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Market Research Report

HB LED & LED PACKAGING '09: Process, equipment and materials Technology and market trends

Published by Yole Developpement Contact us : +1-860-674-8796
Published 2009/12 Content info 250 slides
Product code 102042
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Description TOC

Table of Contents

Content

Introduction

Executive summary

Acronyms & definitions

LED market status

  • Market segmentation
  • Market Volume
  • Market Revenue
  • General Lighting
  • GaN-based White LEDs
  • Wafer Needs for General Lighting

LED Performance

  • Lumens. Depending on Applications
  • Internal Quantum Efficiency
  • Evolution Under High Current
  • Output Heat
  • Overall Performances
  • Expected Performances for White LED

LED Packaging Status

  • Introduction
  • Package families
  • Assembly Process Flow
    • Definitions
    • Description
    • System Integration
    • Challenges
    • Value Chain
    • Evolution
    • Trends
  • Technology Roadmap

Packaging of Regular LED

  • Flow Chart for Regular LED
    • Main steps and materials
    • Standard Assembly Flow
    • Through Hole Devices
    • Surface Mount Devices
    • Market Metrics - Packaged LED Market Volume
  • DICING
    • Location of Dicing Process
    • Saw Dicing
    • Laser Dicing
    • Saw VS Laser
    • Supply Chain
    • Market Volume for Sapphire Wafers
    • Market Revenue for Dicing Services
    • Market of equipments in number of units
    • Market in $M
  • DIE BONDING
    • Location of the process
    • The Basics
    • Dispensing equipment from Asymtek
    • Material for LED
    • Main players
    • Market Volume for Die Attach Material
    • Market Revenue for Die Attach Material
    • Market of equipments in number of units
    • Market of equipments in $M
  • INTERCONNECT
    • Location of the process
    • Overview of wire bonding
    • Electrical connection : the basics
    • Wire Bonding Processes
    • Ball bonding VS Wedge bonding
    • Ribbon bond VS wire bond
    • Main players
    • Market revenue - Assumptions
    • Market revenue for gold wire bonding
  • ENCAPSULATION, LENS & PHOSPHOR
    • Location of the process
    • Encapsulation method for LED lamp
    • Casting process for encapsulation
    • Encapsulation for SMD
    • Compression molding process
    • Materials for encapsulation
    • Market estimation of molding compound
    • How does LED generate white light?
    • Phosphor chemistry
    • Phosphor placement in white LED
    • Main phosphor technologies in use
    • Main phosphor suppliers
    • Optics
    • Main players
    • Market revenue for phosphor material
  • CONCLUSIONS

PACKAGING OF HB/UBH LED

  • Introduction
  • What package for what LED?
  • Package type
  • Evolution of the packaging
  • Impact of the heat
  • HB/UHB LED packaging function
  • Different levels of packaging
  • Considerations of HB LED design
  • Materials challenges and solutions
  • Market Metrics - Packaged LED Market Volume
  • SCRIBING AND DICING
    • Location of the process
    • Scribing & Dicing: Definition
    • Techniques, Throughputs and Costs
    • Number of dice / wafer
    • Laser Scribing & Dicing
    • Diamond Scribing & Dicing
    • Example of JPSA Scribing & Dicing tool
    • Example of NWR Scribing & Dicing tool
    • Laser Microjet Technology from Synova
    • Example of Synova Scribing & Dicing tool
    • Example of Oxford Lasers Scribing & Dicing tool
    • Example of ALSI Lasers Dicing tool
    • Stealth Dicing Technology
    • Stealth Dicing Roadmap
    • Example of Stealth Laser Dicing tool
    • Example of Jenoptik-Votan dicing tool
    • Market Data - Assumptions
    • Laser vs saw
    • Market Revenue for HB/UHB LEDs
    • Market of equipment in number of units
    • Market revenue of equipments in $M
  • DIE BONDING
    • Location of the process
    • Choosing die attach material
    • New material for HB/UHB LED - AuSn
    • AuSn - Strength and weakness of deposition methods
    • Summary
    • Market Volume for Die Attach Material
    • Market Revenue for Die Attach Material
    • Market in number of die bonding equipment
    • Die bonding equipment - market in $M
  • INTERCONNECT
    • Location of the process
    • What' s new?
    • Evolution in wirebonding
    • Matrix LED - features
    • Flip Chip Technology
    • Wirebond VS Flip Chip
    • Flip-chip coupled with back-face contact reflector
    • Stud Bumping
    • Example of Lumileds Luxeon K2
    • Laser Lift-Off (LLO) & Flip-Chip
    • Laser Lift Off Technique: definition
    • Laser Lift Off Technique: OSRAM
    • LLO equipment
    • LLO technique & Flip-chip mounting
  • TEMPORARY BONDING
    • introduction
    • Thin-wafer handling: different solutions
    • principle
    • Main methods: a comparison
    • wax
    • adhesive tapes
    • EVG temporary bonding tools
  • THERMAL MANAGEMENT
    • Location of the process
    • Thermal Solutions
    • Thermal solutions - Managing the LED Thermal System Configuration
    • Substrates
    • Substrates - SMD organic
    • Substrates - Metal Core Printed Circuit Board
    • Substrates - FR4 Board & Flexible Substrate
    • Substrates - Ceramic Substrates
    • Substrates - Direct Bonded Copper
    • Substrates - Trends for DBC
    • Substrates - Summary
    • Substrates - Trends : Chip On Board
    • Substrates - Main Players
    • Substrates - Market Data
    • Substrates - Market Volumes
    • Substrates - Market Revenue
    • HB LED submount - Market Breakdown
    • HB LED submount - Supply Chain
    • Thermal Interface Material
    • Thermal Interface Material - Main Players
    • Heatsink
    • Heatsink - Main Players
    • Summary - LED Package with optimized heat transfer
  • ENCAPSULATION, LENS & PHOSPHOR
    • Location of the process
    • Optical extraction techniques
    • Remote phosphor
    • Silicon Product - Shin Etsu
  • WAFER LEVEL PACKAGING
    • Main challenges for Power LED WLSP
    • Market drivers - Power LED Packaging
    • Power LED Packaging Manufacturer Motivations & Segmentation
    • 3D-TSV developments for Power LEDs
    • Overview of power LED packaging types
    • Drivers for LED silicon packaging solutions
    • Supply chain focus on ESD protection using Si submounts for HB LEDs
    • Hymite: Silicon HB-LED packages
    • Silicon interposer for MEMS / LED Applications
    • 3-D interposer to combine MOSFET + ASIC LED driver
    • WLP : VisEra technologies
    • Estimation of 6" Silicon wafer demand for LED submount and WLP
    • Conclusion & challenges
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