Table of Contents
Scope of the report & definition
- Wafer scale packaging, wafer level packaging and wafer-level chip scale
packaging
- Scope of the report
- Application main sectors of WLP
Executive Summary
Technologies
- Market drivers and comparisons with other package platforms
- Limitations and challenges: reliability and pad limitation issues
- Mother PCB IO pitch reduction rate: 0.5mm versus 0.4mm
- Key WLP technologies
- Equipments and materials
- Embedded die technologies
- Technology roadmaps
Applications
- Present and future applications of WLP
- WLCSP for ICs in handsets
- WLCSP for ICs in medical, automotive and space applications
- WLP of CMOS image sensors
- WLP of MEMS devices
Market forecasts
- WLCSP and WLP market value and 2008-2013 forecasts
- WLCSP and WLP unit 2008 volumes and 2008-2013 forecasts by application
main sector and by application segment
- WLCSP and WLP 2008 wafer volumes and 2008-2013 forecasts For 6-inch,
8-inch and 12-inch wafers
- Materials for WLP market forecasts
Cost of WLCSP
- Cost benefits and drawbacks of WLP and WLCSP
- Estimated outsourced WLCSP assembly wafer prices for 6-inch, 8-inch and
12-inch wafers
- Cost comparisons with competing package platforms
- WLCSP Cost roadmap
Supply Chain
- Players and geographical locations
- Respective market shares of contract WLCSP assemblers
- Ratio contract versus in-house WLCSP assembly by wafer size
- Supply chain perspectives
Conclusion
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