IC EUROPE: European Database of Integrated Circuit, Packaging, MEMS, R&D & Power Devices Players and Market Study

Table of Contents

• Executive summary
• General trends for the micro-electronics industry: market and technologies worldwide and in Europe
  • Semiconductor devices
  • Power devices
  • MEMS/MST
  • Compound semiconductor devices
  • Packaging
  • R&D
• Statistical analysis for European fabs
  • Manufacturing locations
  • Technologies
  • Products
  • Wafer size
  • Capacity planning and future needs/investments
• Conclusions

Executive summary

Analysis of European fabshas shown that:

• There are 281 production fabsin Europe for ICs, MEMS, power devices, compound semiconductors and packaging. 34 have 2 or more activities (ICs and MEMS, ICs and power devices ...)
• For ICs:
  • Europe accounts for 12% of worldwide 8' ' eq. wspw
  • STM and Infineon are among the TOP 10 worldwide SC companies sales
  • Germany, France and UK have more than 50% of the total number ofIC fabsin Europe
• For power devices:
  • Europe accounts for less than 30% of the world production
  • The fabsare evenly distributed through Europe. UK has the highest number of fabs(6 out of 31 fabsin total)
  • STM ranks as the 5th worldwide player in power device sales
• For MEMS:
  • Europe accounts for 16% of worldwide sales
  • Germany has the highest number of MEMS fabs(25 out of 67 fabsin total)
  • STM and Bosch are respectively 3rd and 4th MEMS players in revenue
• For packaging:
  • There are 50 fabsin Europe
  • There is no large OSAT player in Europe (most of them are in Asia)
• For compound semiconductors:
  • For compound semiconductors, the activity is mainly localized inWestern Europe and Israel (29 fabsin total).
  • There are two large players involved in LEDs: Osramand Philips/Lumileds(but no facility in Europe for the latter)
• For R&D:
  • There are 27 large R&D public institutes
  • Europe has three world-class semiconductor R&D centresof semiconductor excellence: IMEC, Letiand Fraunhofer
  • In 2005, R&D spending by European IC companies stands at:
    • STM: $6.4B (17% of sales)
    • Infineon: $6.3B (19% of sales)
• There are seven 12”wafer fabsin Europe and 11 sub-90 nm fabs(including one 45 nm Intel fabin Leixlip, Ireland)
• For ICs, most of the production is done on 8”wafers:
  • MPUs, DRAMsand Flash are processed on 8”and 12”wafers→ 60% of MPUs, DRAMsand Flash are processed on 8”
  • For MEMS and Power Devices, most of the production is done on 4”and 6”wafers (no 8”wafer line in production today for MEMS in Europe)
• ICs represent 74% of total wspm(231 Fabsrepresent a total of 2.04 million of wspm).
• European fabsrepresent a total area of 682,442 m2(corrected data, taking into account combined activities).
  • IC represent almost 75% of the total clean room surface
• Europe employs about 65,000 people related to fabmanufacturing activity.
  • IC manufacturing is the major employer with about 51% of total European fabemployment.
• CMOS, biCMOSand bipolar are the most used technologies.