Abstract
The report provides more than 300 slides "ready to use" for your own business.
IDMs and OSATs players have been investigated. For each profile, you will have
access to the following features:
- Company overview:
- Financial highlights
- Company products and markets
- Strategic alliances & partnerships
- Mapping of the R&D labs and main manufacturing fabs locations: Key R&D,
Front-end, Back-end, and Assembly site activities have been identified
- Key contacts developing the TSV technology
- Summary of the 3D IC technologies developed
- Latest announcements
- Product Roadmaps
Product objectives
A unique tool for equipment & material suppliers to develop their business
worldwide with the key players of the 3D IC industrial value chain. A complete
company profiles report to enable suppliers of semiconductor industry to
detect new opportunities on the 3D Packaging semiconductor market.
Product overview
This unique report & database will provide you a global picture of what is
happening today in the 3D IC world: gain access quickly to the profiles of the
Top 50 key players developing the TSV "Through Silicon Via" technology,
including locations (R&D labs, cutting edge pilot lines and manufacturing
plants), key business & technical contacts, product roadmaps, 3D processes
developed, strategic alliances & partnerships. The covered geographical areas
includes North America, Europe and Asia.
Key features
Whiling to develop your business and learn more about the key 3D IC players?
Our report and database are 2 unique tools to answer your questions:
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