Reverse costing & engineering process analysis of Texas Instruments DLP

Table of Contents

Executive Summary p2

Reverse Costing methodology p6

Physical Analysis p7

• Physical Analysis Methodology
• Digital Micromirror Device
• Package
• Optical Apertures
• Ceramic substrate
• Micromirrors - Pictures
• ASIC Process Characteristics
• Functional Blocks Areas
• Synthesis Part 1

Manufacturing Process p20

• Front End Process Flow
• Back End Process Flow
• Wafer Fabrication Unit
• Synthesis Part 2

Manufacturing Cost p26

• Wafer Cost Data
• Main Steps of Economic Analysis
• ASIC Wafer Cost
• Front End MEMS Wafer Costs
  • Breakdown per Process Steps
  • Breakdown per Equipment
  • Breakdown per Consumables
• Probe Test Cost
• Windows and Walls Costs
• Back End Wafer Cost
  • Breakdown per Process Steps
  • Breakdown per Equipment
  • Breakdown per Consumables
• Total Wafer Cost
• DMD Silicon Cost
• Packaging Cost
• Final Test Cost
• Component Manufacturing Cost
• Synthesis part 3

Average Selling Price p53

• Definitions of Prices
• Manufacturing Price
• ASP Evolution by Quantity Order

Conclusion p56

Glossary p57