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[Report]

Thick Film Devices, Processes and Applications

Published: 2004/05

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Table of Contents

STUDY GOALS AND OBJECTIVES

BCC, Inc.'s goal in conducting this study is to review the current status of the worldwide market for thick film devices, the different types of devices, and the processes by which they are fabricated. We will also assess the thick film industry's growth potential over a 5-year period from 2003 through 2008. We are particularly interested in evaluating the several fields of applications of thick film technology and investigating emerging applications, materials, and processes in each field and their market potential.

Our key objective is to present a comprehensive market analysis of the thick film industry at the present time and outline its future direction.

REASONS FOR DOING THIS STUDY

The thick film industry is quite broad. In fact, thick film technologies are used in several fields. Many types of electronic, mechanical, chemical and energy supply devices are currently fabricated using thick film deposition processes. The main reason for doing this study is to quantify the various types of devices from a market standpoint in order to define the most popular applications, understand which sectors are mature, and identify which sectors are indeed poised to grow.

There is also a need to evaluate the current status and future trends of the thick film industry from a worldwide standpoint. In fact, considering the ongoing globalization of markets and the moving of many manufacturing facilities abroad, it is also necessary to investigate the point of production of thick film devices and their distribution worldwide. Such an evaluation will contribute to a broader understanding of growth opportunities for the different types of devices and their applications within the U.S. and abroad.

Another important reason for performing this study is to provide an overview of the evolution of thick film technologies and processes and to illustrate the latest technological developments that can help companies find opportunities for process and productivity improvements.

CONTRIBUTION TO THE STUDY AND FOR WHOM

This study will be of primary interest to all companies directly involved in the fabrication and selling of thick film devices, process equipment, and raw materials. In particular, it will be of interest to manufacturers, such as those producing electronic components, sensors, displays and energy supply devices, screen printing or other ink deposition equipment, and manufacturers or distributors of polymers, solvents, ceramic materials and metals.

Overall, this study applies to industry segments such as the electronic, automotive, aircraft, instrumentation, medical and appliances industries, for which component miniaturization and light weight are becoming basic and essential properties.

The study is mainly directed to executives, directors, operations managers, sales and marketing managers, and strategic planners working within the above industries. Financial analysts, as well, can benefit from market analysis and growth trend data. Universities and research facilities may also find in this study opportunities for new or expanded R&D activities.

SCOPE AND FORMAT

This study covers the most important types of thick film devices within their fields of application (electronic, mechanical, chemical, display, and energy supply). BCC, Inc. analyzes each type of device, determines its current market status, examines its impact on future markets, and presents forecasts of growth over the next 5 years. Technological issues, including the latest trends, are discussed. Other influential factors such as cost of raw materials, technology limits, and the growth of thin film technology are also reviewed.

BCC, Inc. analyzes the industry on a worldwide basis, both from a manufacturing and consumption point of view. A description of the materials and processes utilized for the manufacturing of thick film devices is also supplied. We examine commercial and public research activities in major regions of the world. Research objectives and areas of interest for different types of thick film devices are also outlined.

METHODOLOGY

BCC, Inc.'s market analysis is essentially divided into four parts.

In the first part, a summary of the overall worldwide market is performed and revenues (sales data in M$) are presented for each main category of thick film devices with actual data referring to the years 2001, 2002 and estimated data for the year 2003. Forecasts for the period 2003 through 2008 are also supplied (in current US$).

In the second part, which is subdivided into several sections, the most common types of devices within each category are described together with their manufacturing process. Revenues by application for each device type are reported relative to the period 2001 through 2003 with forecasts until the year 2008. In addition, for each type of device, sales data are grouped by region (U.S., Europe, Asia Pacific and Rest of the World) based on destination of sales.

In the third part, the worldwide thick film industry structure is reviewed: a list of the major players is supplied, together with a comparison of manufacturing and consumption of thick film devices by region. In this section the profiles of the top 25 players are also included.

In the fourth and final part, an analysis of industry competitiveness is performed, with a description of all the major organizations involved worldwide in the promotion and development of thick film devices and processes. The study is completed by a review of patents awarded during the past year.

INFORMATION SOURCES

To perform this study BCC, Inc. analyzed 430 companies, all manufacturers of thick film devices. Distributors of thick film devices were not included in this study. Data for each company were obtained primarily by thoroughly analyzing SEC filings, Internet Web sites, annual reports, industry directories, industry magazines, government sources, and other public sources. In some cases, data were obtained directly by the manufacturers. In general, manufacturers that were contacted by BCC, Inc. were reluctant to participate in direct surveys and share data due to the pressures of a very competitive market that does not favor release of sensitive information.

Table of Contents

[Report]
Thick Film Devices, Processes and Applications
Published: 2004/05
Published by : BCC Research BCC Research

Price:
US $ 4,150.00 Hard Copy
US $ 4,773.00 PDF by E-mail (Single User License)
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Product Code : BC19499
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