover Forecasts for the RF MEMS Market for Base Stations
- 5.16 Total Unit Forecasts for the RF MEMS Market for Base Stations
- 5.17 Total Turnover Forecasts for the RF MEMS Market for Microwave
Telecommunications
- 5.18 Total Unit Forecasts for the RFMEMS Market for Microwave
Telecommunications
- 5.19 Schematic View of the PIN Electronics of an ATE System's Test Head
- 5.20 SPDT RFMEMS Switch for the DC-18GHz Range, Courtesy of XCOM Wireless,
Inc.
- 5.21 Total Turnover Forecasts for the RF MEMS Market for RF
Instrumentation and ATE
- 5.22 Total Unit Forecasts for the RF MEMS Market for RF Instrumentation
and ATE
- 5.23 Overview of Driving Assistance Systems
- 5.24 Concept for Beam Steering with RF MEMS based Planar Antenna Systems
- 5.25 Total Turnover Forecasts for the RF MEMS Market for Automotive
- 5.26 Total Unit Forecasts for the RF MEMS Market for Automotive
- 5.27 Total Turnover Forecasts for the RF MEMS Market for Satellites
- 5.28 Total Unit Forecasts for the RF MEMS Market for Satellites
- 5.29 RF MEMS based UHF 2-Pole MEMS Capacitor tunable Filter, Courtesy of
Rockwell Scientific
- 5.30 Integration of RF MEMS Filter Module, Courtesy of Raytheon
- 5.31 Total Turnover Forecasts for the RF MEMS Market for Military Radio
Systems
- 5.32 Total Units Forecasts for the RF MEMS Market for Military Radio
Systems
- 5.33 90. RFMEMS enabled Phase Shifter Stick, Courtesy of X-COM Wireless,
Inc.
- 5.34 Electronically Steerable Antenna employing 25000 Switches, Courtesy
of Radant MEMS, Inc.
- 5.35 Total Turnover Forecasts for the RF MEMS Market for phased array
antenna
- 5.36 Total Unit Forecasts for the RF MEMS Market for phased array antenna
- 6.1 Ohmic Contact Electrostatic Cantilever Switch, Courtesy of Radant
MEMS, Inc.
- 6.2 Low Temperature Hermetic Thin Film Packaging (CMOS compatible),
Courtesy of CEA-Leti
- 6.3 RF MEMS Switches in Comparison with GaAs FET, PIN Diodes and EMR
technologies
- 6.4 Roadmap for implementation of MEMS switches
- 6.5 Total Turnover Forecasts for the RF MEMS Switches Market
- 6.6 Total Unit Forecasts for the RF MEMS Switches Market
- 6.7 MEMS Tunable Capacitor, Courtesy of Philips
- 6.8 Roadmap for Implementation of Tunable Capacitors
- 6.9 Total Turnover Forecasts for the Tunable Capacitors Market
- 6.10 Total Unit Forecasts for the Tunable Capacitors Market
- 6.11 Detail of a FBAR structure, Courtesy of Agilent
- 6.12 Detail of a BAWPCS duplexer, Courtesy of Infineon Technologies AG
- 6.13 BAW Technology in Comparison with Ceramic and SAW Technologies
- 6.14 Roadmap for Implementation of BAW Resonators
- 6.15 Total Turnover Forecasts for the BAW Resonators Market
- 6.16 Total Unit Forecasts for the BAW Resonators Market
- 6.17 'Clamped-Clamped' Beam Micro-mechanical Resonator, Courtesy of Discera
- 6.18 Cross-section of a CMOS compatible back-end-of-line Silicon Germanium
resonator with sub-ƒÊs gap electrodes and metal interconnects. Courtesy of
Silicon Clocks, Inc
- 6.19 Roadmap for Implementation of Micro-mechanical Resonators
- 6.20 Total Turnover Forecasts for the Micro-mechanical Resonators Market
- 6.21 Total Unit Forecasts for the Micro-mechanical Resonators Market
- 6.22 Total Turnover Forecasts for the MEMS Inductors Market
- 6.23 Total Unit Forecasts for the MEMS Inductors Market
- 6.24 Total Turnover Forecasts for the Cavity Resonators Market
- 6.25 Total Unit Forecasts for the Cavity Resonators Market
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