INTRODUCTION
Polishing and planarization are related in that polishing improves the flatness (planarity), smoothness and optical properties of a surface.
Planarization, however, is a much more critical process. Integrated circuit (IC) manufacturers must planarize each surface layer of an in-process
wafer to make it level for the next application of microlithography.
Chemical mechanical planarization (CMP) is used during the semiconductor
manufacturing process to planarize individual layers in complex integrated circuits to customer-specific parameters. CMP is a critical technology in
the planarization of multilevel metallization systems and in shallow trench isolations (STIs) in semiconductor manufacturing. The rapid emergence of
copper and low-k dielectrics as interconnect structures for integrated circuits has further pushed CMP technology to the forefront of semiconductor
manufacturing.
CMP polishes a wafer with a moving pad containing an abrasive chemical slurry. The CMP equipment precisely regulates not only the
pad's position, motion and pressure, but also the chemical composition and size of particles in the slurry. Such equipment also increases the
precision of photolithography and reduces defects caused by metal residues.
STUDY GOALS AND OBJECTIVES
The technology of CMP is well
established in the back-end of IC manufacturing, where it was developed to remove variations (bumps) in metallization layers of multi-layer PCB. The
shift to smaller CDs and the adoption of new technologies such as low-k dielectric materials and copper interconnect has increased the specifications
and challenges for a smooth planar wafer surface. The result has been the rapid adoption of CMP in front-end wafer processing.
BCC had published a
series report on nanomaterials and nanoceramics from 1994 and as late as 2003. These nanomaterials find applications in CMP, the market that was
estimated in these reports. BCC also published the first report on Equipment and Materials for Semiconductor Cleaning and Planarization in 2001. Since
then, several new developments have taken place, especially with the feature sizes in most advanced Ics decreasing to less than 0.15 microns, and CMP
has become an important operation for semiconductor manufacturing. Other applications are also emerging for CMP, in particular, in memory devices.
The
market for CMP equipment alone will reach almost $1 billion dollars in 2003. CMP slurry and CMP pad markets have also grown substantially in the last
five years. With new developments in the offing and continued secrecy on the part of those involved in this industry, BCC felt a need to thoroughly
analyze this industry, including the technology and markets, along technological and business issues, new developments and the trends in CMP
equipment, materials and applications.
The objectives of this report are as follows:
- Provide an in-depth analysis of CMP technology and its applications.
- Identify the technological and business issues related to the CMP technologies.
- Analyze the domestic and foreign competition among companies within each of the market segments.
- Determine the current size and future growth of the markets for CMP and post-CMP equipment, CMP slurries, CMP pads and pad conditioners, and
other CMP consumables.
- Identify and profile all worldwide producers of CMP and post-CMP equipment.
- Identify and profile all worldwide producers and suppliers of CMP slurries, CMP pads and pad conditioners as well as suppliers of nanoparticles
for CMP slurries.
- Identify major users of CMP equipment, slurries, pads and pad conditioners
- Analyze major new developments in the use of CMP.
- Identify technology change and its impact on CMP business.
CONTRIBUTION OF THE STUDY
BCC's technical/economic study covers CMP equipment, post-CMP equipment, CMP slurries, CMP pads, CMP pad
conditioners, filters for CMP process and other chemicals needed for CMP. The technology, materials and new developments have been analyzed. Current
size and future growth of the markets are estimated for the period 2002 to 2008. The report analyzes the competitive environment within each of the
markets for CMP equipment, slurries, pads and other accessories and consumables. This report discusses the technology trends in products and
applications so as to assist the suppliers of equipment and materials with their long-range planning. The report profiles all worldwide companies that
are involved in the CMP area.
FORMAT AND SCOPE
The report has been organized according to CMP and post-CMP equipment, CMP slurries, CMP
pads and pad conditioners, and other consumables used in the CMP process. Each section provides the technology, equipment or material types, new
developments, industry structure, company profiles, and market. Since the CMP industry is highly networked on a global scale, BCC has conducted this
analysis with global perspective.
An industry overview has been provided to condense all the detailed analyses of each segment. A technology review
has been conducted on polishing and planarization, CMP and types of CMP. Finally, all companies that are current users of CMP equipment, slurries and
other CMP consumables are profiled.
The qualitative and quantitative judgments embodied in this report are a valuable contribution to the current
knowledge of advanced ceramic powders and nano-sized ceramic powders, their processing techniques, applications and markets. Moreover, this study has
been conducted at a vital stage in the development of this growing industry, where decisions need to be made by a number of companies about their
strategies of involvement and expansion as well as whether or not to enter new areas of business.
METHODOLOGY AND INFORMATION SOURCES
The
findings of this report are based on information derived from interviews with almost all producers and suppliers of CMP and post-CMP equipment, CMP
slurries, CMP pads and other consumables. Industry experts in planarization were also contacted for this study. BCC also spoke to some researchers
conducting R&D in CMP process and slurries. In addition, many end users were contacted to evaluate the current and future demand for CMP
equipment, and CMP slurries and materials. In all, about 100 persons from over 60 companies and institutions were contacted for this study.
Secondary
data were obtained from trade publications, technical journals, CMP and nanomaterials conference proceedings, government statistics and the BCC, Inc.
Database.
WHO SHOULD SUBSCRIBE?
This report is directed to the various strata of companies that are interested in the developments in this
field such as the following:
- companies involved in the development, manufacturing and supplying of advanced materials
- manufacturers of semiconductor equipment
- manufacturers and suppliers of CMP and post-CMP equipment
- manufacturers and suppliers of CMP slurries and nanoparticles
- manufacturers and suppliers of CMP pads and pad conditioners
- semiconductor manufacturers
- manufacturers of hard disks, MEMS, flat panel displays and ferroelectric memories
- manufacturers of filters for CMP process
- chemical companies interested in diversification
- venture capital companies and financial institutions interested in new, attractive investments and acquisitions
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