HB LED & LED PACKAGING '09: Process, equipment and materials Technology and market trends

Table of Contents

Content

Introduction

Executive summary

Acronyms & definitions

LED market status

• Market segmentation
• Market Volume
• Market Revenue
• General Lighting
• GaN-based White LEDs
• Wafer Needs for General Lighting

LED Performance

• Lumens. Depending on Applications
• Internal Quantum Efficiency
• Evolution Under High Current
• Output Heat
• Overall Performances
• Expected Performances for White LED

LED Packaging Status

• Introduction
• Package families
• Assembly Process Flow
  • Definitions
  • Description
  • System Integration
  • Challenges
  • Value Chain
  • Evolution
  • Trends
• Technology Roadmap

Packaging of Regular LED

• Flow Chart for Regular LED
  • Main steps and materials
  • Standard Assembly Flow
  • Through Hole Devices
  • Surface Mount Devices
  • Market Metrics - Packaged LED Market Volume
• DICING
  • Location of Dicing Process
  • Saw Dicing
  • Laser Dicing
  • Saw VS Laser
  • Supply Chain
  • Market Volume for Sapphire Wafers
  • Market Revenue for Dicing Services
  • Market of equipments in number of units
  • Market in $M
• DIE BONDING
  • Location of the process
  • The Basics
  • Dispensing equipment from Asymtek
  • Material for LED
  • Main players
  • Market Volume for Die Attach Material
  • Market Revenue for Die Attach Material
  • Market of equipments in number of units
  • Market of equipments in $M
• INTERCONNECT
  • Location of the process
  • Overview of wire bonding
  • Electrical connection : the basics
  • Wire Bonding Processes
  • Ball bonding VS Wedge bonding
  • Ribbon bond VS wire bond
  • Main players
  • Market revenue - Assumptions
  • Market revenue for gold wire bonding
• ENCAPSULATION, LENS & PHOSPHOR
  • Location of the process
  • Encapsulation method for LED lamp
  • Casting process for encapsulation
  • Encapsulation for SMD
  • Compression molding process
  • Materials for encapsulation
  • Market estimation of molding compound
  • How does LED generate white light?
  • Phosphor chemistry
  • Phosphor placement in white LED
  • Main phosphor technologies in use
  • Main phosphor suppliers
  • Optics
  • Main players
  • Market revenue for phosphor material
• CONCLUSIONS

PACKAGING OF HB/UBH LED

• Introduction
• What package for what LED?
• Package type
• Evolution of the packaging
• Impact of the heat
• HB/UHB LED packaging function
• Different levels of packaging
• Considerations of HB LED design
• Materials challenges and solutions
• Market Metrics - Packaged LED Market Volume
• SCRIBING AND DICING
  • Location of the process
  • Scribing & Dicing: Definition
  • Techniques, Throughputs and Costs
  • Number of dice / wafer
  • Laser Scribing & Dicing
  • Diamond Scribing & Dicing
  • Example of JPSA Scribing & Dicing tool
  • Example of NWR Scribing & Dicing tool
  • Laser Microjet Technology from Synova
  • Example of Synova Scribing & Dicing tool
  • Example of Oxford Lasers Scribing & Dicing tool
  • Example of ALSI Lasers Dicing tool
  • Stealth Dicing Technology
  • Stealth Dicing Roadmap
  • Example of Stealth Laser Dicing tool
  • Example of Jenoptik-Votan dicing tool
  • Market Data - Assumptions
  • Laser vs saw
  • Market Revenue for HB/UHB LEDs
  • Market of equipment in number of units
  • Market revenue of equipments in $M
• DIE BONDING
  • Location of the process
  • Choosing die attach material
  • New material for HB/UHB LED - AuSn
  • AuSn - Strength and weakness of deposition methods
  • Summary
  • Market Volume for Die Attach Material
  • Market Revenue for Die Attach Material
  • Market in number of die bonding equipment
  • Die bonding equipment - market in $M
• INTERCONNECT
  • Location of the process
  • What' s new?
  • Evolution in wirebonding
  • Matrix LED - features
  • Flip Chip Technology
  • Wirebond VS Flip Chip
  • Flip-chip coupled with back-face contact reflector
  • Stud Bumping
  • Example of Lumileds Luxeon K2
  • Laser Lift-Off (LLO) & Flip-Chip
  • Laser Lift Off Technique: definition
  • Laser Lift Off Technique: OSRAM
  • LLO equipment
  • LLO technique & Flip-chip mounting
• TEMPORARY BONDING
  • introduction
  • Thin-wafer handling: different solutions
  • principle
  • Main methods: a comparison
  • wax
  • adhesive tapes
  • EVG temporary bonding tools
• THERMAL MANAGEMENT
  • Location of the process
  • Thermal Solutions
  • Thermal solutions - Managing the LED Thermal System Configuration
  • Substrates
  • Substrates - SMD organic
  • Substrates - Metal Core Printed Circuit Board
  • Substrates - FR4 Board & Flexible Substrate
  • Substrates - Ceramic Substrates
  • Substrates - Direct Bonded Copper
  • Substrates - Trends for DBC
  • Substrates - Summary
  • Substrates - Trends : Chip On Board
  • Substrates - Main Players
  • Substrates - Market Data
  • Substrates - Market Volumes
  • Substrates - Market Revenue
  • HB LED submount - Market Breakdown
  • HB LED submount - Supply Chain
  • Thermal Interface Material
  • Thermal Interface Material - Main Players
  • Heatsink
  • Heatsink - Main Players
  • Summary - LED Package with optimized heat transfer
• ENCAPSULATION, LENS & PHOSPHOR
  • Location of the process
  • Optical extraction techniques
  • Remote phosphor
  • Silicon Product - Shin Etsu
• WAFER LEVEL PACKAGING
  • Main challenges for Power LED WLSP
  • Market drivers - Power LED Packaging
  • Power LED Packaging Manufacturer Motivations & Segmentation
  • 3D-TSV developments for Power LEDs
  • Overview of power LED packaging types
  • Drivers for LED silicon packaging solutions
  • Supply chain focus on ESD protection using Si submounts for HB LEDs
  • Hymite: Silicon HB-LED packages
  • Silicon interposer for MEMS / LED Applications
  • 3-D interposer to combine MOSFET + ASIC LED driver
  • WLP : VisEra technologies
  • Estimation of 6" Silicon wafer demand for LED submount and WLP
  • Conclusion & challenges