Memory Applications, Packaging & Integration Trends 2009

Table of Contents

Introduction to memory technologies 1

• DRAM / SRAM / NOR Flash / NAND Flash
  • 2008 overall memory shipment market (in Units)
  • 2008 overall memory market revenues (in $B)
• Trends for next generation Non-Volatile memory technologies:
  • M-RAM / PC-RAM: status of industrialization and near-term opportunities

Memory Applications & Markets .. 18

• Current & future applications driving DRAM / SRAM / NAND / NOR Flash memory demand
  • Per industry:
    • 2008 Market forecasts in Munits shipment and in 300mm wafers equivalent
    • Breakdown for Telecom / Computing / Consumer / Servers / Automotive / Industrial & Medical markets
  • Per product / application:
    • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
    • Breakdown for Desktop PCs / Notebooks / Net books / MID / Regular & Blade Servers / Data storage servers / Portable media players / Portable game stations / Memory Cards / USB Stick / Cell-phones / Game stations / Set-Top Box / HD camcorders / DSC / SLR / Automotive / Base stations / Portable navigation Sys  GPS / Digital TV / Workstations / Memory Upgrades / HDD / Printer / Analog TV / DVD Player / HPC / ATE systems

Memory Packaging & Integration Trends 33

• Architectures and memory die quantity analysis in current product generation:
  • Focus on Cell-phones, SSDs, DSCs, servers, Portable media players and game stations
• Single Die versus Stacked packaging:
  • 2008-2015 Key market metrics and trends for memory - integration using TSO P / FBGA / PoP / PiP / WLP Fan-in / Fan-out WLP packages / Silicon interposers

Impact of 3-D integrations on the memory market 55

• Applications and market drivers for 3D integration with memories
• �gEmbedded 3D-SOC memories�h Versus �g3-D Stacked memories in SiP�h:
• Definitions, players and roadmaps
  • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
  • "3D Chip Stacking" Vs. "Circuit Transfer 3D" Vs. "Monolithic 3D" integration
  • Definitions, players and roadmaps
  • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
• Impact of MLC versus SLC Flash memory architecture on adoption of 3-D TSV memories
  • Definitions, players and roadmaps
  • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
• Silicon interposers for 3D TSV memories:
  • Definitions, players and roadmaps
  • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
• TSV manufacturing cost challenge:
  • What is the process and cost of TSV in memories today?
  • What is the targeted cost for a broad adoption of 3-D TSV into low cost memory markets?
• Overall Roadmap for 3-D integration with Memories (2008  2015)
• Impact of 3-D integration on DRAM / SRAM / NAND / NOR Flash memory markets
  • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
  • Breakdown per mount technology: forecast for Single die / Wire Bond stacked / 3-D TSV memory
  • Breakdown per application:

• Opportunities of 3-D integrated memory in DDR3 / DDR4 / Wireless Application processors / Wireless Baseband - DSP / SSDs / Graphic memory / Micro-Cards / Embedded & Cache CPU-GPU / FPGAs

Player' s strategy for 3-D integration with memories �c 85

• Supply chain analysis: Memory fabs / CMOS foundries / / OSAT packaging houses / IDMs / Fab-less / Integrator player activities
• Infrastructure & pre-competitive alliances in 3-D IC system integration

Perspectives & Conclusions 98

Annexes 104