Abstract
A complete update on Wafer Level Packaging technologies with market status and forecast
MARKET TRENDS
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Wafer Level Packaging is a confirmed high growth trend in the semiconductor
packaging industry. Wafer Level Chip Scale Packaging (WLCSP), or the direct
bonding of bumped integrated circuits (IC' s) on printed circuit boards (PCB' s)
as one of the most visible expressions of WLP, is undoubtedly the fastest
growing package type in the whole industry. Yole forecasts that it will
exceed 10 billion units per year by 2012, at a compound annual growth rate of
more than 20% over the next 5 years.
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Primarily driven by footprint and thickness reduction of packaged integrated
circuits in mobile phones, WLCSP is now used in a wide range of circuits for
handsets: EMI/ESD interface protection; power supply (PMIC/PMU, DC/DC
converters, LED drivers, MOSFET' s,...); connectivity (Bluetooth, WLAN); and
other features (FM, GPS, TV on mobile, camera).
Wafer-Level Packaging of MEMS devices is also expected to grow fast, driven
here too by the handset market and its fast increasing rate of integrated
sensors (MEMS microphones, accelerometers, gyroscopes, pressure and magnetic
sensors).
Key features of the report
- Detailed account of all the application fields of WLCSP (examples
are Integrated circuits, DC/DC converters, GPS, Bluetooth, audio amplifiers,
...)
- Market trends and figures in Munits and wafer size equivalent with
breakdown by application. Market value evaluation in $M assembly service.
- Wafer price ranges of WLCSP contract assembly by wafer size
- Complete technologies and material tool-box analysis, covering
WLCSP, fan-out WLCSP and chip embedding platforms, as well as WLP of MEMS
devices.
- Key drivers, Benefits and challenges of each of these technologies
- Supply chain analysis: main contract assemblers (OSAT) for WLCSP.
Companies cited in the report:
Amkor, Analog Devices, Apple, Asahi Glass Chemicals , ASE, Analog Devices, Air
Products, Austriamicrosystems, Arch Chemical, AT&S, Avago Technologies, AVX,
Brewer Sciences, Bosch, Broadcom, California Micro Devices, Casio Computer,
China WLCSP, Clover Electronics, CSR, Dalsa Semiconductor, DNP, DOW Chemical,
Dupont, Enthone, Epcos, EPWorks, EVGroup, Fairchild Semiconductors, FlipChip
International, Fraunhofer-IZM,Freescale, Fujikura, Fujifilm, i2a, IC
Interconnect / JCAP, Imbera Electronics, Ibiden, IBM, IME,IMEC, IMT, Infineon,
International Rectifier, JSR Micro, Maxim, MaxLinear, Mentor Graphics,
MicroChem, Micron, National Semiconductor, Nanya, NEC Toppan Circuit, Nokia,
NXP, OKI Electric, Omnivision, OptoPAC, Pac Tech, Replisaurus Technologies,
RFMD, Rohm & Hass, Samsung, Sanyo, Schott, Sensonor, Silex, SiTime, Sharp,
Shin-Etsu, Shinko, Skyworks, StatsChipPac, STMicroelectronics, STEricsson,
SPIL, Sumitomo, SUSS MicroTec, Telephus, Tessera, Texas Instruments, TOK,
Toshiba, Triquint, Tronic' s Microsystems, Touch Microsystems Technology, TSMC,
Ultratech, VTI, Wolfson Microelectronics, Xintec.
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