Abstract
OBJECTIVES OF THE REPORT
The market is a high-growth field in the semiconductor industry. The supply
chain is filled with various players from LED die manufacturers (Epistar,
Forepi,...), to LED assembly suppliers (Harvatek, Citizen, Liteon,
Samsung,....) to fully integrated players (Lumileds, Osram, Toyoda Gosei...)
In the wide range of LED packaging solutions, this report describes the
existing packaging process flow, materials and equipment and the main
evolution in the coming years.
LED devices have been split in 2 categories:
Regular LED High Brightness, Ultra High Brightness LED
The main processes are presented for both groups:
- Dicing
- Die bonding
- Electrical interconnect
- Thermal management
- Encapsulation
The report highlights the main technical challenges, current solutions and
future trends.
This report also includes market analysis on equipment, materials and services.
MAIN CHALLENGES
For the 2 types of LED, assembly approach is not the same.
- Regular LED packaging process flow is based on standard IC process and
almost the same standard material. The main reason is cost because regular LED
are low cost products (< $0.10)
- As a future lighting source, HB/UHB LED packaging should have good optical
properties, high thermal dissipation and high reliability. The better product
is a right combination between optical, thermal and reliability.
It is possible today to make that perfect product, but the cost would be so
high that it will not be successful. A choice has to be made for each
application: for example, optical efficiency for LCD backlighting and thermal
management for automotive lighting.
Today LED packaging has a law:
ONE PROCESS, ONE PRODUCT, ONE APPLICATION
Unlike regular LED, no standards currently exist for packaging of HB-LED. Each
LED vendor has their own proprietary design for most aspects of the assembly
process flow.
Cost is the primary driver and cheaper solutions with the best optical or
thermal properties are under investigation. Main goals are the reduction of
the number parts, use of less expensive material,..... A major issue today is
that the LED manufacturing process is made on 2 or 3 inches wafers that create
handling issues on equipment. We believe that the move to 4 then 6 or 8 inch
wafers will allow more standardized solutions using regular processes and
equipment.
In particular there is a big trend for Wafer Level Packaging of silicon LED
modules which aims at pushing LED to the general lighting market.
KEY FEATURES OF THE REPORT
- Detailed process flow of LED packaging (dicing step, electrical
interconnect, substrates,....)
- Market trends and figures for linked material and equipment (in million $,
in number of units, ASP,.....)
- Key drivers for each technology & material in use
- Supply chain analysis: who is doing what?
COMPANY INDEX
3M, ACC silicones, Accretech, ADT, AiT, Allvia, ALSI, ALSI, Applied NanoWorks,
ASMPT, Asymtek, Avago, Bergquist, Bosch, CeramTec, ChipMOS, C-Mac, CMD, Cofan,
PCB, Cookson, CREE, CTS, Daltec, Datacon, Disco, Doosan, Dow Corning, Dupont,
Dynatex, Electrovac curamik, Epcos, Epoxy Technology, EVG, Evident
Technologies, Friatec, GE, Hamamatsu, Heatron, Heraeus, Hesse & Knipps,
Hymite, Hysol, Indium Corp., Intematix, ipdia, Jenoptik, JPSA, KNS, Kulicke &
Soffa, Kyocera, LG Innotek, Lintec, Lord, Lumi Tech, Lumileds, Master Bond,
Micron, Murata, Natel, New Wave Research, Nitto-Denko, NTK, Nusil, Oerlikon,
Optek, Osram, Oxford lasers, Palomar Technology, Panasonic, PhosphorTech,
Rexpan, Semitool, Shin Etsu, Shinko, SMM, Spectrum Plastics, STM, SUSS
MicroTec, Synova, TDK, TEL, Thermagon, Ticona, TMT, Tong Hsing, Toshiba,
Toyoda Gosei, Tridonic, Trumpf, TSMC, Veeco, VisEra, Xsil, Zevac.
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