IPD - Report 2009 Technologies, Applications, Markets & Players

Table of Contents

1. INTRODUCTION, DEFINITIONS & SCORE OF THE REPORT

• Overview of discrete versus integrated passives solutions
• Integrated active and passive, structures definitions (inductor, capacitor; resistors, diodes, combinations...)
• Comparison between thin film/thick film IPD technologies (including ceramic LTCC)

2. THIN FILM IPD APPLICATIONS AND MARKET DRIVERS

• IPD categories (ESD/EMI protection IPD, high brightness LED silicon submount, RF IPD, Digital & Mixed Signal IPD)
• IPD current and future applications
• IPD benefits and market drivers description for each IPD category and application

3. THIN FILM IPD MARKET STATUS AND 2008-2015 FORECASTS

• IPD market forecasts are provided both in M$, Munits and in wafer eg. with attached growth rates
  • Volume shipments for IPD per applications (cell-phone, mp3 players, medical, sutomotive...)
  • IPD shipments per category (ESD/EMI protection, LED silicon submount, RF IPDs, Digital & Mixed signal IPDs)
  • Specific applicative breakdown and forecasted evolution for each category
  • IPD shipments per substrate type (Silicon, Glass, GaAs, SOI...) and wafer size (4"/6"/8"/12")
  • IPD shipments per packaging platform (WLP, Wire bond, Flip-chip, Embedded, Silicon submount, 3D TSV interposer, Fan-Out plastic laminate...)
• IPD player market shares and revenues
  • "Top 15" IPD players 2008 revenues
  • Overall players market shares based on 2008 IPD revenues
    • Specific market share breakdown for ESD/EMI protection IPD applications
  • Specific market share breakdown for RF IPD applications

4. THIN FILM IPD TECHNOLOGIES

• IPD components requirements and technology options
  • Performance and integration capabilities
    • Inductors (multilayer planar inductors, 3D inductors...)
    • Capacitors (planar versus trench geometries, SiO2 versus SiN versus BST versus PXZT capacitors...)
    • Others structures (resistors, diodes...)
• IPD Manufacturing challenges and related equipment & material tool-box
  • Substrate choice technology comparisons: high resistivity Silicon / Glass / SOI / GaAs / Plastic laminate
  • Dielectric layers options (low k / high k)
    • Available photoresists, oxide and other layer solutions, impact of layer thickness
  • Metallic layers formation (A, Copper, Gold...)
    • Process options (line width, multiple layer IPDs, lithographic versus non lithographic patterning, advanced depositions...)
• IPD Design, Simulation and predictability through system level co-design

5. THIN FILM IPD ARCHITECTURES, ASSEMBLY & PACKAGING

• Integration, packaging and assembly platforms options for IPDs
• through silicon Via manufacturing: a necessary step to reach the 3rd dimension
• Fan-Out Wafer level packaging and embedded die concepts
• Overall IPD Technology roadmap

6. THIN FILM IPD SUPPLY CHAIN & PLAYERS

• Geographical mapping of different players
• Business models analysis for IPD (specialty foundries, Integrated Device Manufactures, Turnkey packaging providers, module makers, fabless & end integrators)
• Summary of IPD players capabilities (manufacturing, design/ library, packaging & assembly...)
• Present and future challenges ahead for successful commercialization of IPDs

7. CONCLUSIONS & PERSPECTIVES