IC EUROPE: European Database of Integrated Circuit, Packaging, MEMS, R&D & Power Devices Players and Market Study

Abstract

Europe accounts for more than 280 production and research fabs active in one or more of the investigated technology fields.

In this report details are given about the specific facilities:

• ICs
• MEMS
• Packaging
• Power Devices
• R&D institutes
• Compound Semiconductors

Product objectives

The objectives of “IC Europe” are:

• To understand, based on facts, the complex and diverse collection of semiconductor equipment and material suppliers' customers.
• To create a tool for the equipment and material suppliers and others to assess business opportunities in the European market
• To enable suppliers of semiconductor industry to detect new opportunities in the European Semiconductor market.

Product overview

This comprehensive report details fab locations, contacts, products, technologies, manufacturing facilities, and financial information. The covered geographical area includes 48 countries such as the European Union, Eastern European countries, Turkey, Morocco, Israel, and Russia.

Key Product Features

The database includes:

• ICs (Memory, Logic, Analog and mixed signal, ASICs, Other IC devices)
• MEMS (Ink jet head; Sensors: pressure, inertial, IR Image, specific chemicals & gasses; optical MEMS; RF MEMS; other MEMS devices)
• Compound Semiconductors (GaAs, SiC, GaN, InP based devices)
• Power devices
• Packaging (Discrete packaging, Zero and first-level packaging, Wafer Level Packaging, other packaging techniques such as 3D)
• Major R&D labs

The report includes:

• Executive summary
• Statistical analysis of the breakdown of corporate and manufacturing sites by size, geography, technology, and products
• Trends analysis for products and manufacturing
• Summary of key points that includes key concerns and initiatives related to the development, purchase and use of equipment and materials.

The accompanying database includes detail for the manufacturing sites*:

• Name of the company, including Website
• Size (number of employees, sales figures for 2005)
• General activities (applications, devices and markets)
• Addresses of the different manufacturing sites in Europe
• Per manufacturing site:
  • Technology(s) implemented
  • Capacity (wafer starts per week)
  • Capacity forecast
  • Size and type of the clean room
• Full coordinates of contact point (name, title, email and/or telephone, location)

Why buy this report

• By acquiring this new report and database, you will have an access to a fully detailed list of European fabs of Integrated Circuit, Packaging, MEMS Power Devices, and R&D centres.
• The Database is a really helpful tool to classify, extract and choose company name and related information.
• The accompanying report will help you to get a better understanding of the European fab market and trends: global sales, products and technology breakdown, future fab opening, 300 mm based wafer fab.

Who should buy this report

• The report & database is of great interest for equipment and material suppliers in order to prepare marketing approach, to forecast opening and expansion fab and to contact the right person within an organisation.
• Report and database are also useful for devices manufacturer to look at production and foundry partners or packaging services companies.

Companies described in the database

3DPlus, ABB Semiconductor, ACREO, AEMtec, Alcatel Alenia Space Italia, AMD, Analog Devices Inc, Atmel, AMS, Boehringer Ingelheim, Bookham Technology Ltd., Colibrys, COM, CSEM, Cube Optics, DALSA Nederland B.V., Dynex Semiconductor, ELMO Semi-conductors, Fraunhofer, Freescale Semiconductor Inc., GE Infrasctructure Sensing, Hymite, IMEC, Infineon Technologies AG, LETI, Microtech, NEC Semiconductors, Olivetti I Jet, Osram Opto Semiconductors GmbH&Co, Philips Semiconductors, Qinetiq, Robert Bosch, Sensitec, Sensonor, Silex Microsystems, STMicroelectronics...