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[Report]

Nondestructive Testing Industry Review

Published: 2004/09

Contact 24 hrs/day
Description

TABLE OF CONTENTS

INTRODUCTION

ACOUSTICS

    • PIPELINE INSPECTION TOOL INTROS
AWARDS
    • KEITHLEY RECEIVES INNOVATION AWARDS
    • KEITHLEY AWARD IN MEASUREMENT
    • KEITHLEY AWARD IN MEASUREMENT (CONTINUED)
    • KLA-TENCOR RECEIVES TRAINING AWARD
    • KEITHLEY BAGS INNOVATION AWARDS
    • INVISION BAGS FORTUNE AWARD
    • KEITHLEY GETS INNOVATION AWARD
BOOK AND PUBLICATIONS
    • KEITHLEY PUBLISHES 2004 T&M CATALOG
    • AMETEK U.S. GAUGE OFFERS PRODUCT CATALOG
    • LEVEL MEASUREMENT CAPABILITIES GUIDE
DATA ACQUISITION
    • MILLTRONICS MONITORS TALK TO INDUSTRIAL BUSES
EDDY CURRENT
    • DUAL PROBE CONTROL SYSTEM
    • PROBE UPDATE FROM TSC INSPECTION
    • PHASEC 2D EC INSPECTION
ELECTROMAGNETICS
    • RADAR ACCESSORIES OPTIMIZE LEVELS
    • COST-EFFECTIVE LEVEL MEASUREMENT
    • LEPTO-PEN GAUGES COATING THICKNESS
    • 40GHZ PARAMETRIC TESTER OFFERED
    • 40GHZ PARAMETRIC TESTER OFFERED (CONTINUED)
    • RADIO WAVES DETECT MOISTURE IN WALLS
    • ACFM RAIL TRACK INSPECTION
    • ACFM RAIL TRACK INSPECTION (CONTINUED)
    • ACFM RAIL TRACK INSPECTION (CONTINUED)
INDUSTRY NEWS
    • U.S. SALES OF NDT SYSTEMS TO REACH $1.77 BILLION BY 2008
  • Table 1 U.S. SALES OF NDT SYSTEMS, THROUGH 2008 ($ MILLIONS)
    • WORLDWIDE MEM/MST MARKET TO CROSS $26 BILLION BY 2007
      • WORLDWIDE MEM/MST MARKET TO CROSS .. (CONTINUED)
  • Table 2 WORLDWIDE UNIT & DOLLAR SALES OF MEMS/MST PRODUCTS, THROUGH 2007 (MILLIONS)
    • HONG KON ORDERS AS&E SYSTEM
    • ELBIT ESTABLISHES PRESENCE IN CHINA
    • UPDATE ON VEECO/FEI MERGER ANNOUNCEMENT
    • FLIR RECEIVES SCANDINAVIA ORDERS
    • THERMO-ELECTRON UNITES LASERS AND PHOTONICS OFFERINGS
    • VARIAN ACQUIRES MRW GmbH
    • ZYGO RECEIVES CONTRACT EXTENSION
    • PAL SIGNS PACT WITH CAN
    • THERMA-WAVE SELECTED BY TOKYO ELECTRON
    • RUDOLPH SELECTED FOR INTEGRATED METROLOGY
    • ADE WINS JAPANESE ORDERS
    • AMETEK ACQUIRES AIRTECHNOLOGY HOLDINGS
    • CONGRESSMAN ATTENDS AS&E ROUNDTABLE
    • AS&E CEO ADDRESSES PORT SECURITY CONFERENCE
    • AS&E CEO ADDRESSES PORT SECURITY CONFERENCE (CONTINUED)
    • FEI GAINS FIRST VECTRA 986+ ORDERS
    • VEECO FEI NOT TO MERGE
    • INVISION RECEIVES U.S. EDS CONTRACT
    • QUANTUM AWARDED $3.49M FROM DOD
    • VEECO, SEMATECH WORK ON PHOTOMASKS
      • VEECO, SEMATECH WORK ON PHOTOMASKS (CONTINUED)
    • RVSI FACILITIES TO CONSOLIDATE
    • VEECO RECEIVES MBE ORDERS
    • EVEREST VIT CERTIFIED FOR F100 ENGINES
    • AGFA-GEVAERT DISINVESTS ITS NDT GROUP
    • n&k TO DELIVER SYSTEMS TO SELETE
    • ADE RECEIVES MULTIPLE ORDERS
    • AS&E GETS $6M AWARD
    • EVS INSPECTION SYSTEMS FOR CHINA
    • FEI OPENS FACILITY IN CZECH REPUBLIC
    • FLIR TEAMS WITH VISTASCAPE
      • FLIR TEAMS WITH VISTASCAPE (CONTINUED)
    • INVISION TO ACQUIRE YXLON
      • INVISION TO ACQUIRE YXLON (CONTINUED)
    • PPT OEM AGREEMENT WITH ISMECA
    • PPT VISION ANNOUNCES NEW DISTRIBUTOR
    • JAPANESE SELECT VEECO METROLOGY TOOL
    • VEECO RECEIVES MBE ORDERS
    • ZYGO BAGS CONTRACT FROM LLNL
    • CORRPRO SELLS BASS-TRIGON ASSETS
    • COGNEX ACQUIRES SIEMENS ID BUSINESS
    • FLIR IMAGERS TO BE USED IN OLYMPICS
    • INVISION BAGS INTERNATIONAL ORDERS
    • INVISION COMPLETES YXLON ACQUISITION
    • KLA-TENCOR OPENS TAIWAN CENTER
    • KLA-TENCOR SHIPS 100TH 300-MM SYSTEM
      • KLA-TENCOR SHIPS 100TH 300-MM SYSTEM (CONTINUED)
    • CUSTOMS SERVICE ORDERS ARACORS SYSTEMS
    • VEECO OPENS SHANGHAI OFFICE
    • VEECO LAUNCHES INTEGRATION CENTER
    • ZYGO EYES DEFENSE, AEROSPACE
    • EVEREST VIT GETS RVI RENEWAL
    • MATECH GOES INTERNATIONAL
    • CORRPRO TO SELL ROHRBACK COSASCO
    • COGNEX EXPANDS IN MACHINE VISION
    • AS&E GETS DOD ORDER
    • FEI ANNOUNCES ORDERS FOR TEM
    • 3-D METROLOGY FOR THIN-FILM HEADS
    • KEITHLEY AUTOMATES DIAGNOSTIC TESTS
    • ORDERS FOR BUMPED WAFER INSPECTION
    • USDATA, RVSI FORM ALLIANCE
    • SEMATECH INSTALLS VEECOS AFM
    • GE SUED OVER PANAMETRICS ACQUISITION
      • GE SUED OVER PANAMETRICS ACQUISITION (CONTINUED)
    • TRENCH MEASUREMENT SYSTEMS
    • COGNEX TO AWARD CONTINUING EDUCATION
    • NEW INTERIM CEO FOR AS&E
    • DOD ORDERS MORE MOBILESEARCH SYSTEMS
    • RADIOACTIVE THREAT DETECTION ADDED
    • NEW COO FOR FEIC
    • ARMY AWARDS CONTRACT TO FLIR
    • LOGAN AIRPORT ADDS SECURITY
      • LOGAN AIRPORT ADDS SECURITY (CONTINUED)
    • CAMERAS HELP COMBAT SARS
    • INVISION INVESTS IN SAFEVIEW
    • MINE DETECTION DEVELOPMENT AWARD
    • INVISION RECEIVES INTERNATIONAL ORDERS
    • RVSI GETS ASIAN ORDERS
    • ADE RECEIVES MULTIPLE ORDERS
    • TURKISH FABRIC FIRM SELECTS EVS
    • FEI RECEIVES NEW ORDERS
    • RVSI GETS WS-3000 ORDER
    • CORRPRO SELLS ASIAN OPERATION
    • FLIR TOPS NORTHWEST COMPETITION
    • WESDYNE NDE SERVICES
    • ADE RECEIVES LARGE ORDER
    • COGNEX EXPANDS INTO CHINA
    • FEI MAKING STRATEGIC ACQUISITIONS
    • INVISION SELLS 1,000TH EDS
    • JMAR DUMPS PRECISION EQUIPMENT
    • RVSI GETS VISIONSCAPE ORDER
    • SEMICONDUCTOR PACKAGE SINGULATION INSPECTION
    • RVSI RECEIVES ORDERS FOR SCANNERS
    • AMETEK ACQUIRES CHANDLER INSTRUMENTS
    • KLA-TENCOR WINS EXCELLENCE AWARD
      • KLA-TENCOR WINS EXCELLENCE AWARD (CONTINUED)
    • MARITIME THERMAL IMAGING SYSTEMS
    • AS&E ACHIEVES ISO 9001:2000
    • AVIATION SECURITY GROUP AT INVISION
    • YXLON ACQUIRES CT SYSTEMS PROVIDER
    • KEITHLEY, ZYVEX IN MARKETING AGREEMENT
    • TOSHIBA SELECTS KEITHLEY TEST SYSTEM
    • NEW GERMAN AMETEK DISTRIBUTOR
    • AS&E PRESENTS AT MARITIME EXPO
    • FEI OPENS NEW CAMPUS
    • FLIR AND INDIGO TO MERGE
    • THERMO SELLS T&M BUSINESS
    • AMD AWARDS KLA-TENCOR
    • INVISION IN DELOITTES TOP 5000
    • VARIAN ACQUIRES ZMED TECHNOLOGY
    • ROSEN RECEIVES LARGE CONTRACT
    • CONDITIONAL APPROVAL OF GE AGFA PURCHASE
    • KLA-TENCOR OPENS JAPAN CUSTOMER CENTER
    • PPT REGAINS NASDAQ COMPLIANCE
    • COGNEX SHIPS 200,000TH SYSTEM
    • RVSI FILES AMENDED SEC DOCUMENTS
    • VEECO BUYS EMCORES TURBODISC
      • VEECO BUYS EMCORES TURBODISC (CONTINUED)
    • VEECO PURCHASES ADVANCED IMAGING
      • VEECO PURCHASES ADVANCED IMAGING (CONTINUED)
INFRARED
    • LANGLEY PROBES SCANNING THERMOGRAPHY
    • ADVANCES IN THERMAL SENSING
    • CAMERA WITH FIREWIRE OPTION
    • CONTRACT FOR HANDHELD CAMERAS
    • AIRBORNE IR SENSING TECHNOLOGY
      • AIRBORNE IR SENSING TECHNOLOGY (CONTINUED)
    • HANDHELD E-SERIES CAMERAS
    • BENCHTOP NIR ANALYZER
    • TINY CAMERA FOR UAVs
    • INDIGO SYSTEMS INTRODUCES VisGaAs
MAGNETIC TESTING
    • SPEED CONTROL INSPECTION TOOL
      • SPEED CONTROL INSPECTION TOOL (CONTINUED)
      • SPEED CONTROL INSPECTION TOOL (CONTINUED)
MEASUREMENT
    • KEITHLEY DEVELOPS NANOTECHNOLOGY SOLUTIONS
    • U.S. SPECTROSCOPY MARKET TO REACH $4.3 BILLION BY 2007
      • U.S. SPECTROSCOPY MARKET .. (CONTINUED)
  • Table 3 U.S. MARKET FOR SPECTROSCOPY, THROUGH 2007 ($ MILLIONS)
NEW RESEARCH
    • SHEAROGRAPHIC SYSTEM FOR COMPONENTS
    • ULTRASONIC INSPECTION OF ADHESIVE BONDS
    • NDT OF TEA FERMENTATION
    • ULTRALOW NOISE ULTRASOUND ELECTRONICS
    • HOW GRAIN SIZE INFLUENCES ULTRASONICS
    • X-RAY MICRO-TOMOGRAPHY
    • ULTRASONIC INSPECTION OF TRAIN WHEELS
    • IR THERMOGRAPHY FOR NDT OF BRIDGES
    • COMPUTER VISION INSPECTS FOOD
    • ULTRASONIC NDT OF ROCK BOLTS
    • PLATE DETECTOR FOR RADIOGRAPHY
    • IN SITU RELIABILITY MEASUREMENTS
NEW TECHNOLOGY
    • DEPOSITING NANOPARTICLES ON SEMICONDUCTORS
      • DEPOSITING NANOPARTICLES ON SEMICONDUCTORS (CONTINUED)
    • 3-D CHIP WITH FOUR WAFERS
    • LASER TECHNIQUE DETECTS CAVITIES
    • IR SPECTROSCOPY SCREENS MEAT
      • IR SPECTROSCOPY SCREENS MEAT (CONTINUED)
    • HOLOGRAPHIC TECHNIQUE MEASURES VIBRATION
    • IMAGING SUBSURFACE MICROSCOPIC DEFECTS
    • TESTING COMPOSITE MILITARY MATERIALS
      • TESTING COMPOSITE MILITARY MATERIALS (CONTINUED)
    • NDT METHODS FOR SHUTTLE COMPOSITES
      • NDT METHODS FOR SHUTTLE COMPOSITES (CONTINUED)
    • FINDING DEFECTS IN SMALLEST SCALES
      • FINDING DEFECTS IN SMALLEST SCALES (CONTINUED)
    • MICROWAVE TESTING OF SHUTTLE INSULATION
    • TERAHERTZ TECHNIQUE FOR SHUTTLE DEFECTS
    • MOBILE ROBOTS INSPECT GAS PIPES
      • MOBILE ROBOTS INSPECT GAS PIPES (CONTINUED)
    • CORROSION INHIBITORS AS PENETRANT DYES
    • USING CD PLAYERS TO SCREEN MOLECULES
      • USING CD PLAYERS TO SCREEN MOLECULES (CONTINUED)
    • MEASURING FEATURES BY COUNTING ATOMS
    • DUAL MICROSCOPES FOR SPOT DEFECTS
    • DETECTING BIOLOGICAL WARFARE SENSORS
      • DETECTING BIOLOGICAL WARFARE SENSORS (CONTINUED)
    • WEARABLE COMPUTERS TO DETECT CORROSION
      • WEARABLE COMPUTERS TO DETECT CORROSION (CONTINUED)
    • X-RAY INSPECTION MEETS CHIP-MAKING
    • AUTOMATED SENSOR NETWORK FOR DISASTERS
      • AUTOMATED SENSOR NETWORK FOR DISASTERS (CONTINUED)
      • AUTOMATED SENSOR NETWORK FOR DISASTERS (CONTINUED)
OPTICAL
    • FILM INSPECTION, FLATNESS SYSTEM
    • COGNEX INSPECTION SYSTEM IMPROVED
    • 4TH-GENERATION SUPER CCD
      • 4TH-GENERATION SUPER CCD (CONTINUED)
    • MEMS MEASUREMENT WITH OPTICAL PROFILER
    • TableTOP UNIT FOR 3-D INSPECTION
    • UV CAMERA INSPECTS ICs
    • JET ENGINE INSPECTION SYSTEM
    • KLA-TENCOR, MITSUBISHI EVALUATE OVERLAY
    • LIVE FIBER DETECTOR
    • FLATNESS METROLOGY TOOL DEBUTS
    • IC INSPECTION BOTTLENECK BROKEN
      • IC INSPECTION BOTTLENECK BROKEN (CONTINUED)
    • AUTOMATIC 3-D INSPECTION SYSTEM
    • HIGH-SPEED INDUSTRIAL CAMERA
      • HIGH-SPEED INDUSTRIAL CAMERA (CONTINUED)
    • VIDEOSCOPE KEEPS THE BORDER SECURE
    • REMOTE VIDEO INSPECTION SYSTEMS
    • DIGITAL CMOS VISION CAMERA
      • DIGITAL CMOS VISION CAMERA (CONTINUED)
    • HIGH-PERFORMANCE FRAME GRABBERS
    • PROCESS WINDOW QUALIFICATION
      • PROCESS WINDOW QUALIFICATION (CONTINUED)
    • COSMETIC MAKER SELECTS COGNEX
    • OPTICAL THIN-FILM METROLOGY SOLUTION
      • OPTICAL THIN-FILM METROLOGY SOLUTION (CONTINUED)
    • RETICLE INSPECTION FOR SUB-90-NM ICS
    • INLINE FOCUS-EXPOSURE MONITORING FOR LITHOGRAPHY
      • INLINE FOCUS-EXPOSURE MONITORING .. (CONTINUED)
    • BRIGHTFIELD ILLUMINATION TO CAPTURE DEFECTS
      • BRIGHTFIELD ILLUMINATION TO CAPTURE DEFECTS (CONTINUED)
    • LAND GRID ARRAY SOCKET INSPECTION
    • METROLOGY OF STRAINED SILICON
    • AUTOMATED STEEL QUALITY INSPECTION
    • CORECO PARTNERS WITH TELI
    • LOW-COST MACHINE VISION SYSTEM
    • IMPROVEMENTS IN LEAD SCANNERS
      • IMPROVEMENTS IN LEAD SCANNERS (CONTINUED)
    • WAFER INSPECTION SYSTEM IMPROVED
    • MEMS METROLOGY TOOL DEBUTS
    • COGNEX CHOSEN BY STEEL PRODUCER
    • METROLOGY SOLUTION FOR 90-NM NODE
      • METROLOGY SOLUTION FOR 90-NM NODE (CONTINUED)
    • KLA TEAMS WITH CARL ZEISS
      • KLA TEAMS WITH CARL ZEISS (CONTINUED)
    • IMAGE MANAGEMENT FOR REMOTE OPERATION
    • CD METROLOGY FOR MASKS AND RETICLES
    • INSPECTION SYSTEM SAVES TIME
    • MORE ORDERS FOR 200MM MEASUREMENT
    • METAL FILMS METROLOGY
    • LS-8000 LEAD SCANNER
    • CAMERA INTERFACE FOR VISIONSCAPE
      • CAMERA INTERFACE FOR VISIONSCAPE (CONTINUED)
    • HIGH PERFORMANCE MACHINE VISION
    • VIDEO BORESCOPE SYSTEM INTROS
    • 300-MM SYSTEM METROLOGY
    • COGNEX LAUNCHES VISION INTEGRATOR PROGRAM
    • LIMITS IN GEOMETRIC PATTERN MATCHING
    • COGNEX INSPECTION PROOF IN PACKAGING
      • COGNEX INSPECTION PROOF IN PACKAGING (CONTINUED)
    • IMPACT MACHINE-VISION MICRO-SYSTEM
    • NETWORKED VISION SMART CAMERAS
      • NETWORKED VISION SMART CAMERAS (CONTINUED)
    • PARTNERSHIP FOR WAFER METROLOGY
    • MACHINE VISION FACTORY AUTOMATION
    • OPTICAL DIGITAL PROFIOMETRY
    • ADE INTROS WAFER SURFACE INSPECTION
    • OVERLAY METROLOGY SOLUTION FOR 65-NM NODE
      • OVERLAY METROLOGY SOLUTION FOR 65-NM NODE (CONTINUED)
    • MACHINE VISION LENS
    • COST-EFFECTIVE PACKAGE TESTING
PATENTS
    • METHOD FOR DIGITAL IMAGING
    • LOOKING AT FERROUS METALS
    • NEW APPLICATIONS
    • APPROVED PATENTS
    • TESTING FOR STRUCTURE DEFECTS
    • TAKING A CLOSE LOOK AT STEEL
RADIOGRAPHY
    • EUROCOPTER CHOOSES RADVIEW
    • VARIAN EXHIBITS SECURITY PRODUCTS
    • STANFORD ESTABLISHES NANOCHARACTERIZATION FACILITY
    • PORTABLE X-RAY UNIT OFFERED
    • CHARACTERISTICS
    • SPECIAL FEATURES
    • INSPECTING ALUMINUM VEHICLE WHEELS
    • SUB-100-NM CRITICAL DIMENSION METROLOGY
    • POSITRON SYSTEM GETS SBIR AWARD
      • POSITRON SYSTEM GETS SBIR AWARD (CONTINUED)
    • FEI LAUNCHES A 90-NM NODE
    • FEI LAUNCHES QUANTA SEM
    • JMAR TO DEVELOP MONITORING TECHNOLOGY
    • MOBILE X-RAY INSPECTION
    • TYPICAL CHARACTERISTICS
    • SPECIAL FEATURES
    • X-RAY SCREENING VAN SYSTEM
    • WEAPONS DETECTION USING TERAHERTZ RADIATION
    • RADIATION DETECTION TECHNOLOGY
    • AS&E INSPECTION SYSTEM FOR SINGAPORE
      • AS&E INSPECTION SYSTEM FOR SINGAPORE (CONTINUED)
    • CHARACTERIZATION, REPAIR OF PHOTOLITH MASKS
    • E-BEAM INSPECTION SYSTEM UNVEILED
      • E-BEAM INSPECTION SYSTEM UNVEILED (CONTINUED)
    • REAL-TIME IN-FAB METROLOGY SYSTEM
      • REAL-TIME IN-FAB METROLOGY SYSTEM (CONTINUED)
    • BETTER MATERIAL ANALYSIS USING SPMs
    • DUALBEAM SYSTEMS FAMILY INTROS
      • DUALBEAM SYSTEMS FAMILY INTROS (CONTINUED)
    • YXLON SELLS XES EDS
    • DIMENSION X ATOMIC FORCE MICROSCOPE
    • VX340 ATOMIC FORCE PROFILER
    • INVISION GETS MORE EDS ORDERS
    • LINATRON CARGO SCREENERS ORDERED
    • COMPACT X-RAY INSPECTION SYSTEM
    • DETECTING DAMAGE IN NICKEL SUPERALLOYS
    • AS&E STRUTS ITS NEW TECHNOLOGY
      • AS&E STRUTS ITS NEW TECHNOLOGY (CONTINUED)
    • VARIAN PARC TO DEVELOP SECURITY SYSTEM
    • SBIR AWARD FOR POSITRON SYSTEMS
      • SBIR AWARD FOR POSITRON SYSTEMS (CONTINUED)
    • DOD BUYS BACKSCATTER SCREENING SYSTEMS
    • NEXT-GENERATION EXPLOSIVES DETECTION
    • SEMICON METROLOGY WITH VX 340
    • PARIS HIGHLIGHTS BACKSCATTER SYSTEM
    • NDT OF SILICON CARBIDE WAFERS
SOFTWARE
    • FATIGUE AND FRACTURE ANALYSIS
    • CIMETRIX SELECTED FOR QUICK INTEGRATION
    • BATCH TESTER FOR MATERIALS TESTING
    • FAB-WIDE YIELD ANALYSIS SOFTWARE
    • TRAINING, INSPECTION TOOLS FOR VISIONPRO
    • DETECTING AIR LEAKS IN THE SPACE STATION
      • DETECTING AIR LEAKS IN THE SPACE STATION (CONTINUED)
    • EASE-OF-USE SOFTWARE FOR IN-SIGHT
    • IR SOFTWARE MODULES
ULTRASONICS
    • APPLICATIONS FOR ULTRASONIC TECHNOLOGY CONTINUE TO EMERGE
      • APPLICATIONS FOR ULTRASONIC TECHNOLOGY .. (CONTINUED)
  • Table 4 U.S. ULTRASONIC MARKET BY SEGMENT, THROUGH 2008 ($ MILLIONS)
    • MOSFET PAIR FOR PULSERS
    • 4-CHANNEL PULSER/RECEIVER
    • MAIN FEATURES
    • PULSER/RECEIVER BOARD FOR PCI BUS
      • PULSER/RECEIVER BOARD FOR PCI BUS (CONTINUED)
      • PULSER/RECEIVER BOARD FOR PCI BUS (CONTINUED)
    • LLOYDS APPROVES MILLTRONICS SYSTEMS
    • MILLTRONICS LEVEL DEVICE BAGS AWARD
    • DSP EMBEDDED UT BOARD
    • R/D TECHS OMNISCAN FAMILY
    • CONTINUOUS LEVEL MEASUREMENT
    • EPOCH 4 RENEWS OPERATING SOFTWARE
    • AUTO-V MODULES FOR UT THICKNESS GAUGE
    • CORROSION THICKNESS GAGE
    • R&D 100 AWARD FOR PNNL
    • FLAW DETECTOR WITH COLOR DISPLAY
    • R/D TECH LAUNCHES OMNISCAN
    • HOW TO MEASURE THIN PLASTICS
    • USM 35 FLAW DETECTOR
    • GE PANAMETRICS INTROS EMATs
    • MULTIRANGER IN PANEL-MOUNT VERSION

LIST OF TABLES

Table 1 U.S. SALES OF NDT SYSTEMS, THROUGH 2008 ($ MILLIONS)
Table 2 WORLDWIDE UNIT & DOLLAR SALES OF MEMS/MST PRODUCTS, THROUGH 2007 (MILLIONS)
Table 3 U.S. MARKET FOR SPECTROSCOPY, THROUGH 2007 ($ MILLIONS)
Table 4 U.S. ULTRASONIC MARKET BY SEGMENT, THROUGH 2008 ($ MILLIONS)
Description

[Report]
Nondestructive Testing Industry Review
Published: 2004/09
Published by : BCC Research BCC Research

Price:
US $ 1,850.00 Hard Copy
US $ 2,128.00 PDF by E-mail (Single User License)
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