Thick SOI 2008

Table of Contents

Executive summary

Thick SOI market analysis

• - Thick SOI application fields
• - Thick SOI definitions
• - Market for MEMS: 2006-2012 thick SOI wafers volume split by MEMS devices
• - Market for Power Devices: 2006-2012 thick SOI wafers volume
• - 2006-2012 total wafers volume (6" equiv. units)
• - 2006-2012 value in M$ (MEMS & Power Devices)
• -- 2007 Top25 thick-SOI wafers company consumption. Estimation in 6" wafer units MEMS & Power Device Markets
• - Bonded-SOI vs. Epi-SOI
• - Geographical breakdown for thick-SOI usage in 2007
• - Thick-SOI: Main technical trends. Top Si layer & BOX thickness

Thick SOI wafer suppliers

• - Thick-SOI 2007 estimated production
• - Estimation of 2007 6" equiv. thick-SOI wafers production per company in units
• - 2007 thick-SOI vendor revenues. Breakdown by region
• - Short company profiles:
  • Icemos Technology
  • Covalent Materials
  • Isonics Semiconductor
  • Simgui
  • SEH: Shin Etsu Hendotai
  • SOITEC - TRACIT
  • Okmetic
  • MEMS Engineering
  • Ultrasil Corporation

2006-2012 MEMS Market

• - Micromachining approaches in MEMS
• -SOI-MEMS micromachining
• - Use of different materials in the MEMS field
• - 2006-2012 MEMS market value (M$)
• - 2006-2012 MEMS market value split by application
• - MEMS CAGR ranking by products
• - MEMS market forecast: comments
• - 2007 MEMS manufacturer TOP 30 revenues
• - 2008 TOP 30 MEMS players: comments
• - MEMS substrates size evolution. Si and SOI
• - SOI use in selected MEMS Companies
  • Vacuum cavities on SOI wafers for MEMS & IC integration
  • 3D integration of MEMS: DALSA Semiconductor
  • RF MEMS Players. Teledyne Scientific & Imaging LLC
  • Tunable Capacitors
  • Silicon Microphone Players. Auxitrol
  • Silicon Microphone Players. Pixtronix (Analog Devices foundry)

2006-2012 Power Device market

• - Power Devices definition
• - Power Devices segmentation
• - Main applications of power devices
• - Si Power Devices Capabilities. Where SOI can be used?
• - Power Devices Technical Challenges
• - Most targeted applications by devices type
• - 2006-2012: The global power devices market: IPM will represent more than 50% by 2008
• - Revenues breakdown per application
• - Comparison with mainstream SC market: in 2007, Power Devices was accounting for ~9%
• - Focus on discretes market: 2005->2007: IGBTs are pushing in
• - Focus on IPM: Voltage regulators are leading the market
• - 2007 Top-20 company main products (discretes and power modules)
• - 2005-2012 wafers consumption (6" equiv. wafer units)
• - Power Devices: Definitions
• - What kind of devices is SOI targeting?
• - What kind of applications is SOI targeting?
• - Use of SOI in Power devices IPM Deep Trench Isolation (DTI)
• - What kind of components is targeting SOI
• - The Membrane Power Device
• - What kind of components is targeting SOI
• - Example of DENSO Research Center
• - SOI competing technologies
• - Who' s using thick SOI for power devices ?
• - Example of thick-SOI application: Plasma Display Panel (PDP) driver IC
• - Plasma Display Panel (PDP) driver IC. 2005-2012 market data (units & value)
• - Example of thick-SOI applications: PDP scan drivers Positioning of SOI technologies in display drivers
• - Example of PDP scan drivers: NEC PDP scan drivers roadmap: 192 then 256 outputs
• -- Conclusions for Power Devices

Recent news in Power Devices and thick-SOI

• - Toshiba: High Voltage Three-Phase Motor Drivers with Built-In Power Management Circuits
• - ATMEL: 1st high voltage automotive load driver IC on SOI-BCD technologyy - On the feasibility of super junction thick-SOI power LDMOS transistors for RF base station applications
• - Philips A-BCD thick SOI technology
• - Toshiba SOI news
• - Infineon & ABB SOI news
  • ±600V ±2A TRIAC in S- ±600V ±2A TRIAC in SOI substrates for domestic applications (source Leti & STM)

Other markets: Image sensors & Photonics

• - Thick SOI in Back-Side Illumination imaging sensors
• - CMOS imagers: SOI process of OKI
• - Thick-SOI for waveguides technology
• - IBM: Si photonics scaling in microelectronic applications
• - SOI in Photonics applications

Conclusions:

• - Summary for Thick-SOI needs

Thick-SOI usage details per company: Products, wafer size, SOI wafer specification, supplier information, others...

• - Analog Devices, APM, Denso, E2V, Freescale, Honeywell, Matsushita, OKI Electric, STM Catania, STM Tours, TMT, TSMC, Atotech, Dalsa Semiconductor, Fraunhofer IZM, Freescale Sendai, IMT, Micralyne, Pirelli, Siimpel, Silex Microsystems, Texas Instrument, VTT, X-Fab, Fraunhofer IPMS, Chemnitz Univ.