Evolving Dielectrics in Semiconductor Devices

Table of Contents

• INTRODUCTION
  • STUDY GOALS AND OBJECTIVES
  • REASONS FOR DOING THE STUDY
  • CONTRIBUTIONS OF THE STUDY AND FOR WHOM
  • SCOPE AND FORMAT
  • METHODOLOGY AND INFORMATION SOURCES
  • AUTHORS CREDENTIALS
  • RELATED BCC RESEARCH CREDENTIALS
  • RELATED BCC PUBLICATIONS
  • BCC ONLINE SERVICES
  • DISCLAIMER
• EXECUTIVE SUMMARY
  • Summary Table: NORTH AMERICAN AND GLOBAL DIELECTRIC MATERIAL MARKETS, THROUGH 2010 ($ MILLIONS)
  • Summary Figure: NORTH AMERICAN AND GLOBAL DIELECTRIC MATERIAL MARKETS, 2004-2010 ($ MILLIONS)
• INDUSTRY AND MARKET OVERVIEW
  • NORTH AMERICAN MARKET
  • Table 1 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
  • Table 2 SHARE OF THE NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, 2004-2010 (%)
    • WORLD MARKET
  • Table 3 GLOBAL DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
  • Table 4 SHARE OF THE GLOBAL DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, 2004-2010 (%)
  • Table 5 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, THROUGH 2010 ($ MILLIONS)
    • COMPETITION
    • INDUSTRY STRUCTURE
  • Table 6 COMPANIES INVOLVED IN DIELECTRIC MATERIALS
  • Table 6 (CONTINUED)
  • Table 6 (CONTINUED)
• TECHNOLOGY OVERVIEW
  • HISTORY
  • Table 7 SUMMARY OF 2003 ITRS ROADMAP
  • Table 8 2004 UPDATE TO ITRS ROADMAP, 2004-2013
  • Table 9 HIGHLIGHTS OF RECENT DEVELOPMENTS IN DIELECTRIC MATERIALS
  • Table 9 (CONTINUED)
  • Table 9 (CONTINUED)
  • Table 9 (CONTINUED)
  • Table 9 (CONTINUED)
  • Table 9 (CONTINUED)
    • RESEARCH AND DEVELOPMENT
      • U.S. GOVERNMENT
        • Air Force
        • Argonne National Laboratory
        • Defense Advance Research Projects Agency (DARPA)
        • Lawrence Berkeley National Laboratory
        • Lawrence Livermore National Laboratory
        • National Institute of Standards and Technology
        • Oak Ridge National Laboratory
        • National Science Foundation
  • Table 10 NSF AWARDS FOR DIELECTRIC MATERIALS RESEARCH
  • Table 10 (CONTINUED)
    • Pacific Northwest National Laboratories
    • UNIVERSITY
      • SUNY-Albany
      • Chemnitz University of Technology
      • Nanyang Technological University
      • National University of Singapore
      • North Carolina State University
      • Pennsylvania State University and University of Missouri-Rolla
      • Rensselaer Polytechnic Institute
      • Rutgers University
      • Seoul National University
      • Stanford University
      • University of Arizona
      • University of California-Berkeley
      • University of California-Los Angeles
      • University College London
      • University of Leicester, UK
      • University of Minnesota
      • University of Texas at Austin
        • University of Texas・Continued)
      • Wayne State University
      • Yale University
    • INDUSTRY
      • ASUKA Project
      • Crolles2 Alliance
      • Honeywell Electronic Materials (HEM)
      • Interuniversity Microelectronics Center (IMEC)
      • Millennium Research for Advanced Information Technology (MIRAI)
      • National Microelectronics Research Center (NMRC)
      • SEMATECH
      • Semiconductor Equipment Assessment (SEA)
      • The SiLKnet Alliance
      • Wafer Technology Consortium
        • Ultrathin Gate Dielectric Characterization
        • Ultralow-K Dielectric Process Technology Development
        • Packaging of Copper/Ultralow-K ICs
      • IBM Almaden Research Center
    • OTHER
    • TYPES OF MATERIALS
  • Table 11 OVERALL SUMMARY OF DIELECTRIC MATERIALS AND APPLICATIONS
    • INORGANIC
  • Table 12 SUMMARY OF INORGANIC DIELECTRICS
  • Table 12 (CONTINUED)
    • Alumina (Al2O3)
    • Hafnium Oxides/Hafnium Silicates
    • Perovskites
    • Silica (SiO2)
    • Porous Silica
  • Table 13 COMPARISON OF POROUS SILICA PROPERTIES
    • Silicates/Phosphosilicates
    • Silicon Nitride (Si3N4)/Other Nitrides
    • Tantalum Pentoxide (Ta2O5)
    • Zirconia (ZrO2)
    • Other
    • Recent Developments
      • Multilayer Composite Dielectric Film
      • RPT-grown Oxynitride Layers for High-k Dielectrics
      • Highly Reliable Amorphous High-k Gate Dielectric ZrOXNY (U. S. Patent No. 6767795)
      • High-k Dielectric Materials and Processes for Manufacturing Them (Patent No. U.S. 6787429)
      • Lanthanide Doped TiOx Dielectric Films (U. S. Patent No. 6790791)
    • ORGANIC
  • Table 14 SUMMARY OF ORGANIC DIELECTRIC MATERIALS
    • Aromatic Thermosets
  • Table 15 DOW CHEMICAL SILK DIELECTRIC PROPERTIES
    • Benzocyclobutene (BCB) Polymers
    • Parylene/poly(arylene Ether)
    • Polyimides
    • Polytetrafluoroethylene (PTFE, Teflon)
    • Siloxanes
    • HYBRID
  • Table 16 SUMMARY OF HYBRID DIELECTRIC MATERIALS
    • Recent Developments
      • Aromatic Thermosetting Polymer for Ultralow-K Dielectric
      • Methylsiloxane Spin-on-Glass Films for Low Dielectric Constant Interlayer Dielectrics
      • Nanoscale Self-Assembled Organic Dielectrics for Ultralow Voltage High-Speed Electronic Devices
      • Spin-On Dielectrics with Low Porosity
      • Ultralow-K Materials based on Nanoporous Fluorinated Polyimide
      • Carbon-Doped Oxide Films for Dual Damascene Processes
      • Porous Low-k Dielectrics with Improved Durability
      • Nanopore Materials for Low-k Dielectrics
      • Ultralow Dielectric Constants Materials for Microelectronics and E-textiles
  • Table 17 SUMMARY OF UCLAS DIELECTRIC MATERIAL
    • Molecular Design of Triptycene-Based Polymers for Low K Dielectrics
    • Defect-Free Dielectric Coatings and Preparation Using Polymeric Nitrogenous Porogens (U.S. Patent No. 6812551)
    • DEPOSITION METHODS
  • Table 18 SUMMARY OF DEPOSITION METHODS AND MATERIALS
    • ATOMIC LAYER DEPOSITION (ALD)
    • CHEMICAL VAPOR DEPOSITION (CVD)
  • Table 19 COMPARISON OF CVD AND SOD
    • JET VAPOR DEPOSITION
    • SPIN-ON DEPOSITION (SOD)
  • Figure 1 GENERAL PROCESS FLOW FOR LOW-K SOD
  • Table 20 COST COMPARISON OF SOD SILK TO CVD AND HYBRID
    • SOL GEL
    • OTHER PROCESSES
      • Dielectric Etch
      • Dielectric CMP
    • RECENT DEVELOPMENTS
      • Atomic Layer Deposition of Single Layers
      • Atomic Vapor Deposition for High-K Materials
      • CVD of Hafnium Silicate Dielectric
      • SiO2-Aerogel Spin-On Process for Low-k Materials
  • Figure 2 PROCESS FLOW OF AEROGEL DEPOSITION AND DIELECTRIC STACK
    • Spin Coating Template Method
    • UC-ALE Deposition of High-k Dielectrics
    • UV-assisted CVD
  • Figure 3 SCHEMATIC OF UV-CVD REACTOR
    • Vapor Phase Plasma Polymerization
    • Method for Depositing Low-k Thermally Stable Dielectric Material
    • Plasma Deposition Sealing Process for Porous Low-k Dielectrics
    • Ultrathin Gate-Insulation Process for Advanced CMOS Transistors
    • Rapid Thermal Nitridation of Oxynitride Layers
    • Radical Nitridation Process
    • UV-Ozone Oxidation of Thin Films
    • RF Plasma-Polymerization for Producing Low-K Thin Polyaniline Films
    • Low Temperature Silicon Nitride Process for Sub-90nm DRAM and Logic IC Manufacturing
    • Method for Growing Ultrathin Nitrided Oxide
    • Method for Forming Airgaps for Semiconductor Devices (U.S. Patent No. 6780753)
    • DIELECTRICS IN SEMICONDUCTOR DEVICES
  • Figure 4 DIELECTRIC ISOLATION
  • Figure 5 GATE DIELECTRIC
  • Figure 6 MEMORY CELL TRENCH CAPACITOR
  • Figure 7 INTERLAYER DIELECTRIC
    • INTERCONNECT DIELECTRIC
      • From Aluminum to Copper
        • From Aluminum to Copper (Continued)
  • Figure 8 DUAL DAMASCENE ETCH VARIATIONS
    • Integration Challenges
  • Table 21 LOW-K INTERCONNECT MATERIAL REQUIREMENTS
    • THE GATE DIELECTRIC
  • Table 22 THE SHRINKING GATE DIELECTRIC LAYER, THROUGH 2016
    • The Gate Dielectric (Continued)
    • Damascene at the Gate
    • MEMORY DEVICES
      • Memory Capacitor Structures
      • Ultrathin Dielectric Layers
  • Table 23 DRAM CAPACITOR DIELECTRIC REQUIREMENTS
    • APPLICATIONS
      • Low-k
  • Table 24 SUMMARY OF LOW-K MATERIALS
  • Table 24 (CONTINUED)
  • Table 25 MATERIAL PROPERTY COMPARISON OF LOW-K DIELECTRICS
    • Low-k (Continued)
    • High-k
  • Table 26 HIGH-K MATERIALS FOR GATE DIELECTRIC APPLICATIONS
    • High-k (Continued)
  • Figure 9 TYPICAL HFSION STACK FORMATION PROCESS
    • Recent Developments
      • 4 Mb SRAM Memory with OSG Dielectric
      • Novel EEPROM Cell with Oxide-Nitride-Oxide as Split Gate Channel Dielectric
      • Low Voltage Operation of Field-effect Transistors Using Pt/SrBi2Ta2O9/Pt/SrTa2O6/SiON/Si Structures
      • Laptop Computers with Low-k Technology
      • High Performance MOSFETs with High-K Gate Dielectrics
      • Strained SiGe MOS Devices with ZrO2 Dielectric
      • GaAs MOSFET with Al2O3 Gate Dielectric
      • DSPs for Wireless Base Stations
      • ASICs Incorporating Low-k Dielectrics
  • Table 27 COMPARISON OF LOW K WITH FSG
    • pMOSFETs with HfO2 Gate Dielectric and TiN Metal Gate
    • Advanced MOSFET for 45-nm Technology
• MARKETS
  • OVERALL NORTH AMERICAN MARKETS
  • Table 28 NORTH AMERICAN DIELECTRIC MATERIAL MARKETS, THROUGH 2010 ($ MILLIONS)
    • BY MATERIAL
    • MARKET DRIVERS
    • TECHNOLOGY DRIVERS
  • Table 29 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
    • Inorganic
  • Table 30 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF INORGANIC MATERIAL, THROUGH 2010 ($ MILLIONS)
    • Organic/Hybrid
      • Organic Low-K Dielectrics
  • Table 31 POLY(ARYLENE ETHER) DIELECTRICS
    • Hybrids
  • Table 32 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
    • Material Suppliers
      • Air Products/Schumacher
      • Applied Materials
  • Table 33 COMPARISON OF APPLIED MATERIALS PRODUCTS
    • Dow Chemical Co.
  • Table 34 PROPERTIES OF SILK DIELECTRICS
    • Dow Corning Co.
  • Table 35 PROPERTIES OF DOW CORNING PRECURSORS
  • Table 36 DOW CORNINGS FOX MATERIALS
    • Honeywell Electronic Materials
  • Table 37 PROPERTIES OF HONEYWELLS DIELECTRIC FILMS
  • Table 37 (CONTINUED)
    • Honeywell Electronic Materials (Continued)
  • Table 38 HISTORY OF NANOGLASS PROPERTIES
    • JSR Micro
  • Table 39 COMPARISON OF JSR DIELECTRICS
    • Novellus
    • Rohm and Haas
    • GLOBAL MARKET
  • Table 40 WORLDWIDE SEMICONDUCTOR CAPITAL EQUIPMENT SPENDING FORECAST, THROUGH 2008 ($ MILLIONS)
    • BY REGION
  • Table 41 SEMICONDUCTOR EQUIPMENT SHARE BY REGION, 2003-2005 (%)
  • Table 42 GLOBAL MARKET FOR DIELECTRIC MATERIALS BY REGION, THROUGH 2010 ($ MILLIONS)
  • Figure 10 GLOBAL MARKET FOR DIELECTRIC MATERIALS BY REGION, 2004-2010 ($ MILLIONS)
    • BY MATERIAL
  • Table 43 GLOBAL DIELECTRIC MATERIAL MARKET BY MATERIAL TYPE, THROUGH 2010 ($ MILLIONS)
  • Figure 11 GLOBAL DIELECTRIC MATERIAL MARKET BY MATERIAL TYPE, 2004-2010 ($ MILLIONS)
    • Inorganic Material
  • Table 44 GLOBAL MARKET BY TYPE OF INORGANIC MATERIAL, THROUGH 2010 ($ MILLIONS)
  • Figure 12 GLOBAL MARKET BY TYPE OF INORGANIC MATERIAL, 2004-2010 ($ MILLIONS)
    • Organic/Hybrid
  • Table 45 GLOBAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
  • Figure 13 GLOBAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
    • BY APPLICATION
  • Table 46 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, THROUGH 2010 ($ MILLIONS)
  • Figure 14 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, 2004-2010 ($ MILLIONS)
  • Table 47 GLOBAL INTERCONNECT DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
  • Table 48 GLOBAL GATE DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
  • Table 49 GLOBAL CAPACITOR DIELECTRIC MATERIAL USE BY MATERIAL TYPE, THROUGH 2010 ($ MILLIONS)
  • Table 50 GLOBAL MEMORY CAPACITOR DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
    • By Application (Continued)
    • By Application (Continued)
    • BY DEPOSITION METHOD
  • Table 51 FABS ADOPTING LOW-K AT 130 NM
    • By Deposition Method (Continued)
  • Table 52 GLOBAL DIELECTRIC MATERIALS MARKET BY DEPOSITION METHOD, THROUGH 2010 ($ MILLIONS)
  • Figure 15 GLOBAL DIELECTRIC MATERIALS MARKET BY DEPOSITION METHOD, 2004-2010 ($ MILLIONS)
    • INDUSTRY DYNAMICS
  • Table 53 POTENTIAL MERGERS BY 2010
    • MAJOR PLAYERS
  • Table 54 SALES OF TOP 25 SEMICONDUCTOR COMPANIES BY RANK, 2003 AND 2004
  • Table 55 MAJOR PLAYERS IN DIELECTRIC MATERIALS
  • Table 56 MARKET SHARE BY COMPANY FOR DIELECTRIC MATERIALS, 2004 (%)
    • ACQUISITIONS, MERGERS AND EXPANSIONS
  • Table 57 SUMMARY OF ACQUISITIONS AND EXPANSIONS, 2001-2005
    • LICENSING AND MARKETING AGREEMENTS
  • Table 58 SUMMARY OF LICENSING AND MARKETING AGREEMENTS, 2000-2005
  • Table 58 (CONTINUED)
  • Table 58 (CONTINUED)
    • COMPETITION
    • PRICE TRENDS
• PROFILES OF COMPANIES IN DIELECTRIC MATERIALS
  • ACM RESEARCH INC.
  • ADVANCED MICRO DEVICES
    • ADVANCED MICRO DEVICES (CONTINUED)
  • AGERE SYSTEMS
  • AIR LIQUIDE ELECTRONICS
  • ALTERA CORPORATION
  • APPLIED MATERIALS
  • ASAHI GLASS CO. LTD.
  • ASM INTERNATIONAL
  • ATI TECHNOLOGIES, INC.
  • AVIZA TECHNOLOGY
  • AXCELIS TECHNOLOGIES
  • CHARTERED SEMICONDUCTOR MANUFACTURING
  • CYPRESS SEMICONDUCTOR
  • DAINIPPON SCREEN MANUFACTURING
  • DOW CHEMICAL
  • DOW CORNING INC.
    • DOW CORNING INC. (CONTINUED)
  • ELUME INC.
  • FREESCALE SEMICONDUCTOR
  • FSI INTERNATIONAL
  • FUJITSU MICROELECTRONICS, INC.
  • GENUS, INC.
  • HITACHI, LTD.
    • HITACHI, LTD. (CONTINUED)
  • HONEYWELL ELECTRONIC MATERIALS
  • HYNIX SEMICONDUCTOR INC.
  • INFINEON TECHNOLOGIES AG
  • INTEL CORP.
  • INTERNATIONAL BUSINESS MACHINES (IBM)
  • IPTYX CORPORATION
  • JSR CORP.
  • LAM RESEARCH CORP.
  • LSI LOGIC
  • LUCENT TECHNOLOGIES
  • MATTSON TECHNOLOGY, INC.
  • MEMSCAP
  • MICRON TECHNOLOGY, INC.
  • MITSUBISHI ELECTRIC CORP.
    • MITSUBISHI ELECTRIC CORP. (CONTINUED)
  • NEC CORP.
  • NOVELLUS
    • NOVELLUS (CONTINUED)
  • PHILIPS SEMICONDUCTOR
    • PHILIPS SEMICONDUCTOR (CONTINUED)
  • RENESAS TECHNOLOGY AMERICA INC.
  • ROHM AND HAAS ELECTRONIC MATERIALS
  • SAMSUNG ELECTRONICS
  • SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. (SELETE)
  • SCHUMACHER
  • SILECS, INC.
  • STMICROELECTRONICS
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO.
    • TAIWAN SEMICONDUCTOR MANUFACTURING CO. (CONTINUED)
  • TEXAS INSTRUMENTS, INC.
    • TEXAS INSTRUMENTS, INC. (CONTINUED)
  • TOKYO ELECTRON, LTD.
  • TOSHIBA CORP.
  • TRIKON TECHNOLOGIES
  • UNITED MICROELECTRONICS CO. (UMC)
    • UNITED MICROELECTRONICS CO. (UMC) (CONTINUED)
    • UNITED MICROELECTRONICS CO・CONTINUED)
• APPENDIX
  • SUMMARY OF PATENTS IN DIELECTRIC MATERIALS, PROCESSING AND APPLICATIONS
    • PATENTS BY COUNTRY
    • PATENTS BY ASSIGNEE
  • Table 59 TOP 20 U.S. PATENT WINNERS IN 2004
  • Table 60 NUMBER OF U.S. PATENTS IN DELECTRIC MATERIALS, PROCESSING AND APPLICATIONS PER COMPANY IN 2004
  • Table 60 (CONTINUED)
  • Table 61 NUMBER OF JAPANESE PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGIES PER COMPANY IN 2004
    • PATENTS BY MATERIAL TYPES
    • PATENTS BY DEPOSITION TECHNOLOGIES
    • U.S. PATENTS IN INORGANIC DIELETRICS
  • Table 62 U.S. PATENTS IN INORGANIC DIELETRICS, 2000-2004
  • Table 62 (CONTINUED)
  • Table 62 (CONTINUED)
  • Table 62 (CONTINUED)
    • U.S. PATENTS IN ORGANIC DIELECTRICS
  • Table 63 U.S. PATENTS IN ORGANIC DIELECTRICS, 2000-2004
  • Table 63 (CONTINUED)
  • Table 63 (CONTINUED)
    • U.S. PATENTS IN DIELECTRIC APPLICATIONS AND PROCESSING
  • Table 64 U.S. PATENTS IN DIELECTRIC APPLICATIONS AND PROCESSING, 2000-2004
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
    • RECENT JAPANESE PATENTS IN DIELECTRICS MATERIALS AND TECHNOLOGY
  • Table 65 JAPANESE PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGY, 2001-2004
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 56 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
    • RECENT INTERNATIONAL PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGY
  • Table 66 INTERNATIONAL PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGY, 1997-2004
  • Table 66 (CONTINUED)
  • Table 66 (CONTINUED)
  • Table 66 (CONTINUED)
  • Table 66 (CONTINUED)
    • OTHER RESEARCH ORGANIZATIONS INVOLVED IN DIELECTRICS RESEARCH
    • GLOSSARY OF ACRONYMS
      • GLOSSARY OF ACRONYMS (CONTINUED)
      • GLOSSARY OF ACRONYMS (CONTINUED)
• LIST OF TABLES
• Summary Table:
• Table 1 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 2 SHARE OF THE NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, 2004-2010 (%)
• Table 3 GLOBAL DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 4 SHARE OF THE GLOBAL DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, 2004-2010 (%)
• Table 5 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, THROUGH 2010 ($ MILLIONS)
• Table 6 COMPANIES INVOLVED IN DIELECTRIC MATERIALS
• Table 7 SUMMARY OF 2003 ITRS ROADMAP
• Table 8 2004 UPDATE TO ITRS ROADMAP, 2004-2013
• Table 9 HIGHLIGHTS OF RECENT DEVELOPMENTS IN DIELECTRIC MATERIALS
• Table 10 NSF AWARDS FOR DIELECTRIC MATERIALS RESEARCH
• Table 11 OVERALL SUMMARY OF DIELECTRIC MATERIALS AND APPLICATIONS
• Table 12 SUMMARY OF INORGANIC DIELECTRICS
• Table 13 COMPARISON OF POROUS SILICA PROPERTIES
• Table 14 SUMMARY OF ORGANIC DIELECTRIC MATERIALS
• Table 15 DOW CHEMICAL SILK DIELECTRIC PROPERTIES
• Table 16 SUMMARY OF HYBRID DIELECTRIC MATERIALS
• Table 17 SUMMARY OF UCLAS DIELECTRIC MATERIAL
• Table 18 SUMMARY OF DEPOSITION METHODS AND MATERIALS
• Table 19 COMPARISON OF CVD AND SOD
• Table 20 COST COMPARISON OF SOD SILK TO CVD AND HYBRID
• Table 21 LOW-K INTERCONNECT MATERIAL REQUIREMENTS
• Table 22 THE SHRINKING GATE DIELECTRIC LAYER, THROUGH 2016
• Table 23 DRAM CAPACITOR DIELECTRIC REQUIREMENTS
• Table 24 SUMMARY OF LOW-K MATERIALS
• Table 25 MATERIAL PROPERTY COMPARISON OF LOW-K DIELECTRICS
• Table 26 HIGH-K MATERIALS FOR GATE DIELECTRIC APPLICATIONS
• Table 27 COMPARISON OF LOW K WITH FSG
• Table 28 NORTH AMERICAN DIELECTRIC MATERIAL MARKETS, THROUGH 2010 ($ MILLIONS)
• Table 29 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 30 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF INORGANIC MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 31 POLY(ARYLENE ETHER) DIELECTRICS
• Table 32 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 33 COMPARISON OF APPLIED MATERIALS PRODUCTS
• Table 34 PROPERTIES OF SILK DIELECTRICS
• Table 35 PROPERTIES OF DOW CORNING PRECURSORS
• Table 36 DOW CORNINGS FOX MATERIALS
• Table 37 PROPERTIES OF HONEYWELLS DIELECTRIC FILMS
• Table 38 HISTORY OF NANOGLASS PROPERTIES
• Table 39 COMPARISON OF JSR DIELECTRICS
• Table 40 WORLDWIDE SEMICONDUCTOR CAPITAL EQUIPMENT SPENDING FORECAST, THROUGH 2008 ($ MILLIONS)
• Table 41 SEMICONDUCTOR EQUIPMENT SHARE BY REGION, 2003-2005 (%)
• Table 42 GLOBAL MARKET FOR DIELECTRIC MATERIALS BY REGION, THROUGH 2010 ($ MILLIONS)
• Table 43 GLOBAL DIELECTRIC MATERIAL MARKET BY MATERIAL TYPE, THROUGH 2010 ($ MILLIONS)
• Table 44 GLOBAL MARKET BY TYPE OF INORGANIC MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 45 GLOBAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 46 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, THROUGH 2010 ($ MILLIONS)
• Table 47 GLOBAL INTERCONNECT DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
• Table 48 GLOBAL GATE DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
• Table 49 GLOBAL CAPACITOR DIELECTRIC MATERIAL USE BY MATERIAL TYPE, THROUGH 2010 ($ MILLIONS)
• Table 50 GLOBAL MEMORY CAPACITOR DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
• Table 51 FABS ADOPTING LOW-K AT 130 NM
• Table 52 GLOBAL DIELECTRIC MATERIALS MARKET BY DEPOSITION METHOD, THROUGH 2010 ($ MILLIONS)
• Table 53 POTENTIAL MERGERS BY 2010
• Table 54 SALES OF TOP 25 SEMICONDUCTOR COMPANIES BY RANK, 2003 AND 2004
• Table 55 MAJOR PLAYERS IN DIELECTRIC MATERIALS
• Table 56 MARKET SHARE BY COMPANY FOR DIELECTRIC MATERIALS, 2004 (%)
• Table 57 SUMMARY OF ACQUISITIONS AND EXPANSIONS, 2001-2005
• Table 58 SUMMARY OF LICENSING AND MARKETING AGREEMENTS, 2000-2005
• Table 59 TOP 20 U.S. PATENT WINNERS IN 2004
• Table 60 NUMBER OF U.S. PATENTS IN DELECTRIC MATERIALS, PROCESSING AND APPLICATIONS PER COMPANY IN 2004
• Table 61 NUMBER OF JAPANESE PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGIES PER COMPANY IN 2004
• Table 62 U.S. PATENTS IN INORGANIC DIELETRICS, 2000-2004
• Table 63 U.S. PATENTS IN ORGANIC DIELECTRICS, 2000-2004
• Table 64 U.S. PATENTS IN DIELECTRIC APPLICATIONS AND PROCESSING, 2000-2004
• Table 65 JAPANESE PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGY, 2001-2004
• Table 66 INTERNATIONAL PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGY, 1997-2004
• LIST OF FIGURES
• Summary Figure:
• Figure 1 GENERAL PROCESS FLOW FOR LOW-K SOD
• Figure 2 PROCESS FLOW OF AEROGEL DEPOSITION AND DIELECTRIC STACK
• Figure 3 SCHEMATIC OF UV-CVD REACTOR
• Figure 4 DIELECTRIC ISOLATION
• Figure 5 GATE DIELECTRIC
• Figure 6 MEMORY CELL TRENCH CAPACITOR
• Figure 7 INTERLAYER DIELECTRIC
• Figure 8 DUAL DAMASCENE ETCH VARIATIONS
• Figure 9 TYPICAL HFSION STACK FORMATION PROCESS
• Figure 10 GLOBAL MARKET FOR DIELECTRIC MATERIALS BY REGION, 2004-2010 ($ MILLIONS)
• Figure 11 GLOBAL DIELECTRIC MATERIAL MARKET BY MATERIAL TYPE, 2004-2010 ($ MILLIONS)
• Figure 12 GLOBAL MARKET BY TYPE OF INORGANIC MATERIAL, 2004-2010 ($ MILLIONS)
• Figure 13 GLOBAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
• Figure 14 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, 2004-2010 ($ MILLIONS)
• Figure 15 GLOBAL DIELECTRIC MATERIALS MARKET BY DEPOSITION METHOD, 2004-2010 ($ MILLIONS)