Compound Semiconductor Materials: Technology, Development and Market Trends

Table of Contents

• INTRODUCTION
  • STUDY GOALS AND OBJECTIVES
  • REASONS FOR DOING THE STUDY
  • SCOPE AND FORMAT
  • METHODOLOGY AND INFORMATION SOURCES
  • INTENDED AUDIENCE OF THIS REPORT
  • AUTHORS CREDENTIALS
  • RELATED BCC PUBLICATIONS
    • REPORTS
    • REVIEWS
  • MONTHLY NEWSLETTERS
  • BCC ON-LINE SERVICES
  • DISCLAIMER
• EXECUTIVE SUMMARY
  • Summary Table: WORLDWIDE COMPOUND SEMICONDUCTOR REVENUE BY MAJOR PRODUCT CATEGORY, THROUGH 2009 ($ MILLIONS)
  • Summary Figure: WORLDWIDE COMPOUND SEMICONDUCTOR REVENUE BY MAJOR PRODUCT CATEGORY, 2001-2009 ($ MILLIONS)
    • PRINCIPAL MARKET FORCES
      • MATERIALS
      • COMPONENTS
      • SUBSYSTEMS
• OVERVIEW: MATERIAL TECHNOLOGY AND STATE OF THE INDUSTRY
  • OVERVIEW OF SEMICONDUCTORS
    • GENERAL PROPERTIES OF COMPOUND SEMICONDUCTORS
  • Table 1 PHYSICAL PROPERTIES OF MAJOR COMPOUND SEMICONDUCTOR MATERIALS (COMPARED TO SILICON)
    • Lattice Parameter
    • Bandgap Engineering
    • Heterostructure and Heterojunctions
    • TYPES OF COMPOUND SEMICONDUCTOR MATERIALS
      • Group III-V: Nitrides, Antimonides, Phosphides and Arsenides
        • Gallium Arsenide
        • Indium Phosphide
        • Gallium Nitride
      • Group II-VI: Oxides, Sulphides, Selenides and Tellurides
        • Zinc Selenide
        • Cadmium Telluride
        • Cadmium Zinc Telluride
        • Mercury Cadmium Telluride
      • Group IV: Silicon-Based Compounds and Alloys
        • Silicon Germanium
        • Silicon Carbide
  • Table 2 SUMMARIES OF COMPOUND SEMICONDUCTORS
    • SUBSTRATE MATERIALS
      • Gallium Arsenide
      • Indium Phosphide
      • Silicon
      • Silicon Carbide
      • Germanium
      • Sapphire
      • Aluminum Nitride
      • Free Standing Gallium Nitride Wafer
  • Table 3 SUMMARY OF AVAILABLE SUBSTRATES FOR COMPOUND SEMICONDUCTOR DEVICE MANUFACTURING, 2003
    • MANUFACTURING TECHNOLOGIES
      • Single Crystal Production
        • Czochralski (CZ) Method
        • Float-Zone (FZ) Method
        • Liquid-Encapsulated Czochralski (LEC) Method
        • Vertical Gradient Freeze (VGF) Method
      • Wafer Manufacturing
      • Deposition Technologies
        • Metal Organic Chemical Vapor Deposition (MOCVD)
        • Molecular Beam Epitaxy (MBE)
        • Other Deposition Methods
          • Physical Vapor Deposition (PVD)
          • Liquid Phase Epitaxy (LPE)
          • Hydride Vapor Phase Epitaxy (HVPE)
      • Device Manufacturing
        • Front-End Processing
        • Back-End Processing
    • COMPOUND SEMICONDUCTOR MARKETPLACE
      • RF/Microwave devices
      • Optoelectronic Devices
        • VCSELs
        • Long Wavelength (1,310 nm and 1,550 nm) DFB and FP Lasers
        • Photodetectors (PIN and APD)
        • Light-emitting Diodes (LEDs)
      • Solar Cells
      • Sensors and Detectors
        • Infrared Sensors and Detectors
        • X and Gamma Ray Detectors
        • Magnetic Field Sensors
          • Hall Effect Devices
          • Magnetoresistor (MR)
  • Table 4 APPLICATION GRIDS OF COMPOUND SEMICONDUCTORS
• WORLD MARKET FOR COMPOUND SEMICONDUCTOR MATERIALS
  • DEFINITION
  • SUMMARY AND FORECAST OF THE COMPOUND SEMICONDUCTOR MATERIAL MARKET
    • REVENUE BY CATEGORY: CRYSTAL AND WAFER VS. EPI WAFER AND FOUNDRIES
  • Table 5 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR MATERIALS BY CATEGORY INCLUDING FOUNDRY SERVICES, THROUGH 2009 ($ MILLIONS)
  • Figure 1 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR MATERIALS BY CATEGORY INCLUDING FOUNDRY SERVICES, THROUGH 2009 ($ MILLIONS)
  • Table 6 PERCENTAGES OF COMPOUND SEMICONDUCTOR CRYSTAL AND WAFER PRODUCTS VS. EFIWAFER AND FOUNDRY SERVICES, 2001-2009
  • Table 7 ESTIMATED MARKET SHARES OF COMPOUND SEMICONDUCTOR WAFER MANUFACTURERS, 2003 (%)
  • Table 7 (CONTINUED)
  • Table 8 ESTIMATED MARKET SHARES OF COMPOUND SEMICONDUCTOR FOUNDRIES, 2003 (%)
    • REVENUES BY MATERIAL
  • Table 9 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR MATERIAL PRODUCTS AND SERVICES BY MATERIAL TYPE, THROUGH 2009 ($ MILLIONS)
  • Figure 2 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR MATERIAL PRODUCTS AND SERVICES BY MATERIAL TYPE, 2001-2009 ($ MILLIONS)
  • Table 10 MARKET SHARE OF COMPOUND SEMICONDUCTOR PRODUCTS AND SEVICES BY MATERIAL, 2001-2009 (%)
    • Gallium Arsenide
      • Overview
  • Table 11 BASIC PHYSICAL PARAMETERS OF GALLIUM ARSENIDE (AT 300K)
    • Products
  • Table 12 GALLIUM ARSENIDE CRYSTAL AND WAFER PRODUCERS
  • Table 12 (CONTINUED)
  • Table 13 MAJOR GALLIUM ARSENIDE EPIWAFER PRODUCERS (FOUNDRIES)
    • Forecast of Gallium Arsenide Material Markets
  • Table 14 GLOBAL MARKET FOR GALLIUM ARSENIDE BY CATEORY, THROUGH 2009 ($ MILLIONS)
    • Indium Phosphide
      • Overview
  • Table 15 BASIC PHYSICAL PARAMETERS OF INDIUM PHOSPHIDE (AT 300K)
    • Products
  • Table 16 INDIUM PHOSPHIDE CRYSTAL AND WAFER PRODUCERS
  • Table 17 MAJOR INDIUM PHOSPHIDE EPIWAFER PRODUCERS (FOUNDRIES)
    • Forecast of Indium Phosphide Material Markets
  • Table 18 GLOBAL MARKET FOR INDIUM PHOSPHIDE, THROUGH 2009 ($ MILLIONS)
    • Gallium Nitride
      • Overview
  • Table 19 BASIC PHYSICAL PARAMETERS OF GALLIUM NITRIDE (AT 300K)
    • Optical Devices
    • Electrical Devices
  • Table 20 GALLIUM NITRIDE BASED DEVICES
    • Products
      • Products (continued)
  • Table 21 PARTIAL LIST OF COMPANIES WITH GALLIUM NITRIDE PRODUCTS
    • Forecast of Gallium Nitride Material Market
  • Table 22 GLOBAL MARKET FOR GALLIUM NITRIDE MATERIAL PRODUCT MARKET, THROUGH 2009 ($ MILLIONS)
    • Silicon Germanium
      • Overview
  • Table 23 BASIC PHYSICAL PARAMETERS OF SILICON, GERMANIUM AND SILICON GERMANIUM ALLOYS (AT 300K)
    • Foundry Services
  • Table 24 MAJOR SILICON GERMANIUM BICMOS FOUNDRIES
    • Forecast of Silicon Germanium Related Service Market
  • Table 25 GLOBAL MARKET FOR SILICON GERMANIUM FOUNDRY RELATED SERVICES, THROUGH 2009 ($ MILLIONS)
    • Silicon Carbide
      • Overview
  • Table 26 BASIC PHYSICAL PARAMETERS OF SILICON CARBIDE (AT 300K)
  • Table 27 SILICON CARBIDE BASED DEVICES (POTENTIAL OR EXISTING)
  • Table 27 (CONTINUED)
    • Products
  • Table 28 MAJOR MANUFACTURERS OF SILICON CARBIDE SUBSTRATES
    • Forecast of Silicon Carbide Material Markets
  • Table 29 GLOBAL MARKET FOR SILICON CARBIDE MATERIAL REVENUE, THROUGH 2009 ($ MILLIONS)
    • Other Materials
      • Summary and Outlook
      • Forecast of Other Compound Semiconductor and Related Materials
  • Table 30 GLOBAL MARKET FOR OTHER COMPOUND SEMICONDUCTOR AND RELATED MATERIALS, THROUGH 2009 ($ MILLIONS)
• WORLD MARKET FOR COMPOUND SEMICONDUCTOR BASED COMPONENTS
  • DEFINITION
  • SUMMARY AND FORECAST OF COMPOUND SEMICONDUCTOR COMPONENT MARKET
  • Table 31 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR BASED COMPONENTS AND DEVICES, THROUGH 2009 ($ MILLIONS)
  • Table 32 PERCENTAGES OF COMPOUND SEMICONDUCTOR BASED COMPONENTS BY SUBCATEGORY, 2001-2009 (%)
    • RF AND MICROWAVE COMPONENTS
      • Overview of Applications
  • Table 33 RADIO FREQUENCY BAND AND CORRESPONDENT WAVELENGTH
    • Cellular Network
  • Table 34 DIGITAL CELLULAR PHONE NETWORK PROTOCOLS
    • Wireless Local Area Network (WLAN) and Bluetooth
  • Table 35 WIRELESS NETWORKING STANDARDS
    • Automotive Radar
    • Basic building blocks of RF communication Systems
    • Process Technologies
      • Monolithic Microwave Integrated Circuits (MMIC)
      • Field Effect Transistors
        • JFET
        • MOSFET
        • MESFET
        • HEMT and pHEMT
      • Bipolar Junction Transistors
        • Heterojunction Bipolar Transistor (HBT)
  • Table 36 MAJOR MANUFACTURERS OF COMPOUND SEMICONDUCTOR RF COMPONENTS
  • Table 36 (CONTINUED)
  • Table 36 (CONTINUED)
  • Table 37 MARKET SHARES OF MAJOR COMPOUND SEMICONDUCTOR RF COMPONENT MANUFACTURERS, 2003
    • OPTOELECTRONIC COMPONENTS
      • Overview of Applications
        • Optical Communications Network
  • Table 38 OPTICAL CARRIER LEVELS
    • Optical Wireless and Free Space Optics Communications
    • Next Generation Optical Information Storage
  • Table 39 COMPARISONS OF CD-ROM, DVD AND BLU-RAY DISC
    • Solid State Lighting
    • Laser Diodes
      • Edge-Emitting Laser Diodes
        • Fabry-Perot (FP) Laser
        • Distributed Feedback (DFB) Laser
      • Vertical Cavity Surface Emitting Laser (VCSEL)
    • Superluminescent Diodes (SLDs)
    • Photodiodes
      • PIN Photodiodes
      • Avalanche Photodiodes (APD)
    • Integrated Optical Circuits (IOC) And Photonic Integrated Circuits (PIC)
  • Table 40 MAJOR MANUFACTURERS OF OPTOELECTRONIC COMPONENTS
  • Table 40 (CONTINUED)
  • Table 40 (CONTINUED)
    • Light-emitting Diodes (LEDs)
      • Early Generations of LEDs
  • Table 41 WAVELENGTH AND COLOR OF GaP BASED LEDS
    • High Brightness LEDs
    • Short Wavelength (Green, Blue and Violet) LEDs
  • Table 42 TYPICAL MATERIALS, WAVELENGTHS AND COLORS OF LEDS
  • Table 42 (CONTINUED)
    • White LEDs
      • Gallium Nitride-Based White LED
      • Zinc Selenide-Based White LED
    • Infrared Emitting Diodes (IREDs)
  • Table 43 NEAR INFRARED EMITTING DIODES
    • Ultraviolet (UV) LEDs
    • Lead Mount vs. Surface Mount (SMD) LEDs
    • Applications of LEDs and Current Market Conditions
      • Applications of LEDs and・continued)
  • Table 44 MAJOR MANUFACTURERS OF LED COMPONENTS FOR LIGHTING AND ILLUMINATION (IN ADDITION TO THOSE INCLUDED IN TABLE 39)
  • Table 44 (CONTINUED)
  • Table 45 ESTIMATED MARKET SHARES OF MAJOR COMPOUND SEMICONDUCTOR OPTOELECTRONIC COMPONENT MANUFACTURERS, 2003
    • SENSOR AND DETECTOR COMPONENTS
      • Infrared Sensors and Thermal Image Arrays
      • Infrared Sensor Materials
        • Indium Gallium Arsenide
        • Indium Antimonide
        • Mercury Cadmium Telluride
      • IR Detector Arrays
      • Magnetic Field Sensors
        • Hall Effect Devices
        • Magnetoresistors (MR)
      • X- And Gamma Ray Detectors
  • Table 46 MAJOR MANUFACTURERS OF COMPOUND SEMICONDUCTOR SENSOR AND DETECTOR COMPONENTS
  • Table 47 ESTIMATED MARKET SHARES OF MAJOR MANUFACTURERS OF COMPOUND SEMICONDUCTOR SENSORS, 2003
• WORLD MARKET FOR COMPOUND SEMICONDUCTOR INTEGRATED SUBSYSTEMS
  • DEFINITION
  • SUMMARY AND FORECAST OF COMPOUND SEMICONDUCTOR SUBSYSTEMS MARKET
  • Table 48 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR INTEGRATED SUBSYSTEMS BY SUBCATEGORIES, THROUGH 2009 ($ MILLIONS)
  • Figure 3 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR INTEGRATED SUBSYSTEMS BY SUBCATEGORIES, 2001-2009 ($ MILLIONS)
  • Table 49 REVENUE PERCENTAGES OF COMPOUND SEMICONDUCTOR INTEGRATED SUBSYSTEMS BY SUBCATEGORIES, 2001-2009
    • RF AND MICROWAVE SUBSYSTEMS
      • Transceiver and Power Amplifier Modules for Cellular Handsets and Bluetooth Devices
      • Network Infrastructure (Point-to Point, Point-to-Multipoint Transceivers, Outdoor Units)
      • WLAN Power Amplifiers and Transceivers
  • Table 50 MAJOR MANUFACTURERS OF COMPOUND SEMICONDUCTOR RF AND MICROWAVE SUBSYSTEMS
  • Table 51 ESTIMATED MARKET SHARES OF MAJOR RF SUBSYSTEM MANUFACTURERS, 2003
    • OPTOELECTRONIC SUBSYSTEMS
      • Optical Transceivers
        • Small Form-Factor Pluggable (SFP) Transceiver
        • Gigabit Interface Converter (GBIC)
      • Tunable Lasers
  • Table 52 MAJOR MANUFACTURERS OF COMPOUND SEMICONDUCTOR OPTOELECTRONIC SUBSYSTEMS
  • Table 52 (CONTINUED)
  • Table 53 ESTIMATED MARKET SHARES OF MAJOR OPTOELECTRONIC SUBSYSTEM MANUFACTURERS (EXCLUDING SOLID STATE LIGHTING), 2003
    • LED Display Modules and Solid State Lighting Products
      • LED Displays
      • Solid State Lighting
  • Table 54 MANUFACTURERS OF SOLID STATE LIGHTING AND DISPLAY PRODUCTS
  • Table 54 (CONTINUED)
    • COMPOUND SEMICONDUCTOR SOLAR MODULES
      • Conversion Efficiencies
      • Solar Cell Materials
        • Silicon
        • III-V Compounds
        • CdS/CdTe Polycrystalline Thin Films
  • Table 55 MANUFACTURERS OF COMPOUND SEMICONDUCTOR SOLAR MODULES
• COMPOUND SEMICONDUCTOR TECHNOLOGY ANALYSIS
  • OVERVIEW OF PATENTS AND PATENT APPLICATIONS, USPTO, 1996-2003
  • Table 56 USPTO COMPOUND SEMICONDUCTOR RELATED PATENTS AND PUBLISHED APPLICATIONS BY YEAR, 1996-2003
  • Figure 4 USPTO COMPOUND SEMICONDUCTOR RELATED PATENTS AND PUBLISHED APPLICATIONS BY YEAR, 1996-2003
    • Patents
  • Table 57 COMPOUND SEMICONDUCTOR RELATED PATENTS ISSUED BY MATERIAL, THROUGH 2003
  • Figure 5 COMPOUND SEMICONDUCTOR RELATED PATENTS ISSUED BY MATERIAL, 1996-2003
    • Published Patent Applications
  • Table 58 COMPOUND SEMICONDUCTOR RELATED PUBLISHED PATENT APPLICATIONS BY MATERIAL, 1996-2003
  • Figure 6 COMPOUND SEMICONDUCTOR RELATED PUBLISHED PATENT APPLICATIONS BY MATERIAL, 1996-2003
  • Table 59 PERCENTAGE SHARE OF MATERIALS BY TYPE IN PATENTS AND PENDING PUBLISHED APPLICATIONS, AND DIFFERENCE IN PERCENTAGES, 1996-2003
  • Figure 7 PERCENTAGES OF PATENTS AND PUBLISHED PENDING APPLICATIONS BY MATERIAL, 1996-2003
    • Patent Classification
    • PATENT ANALYSIS BY MATERIAL
      • Gallium Arsenide
  • Table 60 GALLIUM ARSENIDE-RELATED PATENTS BY CLASSIFICATIONS, 1996-2003
  • Table 61 COMPANIES WITH SIGNIFICANT AMOUNT OF GALLIUM ARSENIDE RELATED PATENTS, AWARDED 1996-2003
    • Indium Phosphide
  • Table 62 INDIUM PHOSPHIDE RELATED PATENTS BY CLASSIFICATIONS, 1996-2003
  • Table 63 COMPANIES WITH SIGNIFICANT AMOUNT OF INDIUM PHOSPHIDE RELATED PATENTS, AWARDED 1996-2003
  • Table 63 (CONTINUED)
    • Gallium Nitride And Group III Nitrides
  • Table 64 GALLIUM NITRIDE AND GROUP III NITRIDES RELATED PATENTS BY CLASSIFICATIONS, 1996-2003
  • Table 65 COMPANIES WITH SIGNIFICANT AMOUNT OF GALLUIM NITRIDE AND GROUP III NITRIDES RELATED PATENTS, AWARDED 1996-2003
    • Silicon Carbide
  • Table 66 SILICON CARBIDE RELATED PATENTS BY CLASSIFICATIONS, 1996-2003
  • Table 67 COMPANIES WITH SIGNIFICANT AMOUNT OF SILICON CARBIDE RELATED PATENTS, AWARDED 1996-2003
    • Silicon Germanium
  • Table 68 SILICON GERMANIUM-RELATED PATENTS BY CLASSIFICATIONS, 1996-2003
  • Table 69 COMPANIES WITH SIGNIFICANT AMOUNT OF SILICON GERMANIUM RELATED PATENTS, AWARDED 1996-2003
  • Table 70 MAJOR COMPANIES WITH LARGEST NUMBER OF COMPOUND SEMICONDUCTOR RELATED PATENTS BY MATERIAL
• COMPANY PROFILES
  • COMPOUND SEMICONDUCTOR-RELATED RESEARCH AT LEADING INDUSTRY R&D LABS
    • GE GLOBAL RESEARCH
    • HRL LABORATORIES
    • IBM RESEARCH
    • NORTHROP GRUMMAN ELECTRONIC SYSTEMS
    • ELECTRONIC MATERIALS LABORATORY, XEROX PALO ALTO RESEARCH CENTER
    • SEMICONDUCTOR RESEARCH LABORATORY, LUCENT BELL LABS
    • FREESCALE SEMICONDUCTOR R&D LABS (FORMERLY MOTOROLA)
    • SEMICONDUCTOR ENERGY LABORATORY CO. LTD.
    • NEC COMPOUND SEMICONDUCTOR DEVICES R&D
    • SIEMENS AG RESEARCH AND DEVELOPMENT
    • DOW CORNING COMPOUND SEMICONDUCTOR SOLUTIONS
  • PROFILES OF GOVERNMENT SPONSORED RESEARCH LABS AND PROGRAMS-UNITED STATES
    • MATERIALS AND MANUFACTURING DIRECTORATE (ML), AIR FORCE RESEARCH LABORATORY
    • DEFENSE ADVANCED RESEARCH PROJECTS AGENCY (DARPA)
    • NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
      • Semiconductor Electronics Division, Gaithersburg, MD
      • Optoelectronics Division (Boulder, CO)
    • OFFICE OF NAVAL RESEARCH
      • Electronics Division
      • Funding Programs Concerning Compound Semiconductors:
    • COMPOUND SEMICONDUCTOR RESEARCH LABORATORY (CSRL), SANDIA NATIONAL LABORATORIES
    • THE SENSORS AND ELECTRON DEVICES DIRECTORATE, U.S. ARMY RESEARCH LABORATORY
    • U.S. ARMY RESEARCH OFFICE
    • DIVISION OF MATERIALS RESEARCH, NATIONAL SCIENCE FOUNDATION
  • PROFILES OF GOVERNMENT SPONSORED RESEARCH LABS AND PROGRAMS-OTHER COUNTRIES
    • ENGINEERING AND PHYSICAL SCIENCES RESEARCH COUNCIL, UK
    • NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, JAPAN
      • Power Electronics Research Center
      • Research Center for Photovoltatics
    • NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATION TECHNOLOGY, JAPAN
    • IOFFE PHYSICO-TECHNICAL INSTITUTE, RUSSIA
      • Division of Solid State Electronics
      • Division of Physics of Dielectric And Semiconductors
    • INSTITUTE OF SEMICONDUCTORS, CHINESE ACADEMY OF SCIENCES, CHINA
    • FORSCHUNGSZENTRUM JULICH (RESEARCH CENTRE JULICH), GERMANY
      • Institute of Thin Films and Interfaces
  • PROFILES OF SELECTED UNIVERSITY RESEARCH LABS-UNITED STATES
    • CENTER FOR SOLID STATE ELECTRONICS RESEARCH (CSSER), ARIZONA STATE UNIVERSITY
    • DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING, BOSTON UNIVERSITY
      • Wide Band Gap Semiconductors Laboratory (www.bu.edu/nitrides/)
  • STM/MBE GROUP, CARNEGIE MELLON UNIVERSITY
    • ELECTRICAL AND COMPUTER ENGINEERING, CORNELL UNIVERSITY
      • Electronic and optoelectronic materials research
      • Optoelectronic, optical and laser devices research
    • MICROELECTRONICS RESEARCH CENTER, GEORGIA INSTITUTE OF TECHNOLOGY
    • CENTER FOR MATERIALS SCIENCE AND ENGINEERING, MASSACHUSETTS INSTITUTE OF TECHNOLOGY
      • Compound Semiconductor Materials and Device Research Group
    • ELECTRICAL AND COMPUTER ENGINEERING, OHIO STATE UNIVERSITY
      • Solid State Electronics and Photonics
    • DEPARTMENT OF MATERIALS SCIENCE AND ENGINEERING, PENNSYLVANIA STATE UNIVERSITY
    • WIDE BAND GAP SEMICONDUCTOR DEVICE RESEARCH PROGRAM, PURDUE UNIVERSITY
    • DEPARTMENT OF ELECTRICAL ENGINEERING, STANFORD UNIVERSITY
    • MATERIALS SCIENCE AND ENGINEERING, UNIVERSITY OF CALIFORNIA-BERKELEY
    • FIBER OPTICS AND COMPOUND SEMICONDUCTOR LABORATORY, UNIVERSITY OF CALIFORNIA-IRVINE
    • UNIVERSITY OF CALIFORNIA-SANTA BARBARA
      • Optoelectronics Technology Center (OTC)
      • Interdisciplinary Center for Wide Bandgap Semiconductors and The Solid State Lighting and Display Center
    • OPTOELECTRONICS GROUP, UNIVERSITY OF CALIFORNIA-LOS ANGLES
    • MICRO AND NANOTECHNOLOGY LABORATORY, UNIVERSITY OF ILLINOIS AT URBANA-CHAMPAIGN
    • CENTER FOR OPTOELECTRONIC DEVICES, INTERCONNECTS, AND PACKAGING - UNIVERSITY OF MARYLAND
    • SEMICONDUCTOR SPECTROSCOPY LABORATORY, ELECTRICAL AND COMPUTER ENGINEERING DEPARTMENT, UNIVERSITY OF MASSACHUSETTS AT AMHERST
    • SOLID-STATE ELECTRONICS LABORATORY, UNIVERSITY OF MICHIGAN
      • III-V Integrated Devices and Circuits Group
    • PHOTONICS AND MICROELECTRONICS LABORATORY, UNIVERSITY OF SOUTH CAROLINA
    • UNIVERSITY OF SOUTHERN CALIFORNIA
      • Compound Semiconductor Laboratory
    • THE CENTER FOR MICROELECTRONIC MATERIALS AND STRUCTURES, YALE UNIVERSITY
  • PROFILES OF SELECTED UNIVERSITY RESEARCH LABS-OTHER COUNTRIES
    • SCHOOL OF ELECTRICAL, ELECTRONIC AND COMPUTER ENGINEERING, UNIVERSITY OF WESTERN AUSTRALIA, AUSTRALIA
      • Microelectronics Research Group
    • COMPOUND SEMICONDUCTOR LABORATORY, SIMON FRASER UNIVERSITY, CANADA
    • ELECTRICAL AND ELECTRONIC ENGINEERING, HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY, CHINA
    • GROUP OF RESEARCH ON GAN-RELATED MATERIALS AND DEVICES, PEKING UNIVERSITY, CHINA
    • INSTITUTE OF SOLID STATE PHYSICS, TECHNICAL UNIVERSITY OF BERLIN, GERMANY
    • WALTER SCHOTTKY INSTITUTE, TECHNICAL UNIVERSITY OF MUNICH, GERMANY
    • NAGOYA INSTITUTE OF TECHNOLOGY, RESEARCH CENTER FOR NANO-DEVICE AND SYSTEM, NAGOYA UNIVERSITY, JAPAN
    • THE INSTITUTE OF SCIENTIFIC AND INDUSTRIAL RESEARCH, OSAKA UNIVERSITY, JAPAN
    • LABORATORY FOR NANOELECTRONICS AND SPINTRONICS, RESEARCH INSTITUTE OF ELECTRICAL COMMUNICATION, TOHOKO UNIVERSITY, JAPAN
    • COMPOUND SEMICONDUCTOR PROCESS LABORATORY, POHANG UNIVERSITY OF SCIENCE AND TECHNOLOGY, KOREA
    • SCHOOL OF ELECTRICAL AND ELECTRONIC ENGINEERING, NANYANG TECHNICAL UNIVERSITY, SINGAPORE
    • INSTITUTE OF QUANTUM ELECTRONIC AND PHOTONICS (INSTITUT DE PHOTONIQUE ET DELECTRONIQUE QUANTIQUES), SWISS FEDERAL INSTITUTE OF TECHNOLOGY LAUSANNE (EPFL), SWITZERLAND
    • COMPOUND SEMICONDUCTOR TECHNOLOGIES INITIATIVE, GLASGOW AND STRATHCLYDE UNIVERSITIES, UK
    • UNIVERSITY OF CAMBRIDGE, UK
      • Sige Research, Cavendish Laboratory
    • OPTOELECTRONIC MATERIALS AND DEVICES LABORATORY, UNIVERSITY OF ESSEX, UK
    • SPACE RESEARCH CENTRE, UNIVERSITY OF LEICESTER, UK
    • SEMICONDUCTOR PHYSICS GROUP, UNIVERSITY OF SHEFFIELD, UK
    • MICROELECTRONICS GROUP, UNIVERSITY OF SOUTHAMPTON, UK
    • OPTOELECTRONICS DEVICES AND MATERIALS GROUP, DEPARTMENT OF PHYSICAL SCIENCE, UNIVERSITY OF SURREY, UK

• Summary Table:
• Table 1 PHYSICAL PROPERTIES OF MAJOR COMPOUND SEMICONDUCTOR MATERIALS (COMPARED TO SILICON)
• Table 2 SUMMARIES OF COMPOUND SEMICONDUCTORS
• Table 3 SUMMARY OF AVAILABLE SUBSTRATES FOR COMPOUND SEMICONDUCTOR DEVICE MANUFACTURING, 2003
• Table 4 APPLICATION GRIDS OF COMPOUND SEMICONDUCTORS
• Table 5 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR MATERIALS BY CATEGORY INCLUDING FOUNDRY SERVICES, THROUGH 2009 ($ MILLIONS)
• Table 6 PERCENTAGES OF COMPOUND SEMICONDUCTOR CRYSTAL AND WAFER PRODUCTS VS. EFIWAFER AND FOUNDRY SERVICES, 2001-2009
• Table 7 ESTIMATED MARKET SHARES OF COMPOUND SEMICONDUCTOR WAFER MANUFACTURERS, 2003 (%)
• Table 8 ESTIMATED MARKET SHARES OF COMPOUND SEMICONDUCTOR FOUNDRIES, 2003 (%)
• Table 9 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR MATERIAL PRODUCTS AND SERVICES BY MATERIAL TYPE, THROUGH 2009 ($ MILLIONS)
• Table 10 MARKET SHARE OF COMPOUND SEMICONDUCTOR PRODUCTS AND SEVICES BY MATERIAL, 2001-2009 (%)
• Table 11 BASIC PHYSICAL PARAMETERS OF GALLIUM ARSENIDE (AT 300K)
• Table 12 GALLIUM ARSENIDE CRYSTAL AND WAFER PRODUCERS
• Table 13 MAJOR GALLIUM ARSENIDE EPIWAFER PRODUCERS (FOUNDRIES)
• Table 14 GLOBAL MARKET FOR GALLIUM ARSENIDE BY CATEORY, THROUGH 2009 ($ MILLIONS)
• Table 15 BASIC PHYSICAL PARAMETERS OF INDIUM PHOSPHIDE (AT 300K)
• Table 16 INDIUM PHOSPHIDE CRYSTAL AND WAFER PRODUCERS
• Table 17 MAJOR INDIUM PHOSPHIDE EPIWAFER PRODUCERS (FOUNDRIES)
• Table 18 GLOBAL MARKET FOR INDIUM PHOSPHIDE, THROUGH 2009 ($ MILLIONS)
• Table 19 BASIC PHYSICAL PARAMETERS OF GALLIUM NITRIDE (AT 300K)
• Table 20 GALLIUM NITRIDE BASED DEVICES
• Table 21 PARTIAL LIST OF COMPANIES WITH GALLIUM NITRIDE PRODUCTS
• Table 22 GLOBAL MARKET FOR GALLIUM NITRIDE MATERIAL PRODUCT MARKET, THROUGH 2009 ($ MILLIONS)
• Table 23 BASIC PHYSICAL PARAMETERS OF SILICON, GERMANIUM AND SILICON GERMANIUM ALLOYS (AT 300K)
• Table 24 MAJOR SILICON GERMANIUM BICMOS FOUNDRIES
• Table 25 GLOBAL MARKET FOR SILICON GERMANIUM FOUNDRY RELATED SERVICES, THROUGH 2009 ($ MILLIONS)
• Table 26 BASIC PHYSICAL PARAMETERS OF SILICON CARBIDE (AT 300K)
• Table 27 SILICON CARBIDE BASED DEVICES (POTENTIAL OR EXISTING)
• Table 28 MAJOR MANUFACTURERS OF SILICON CARBIDE SUBSTRATES
• Table 29 GLOBAL MARKET FOR SILICON CARBIDE MATERIAL REVENUE, THROUGH 2009 ($ MILLIONS)
• Table 30 GLOBAL MARKET FOR OTHER COMPOUND SEMICONDUCTOR AND RELATED MATERIALS, THROUGH 2009 ($ MILLIONS)
• Table 31 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR BASED COMPONENTS AND DEVICES, THROUGH 2009 ($ MILLIONS)
• Table 32 PERCENTAGES OF COMPOUND SEMICONDUCTOR BASED COMPONENTS BY SUBCATEGORY, 2001-2009 (%)
• Table 33 RADIO FREQUENCY BAND AND CORRESPONDENT WAVELENGTH
• Table 34 DIGITAL CELLULAR PHONE NETWORK PROTOCOLS
• Table 35 WIRELESS NETWORKING STANDARDS
• Table 36 MAJOR MANUFACTURERS OF COMPOUND SEMICONDUCTOR RF COMPONENTS
• Table 37 MARKET SHARES OF MAJOR COMPOUND SEMICONDUCTOR RF COMPONENT MANUFACTURERS, 2003
• Table 38 OPTICAL CARRIER LEVELS
• Table 39 COMPARISONS OF CD-ROM, DVD AND BLU-RAY DISC
• Table 40 MAJOR MANUFACTURERS OF OPTOELECTRONIC COMPONENTS
• Table 41 WAVELENGTH AND COLOR OF GaP BASED LEDS
• Table 42 TYPICAL MATERIALS, WAVELENGTHS AND COLORS OF LEDS
• Table 43 NEAR INFRARED EMITTING DIODES
• Table 44 MAJOR MANUFACTURERS OF LED COMPONENTS FOR LIGHTING AND ILLUMINATION (IN ADDITION TO THOSE INCLUDED IN TABLE 39)
• Table 45 ESTIMATED MARKET SHARES OF MAJOR COMPOUND SEMICONDUCTOR OPTOELECTRONIC COMPONENT MANUFACTURERS, 2003
• Table 46 MAJOR MANUFACTURERS OF COMPOUND SEMICONDUCTOR SENSOR AND DETECTOR COMPONENTS
• Table 47 ESTIMATED MARKET SHARES OF MAJOR MANUFACTURERS OF COMPOUND SEMICONDUCTOR SENSORS, 2003
• Table 48 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR INTEGRATED SUBSYSTEMS BY SUBCATEGORIES, THROUGH 2009 ($ MILLIONS)
• Table 49 REVENUE PERCENTAGES OF COMPOUND SEMICONDUCTOR INTEGRATED SUBSYSTEMS BY SUBCATEGORIES, 2001-2009
• Table 50 MAJOR MANUFACTURERS OF COMPOUND SEMICONDUCTOR RF AND MICROWAVE SUBSYSTEMS
• Table 51 ESTIMATED MARKET SHARES OF MAJOR RF SUBSYSTEM MANUFACTURERS, 2003
• Table 52 MAJOR MANUFACTURERS OF COMPOUND SEMICONDUCTOR OPTOELECTRONIC SUBSYSTEMS
• Table 53 ESTIMATED MARKET SHARES OF MAJOR OPTOELECTRONIC SUBSYSTEM MANUFACTURERS (EXCLUDING SOLID STATE LIGHTING), 2003
• Table 54 MANUFACTURERS OF SOLID STATE LIGHTING AND DISPLAY PRODUCTS
• Table 55 MANUFACTURERS OF COMPOUND SEMICONDUCTOR SOLAR MODULES
• Table 56 USPTO COMPOUND SEMICONDUCTOR RELATED PATENTS AND PUBLISHED APPLICATIONS BY YEAR, 1996-2003
• Table 57 COMPOUND SEMICONDUCTOR RELATED PATENTS ISSUED BY MATERIAL, THROUGH 2003
• Table 58 COMPOUND SEMICONDUCTOR RELATED PUBLISHED PATENT APPLICATIONS BY MATERIAL, 1996-2003
• Table 59 PERCENTAGE SHARE OF MATERIALS BY TYPE IN PATENTS AND PENDING PUBLISHED APPLICATIONS, AND DIFFERENCE IN PERCENTAGES, 1996-2003
• Table 60 GALLIUM ARSENIDE-RELATED PATENTS BY CLASSIFICATIONS, 1996-2003
• Table 61 COMPANIES WITH SIGNIFICANT AMOUNT OF GALLIUM ARSENIDE RELATED PATENTS, AWARDED 1996-2003
• Table 62 INDIUM PHOSPHIDE RELATED PATENTS BY CLASSIFICATIONS, 1996-2003
• Table 63 COMPANIES WITH SIGNIFICANT AMOUNT OF INDIUM PHOSPHIDE RELATED PATENTS, AWARDED 1996-2003
• Table 64 GALLIUM NITRIDE AND GROUP III NITRIDES RELATED PATENTS BY CLASSIFICATIONS, 1996-2003
• Table 65 COMPANIES WITH SIGNIFICANT AMOUNT OF GALLUIM NITRIDE AND GROUP III NITRIDES RELATED PATENTS, AWARDED 1996-2003
• Table 66 SILICON CARBIDE RELATED PATENTS BY CLASSIFICATIONS, 1996-2003
• Table 67 COMPANIES WITH SIGNIFICANT AMOUNT OF SILICON CARBIDE RELATED PATENTS, AWARDED 1996-2003
• Table 68 SILICON GERMANIUM-RELATED PATENTS BY CLASSIFICATIONS, 1996-2003
• Table 69 COMPANIES WITH SIGNIFICANT AMOUNT OF SILICON GERMANIUM RELATED PATENTS, AWARDED 1996-2003
• Table 70 MAJOR COMPANIES WITH LARGEST NUMBER OF COMPOUND SEMICONDUCTOR RELATED PATENTS BY MATERIAL

• Summary Figure:
• Figure 1 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR MATERIALS BY CATEGORY INCLUDING FOUNDRY SERVICES, THROUGH 2009 ($ MILLIONS)
• Figure 2 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR MATERIAL PRODUCTS AND SERVICES BY MATERIAL TYPE, 2001-2009 ($ MILLIONS)
• Figure 3 GLOBAL MARKET FOR COMPOUND SEMICONDUCTOR INTEGRATED SUBSYSTEMS BY SUBCATEGORIES, 2001-2009 ($ MILLIONS)
• Figure 4 USPTO COMPOUND SEMICONDUCTOR RELATED PATENTS AND PUBLISHED APPLICATIONS BY YEAR, 1996-2003
• Figure 5 COMPOUND SEMICONDUCTOR RELATED PATENTS ISSUED BY MATERIAL, 1996-2003
• Figure 6 COMPOUND SEMICONDUCTOR RELATED PUBLISHED PATENT APPLICATIONS BY MATERIAL, 1996-2003
• Figure 7 PERCENTAGES OF PATENTS AND PUBLISHED PENDING APPLICATIONS BY MATERIAL, 1996-2003