The Global Market for Advanced Electronic Packaging

Table of Contents

• INTRODUCTION
  • STUDY GOALS AND OBJECTIVES
  • REASONS FOR DOING THE STUDY
  • SCOPE AND FORMAT
  • ABOUT THE AUTHOR
  • INFORMATION SOURCES
  • RELATED BCC REPORTS
  • BCC ONLINE SERVICES
  • DISCLAIMER
• EXECUTIVE SUMMARY
  • Summary Table:
  • GLOBAL MARKET FOR IN-HOUSE AND OUTSOURCED PACKAGING AND TESTING, THROUGH 2011 ($ BILLIONS)
  • Summary Figure:
  • GLOBAL MARKET FOR IN-HOUSE AND OUTSOURCED PACKAGING AND TESTING SALES, 2006 AND 2011 ($ BILLIONS)
• TECHNOLOGY LANDSCAPE
  • TECHNOLOGY LANDSCAPE
    • TECHNOLOGY LANDSCAPE (Continued)
• Figure 1 POSITION OF PACKAGING AND TESTING IN SEMICONDUCTOR MANUFACTURING CYCLE
  • TYPES OF ADVANCED PACKAGING TECHNIQUES
    • TYPES OF ADVANCED PACKAGING ...(CONTINUED)
  • PACKAGE FOOTPRINT REDUCTION: CHIP SCALE PACKAGE (CSP)/WAFER LEVEL PACKAGING (WLP)
    • Introduction
• Table 1 GLOBAL MARKET FORECAST FOR OSPT CSP/WLP SALES, THROUGH 2011 ($ BILLIONS)
  • Background
  • Applications and Case Studies
• Table 2 GLOBAL MARKET FORECAST FOR OSPT CSP, BY SECTOR, THROUGH 2011 ($ BILLIONS)
• Figure 2 GLOBAL MARKET FORECAST FOR OSPT CSP, BY SECTOR, 2004-2011 ($ BILLIONS)
  • Case Study-CSP for High-Brightness LED
• Features and Benefits
  • Size and Weight Efficiency
  • Ease of Implementation
  • Compatibility
  • Mismatch and Revision Elimination
  • Time to Market Reduction
• Implementation Methodologies and Process Enhancements
  • CSP
  • WLP
  • Process Enhancement-Reduction in Particle Defects
  • Process Enhancement-Maxim Integrated Products
• Figure 3 WLP CROSS SECTION
  • Process Enhancement-Tessera
• Figure 4 WLP-COMPLIANT LAYER
  • Process Enhancement-Amkor
• Limitations of CSP/WLP
  • Infrastructure Constraints
  • Cost Concerns
  • Operation Concerns
  • Challenges Associated with Wafer Level Test and Burn-in (WLTBI)
• Global Distribution of OSPT Services Sales by Region
• Table 3 GLOBAL MARKET FORECAST FOR OSPT CSP: DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • PACKAGE-TO-PCB BONDING-PGA
    • Introduction
    • Features and Benefits
      • Lower Thermal Resistance and High Thermal Heat Dissipation
      • Better Signal Quality
      • High Reliability
• Applications and Case Studies
• Implementation Methodologies and Process Enhancements
  • Implementation Methodology-CPGA
  • Implementation Methodology-PPGA
• PACKAGE-TO-PCB ATTACHMENT/ BONDING: BGA
  • Introduction
• Table 4 GLOBAL MARKET FORECAST FOR OSPT BGA SALES, THROUGH 2011 ($ BILLIONS)
  • Applications and Case Studies
• Table 5 GLOBAL MARKET FORECAST FOR BGA: DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)
• Figure 5 GLOBAL MARKET FORECAST FOR BGA, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)
  • Features and Benefits
  • High Density
  • Heat Conduction Efficiency
  • Low Inductance Leads
• Implementation Methodologies and Process Enhancements
  • Implementation Methodologies ...(Continued)
  • Implementation Methodology-PBGA
  • Implementation Methodology-FCBGA
  • Implementation Methodology-CBGA
  • Implementation Methodology-TBGA
  • Implementation Methodology-EBGA
  • Process Enhancement-Ball Placement Equipment
  • Process Enhancement-SolVision
• Limitations and Challenges
  • Unreliability of Solder Balls
  • Complicated, Expensive, and Incomprehensive Inspection Techniques
  • Difficulty in Rectification of Individual Solders
  • Inability to Withstand High Temperature
  • Sensitivity to Moisture
• Global Distribution of OSPT Sales by Region
• Table 6 GLOBAL MARKET FORECAST FOR OSPT BGA, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • DIE-TO-PACKAGE SUBSTRATE ATTACHMENT/BONDING: FC
    • Introduction
• Table 7 GLOBAL MARKET FORECAST FOR OSPT FC, THROUGH 2011 ($ BILLIONS)
  • Applications and Case Studies
    • Case Study-Kyocera
    • Case Study-Migration from Wire Bond to FC Packaging
    • Case Study-Amkor
    • Case Study-ASAT
• Table 8 GLOBAL MARKET FORECAST FOR OSPT FC, DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)
• Figure 6 GLOBAL MARKET FORECAST FOR OSPT FC, DISTRIBUTION, BY SECTOR, 2004-2011 ($ BILLIONS)
  • Features and Benefits
    • Size Efficiency
    • Speedy Interconnect
    • I/O Efficiency
    • Cost Benefits
    • Assembly Process Efficiency
  • Implementation Methodologies and Process Enhancements
• Figure 7 OERLIKON MICRON5003 FC BONDER
  • Implementation Methodologies ...(Continued)
  • Implementation Methodologies ...(Continued)
  • Implementation Methodology-Electroless Nickel-Gold FC
  • Process Enhancement-Texas Instruments
  • Process Enhancement-Valtronics
  • Process Enhancement-Henkel
  • Process Enhancement-Stud Bumping
  • Process Enhancement-Precise Flux Deposition Mechanism
• Limitations and Challenges
  • Spacing Constraints
  • Solder Processing Temperature and Material Restrictions
  • Costly Bumping Processes
  • Substrate Concerns
  • Underfill Process Trade-Offs
• Global Distribution of OSPT Services by Region
• Table 9 GLOBAL MARKET FORECAST FOR OSPT FC, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • MULTI-FUNCTIONAL INTEGRATION ON THE PACKAGE: MCM
    • Introduction
• Table 10 GLOBAL MARKET FORECAST FOR OSPT MCM, THROUGH 2011 ($ BILLIONS)
  • Applications and Case Studies
    • Case Study-IBM
    • Case Study-MCM in Optical Telecom Applications
    • Case Study-Orsys
• Table 11 GLOBAL MARKET FORECAST FOR OSPT MCM, DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)
• Figure 8 GLOBAL MARKET FORECAST FOR OSPT MCM, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)
  • Features and Benefits
    • Better Performance
    • Improved Signal Quality
    • Size Reduction
    • Economic Advantages
  • Implementation Methodologies and Process Enhancements
  • Implementation Methodology-Laminated MCM (MCM-L)
  • Implementation Methodology-Ceramic MCM (MCM-C)
    • Thick Film
    • High Temperature Co-fired Ceramic (HTCC)
    • Low Temperature Co-fired Ceramic (LTCC)
  • Implementation Methodology-Deposited MCM (MCM-D)
    • Classic Thin-Film
    • Silicon Thin-Film
    • Polymer Thin-Film
  • Limitations and Challenges
    • Performance Inefficiencies
    • Architectural Constraints
    • Electrical and Thermal Constraints
    • Cost Constraints
    • Test Constraints
  • Global Distribution of OSPT Sales by Region
• Table 12 GLOBAL MARKET FORECAST FOR OSPT MCM, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • MULTI-FUNCTIONAL INTEGRATION ON THE PACKAGE: SIP
    • Introduction
• Table 13 GLOBAL MARKET FORECAST FOR OSPT SIP, THROUGH 2011 ($ BILLIONS)
  • Applications and Case Studies
    • Case Study-Wi2Wi
    • Case Study-NEC
    • Case Study-ChipMOS
    • Case Study-Toshiba
• Figure 9 SIP IN ULTRA-THIN HARD DRIVE
• Figure 10 SIP IN MOBILE PHONE
• Table 14 GLOBAL MARKET FORECAST FOR OSPT SIP, DISTRIBUTION, BY SECTOR, THROUGH 2011 ($ BILLIONS)
• Figure 11 GLOBAL MARKET FORECAST FOR OSPT SIP, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)
  • Features and Benefits
    • Size Efficiency
    • Performance Enhancement
    • Design and Review Flexibility
    • Cost Advantage
    • Reduced Time-to-Market
  • Implementation Methodologies and Process Enhancements
• Figure 12 CROSS SECTIONS OF FC AND WIRE-BONDED SIPS
  • Limitations and Challenges
    • Limited Availability of Skills and Resources
    • Re-alignment of EDA Processes
    • Lack of KGD
    • Larger Package Size as Compared to SoC
    • Pressures on Wafering Process
• Table 15 GLOBAL MARKET FORECAST FOR OSPT SIP, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • MULTI-FUNCTIONAL INTEGRATION ON THE PACKAGE: POP
    • Introduction
• Table 16 GLOBAL MARKET FORECAST FOR OSPT POP, THROUGH 2011 ($ BILLIONS)
  • Applications and Case Studies
    • Case Study-STATS ChipPAC
    • Case Study-STMicroelectronics
    • Case Study-Toshiba America Electronic Components
• Table 17 GLOBAL MARKET FORECAST FOR OSPT POP, DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)
• Figure 13 GLOBAL MARKET FORECAST FOR OSPT POP, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)
  • Features and Benefits
    • Saving in Board Surface Area
    • Ease in System Design
    • Reduction in PCB Complexity
    • Enhanced Performance
    • Reduced Time-to-Market
  • Implementation Methodologies and Process Enhancements
• Figure 14 CROSS SECTION AND TOP VIEW OF PSVFBGA
  • Process Enhancement-IntelLimitations and Challenges
  • Conflict of Interests
  • Over Dependence on Solder Ball Material Characteristics
  • Pressure on PoP(d) Design
• Global Distribution of OSPT Sales by Region
• Table 18 GLOBAL MARKET FORECAST FOR OSPT POP, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • INDUSTRY ANALYSIS
• Table 19 GLOBAL MARKET FORECAST FOR SEMICONDUCTOR CHIPS TO ALL INDUSTRY SECTOR END PRODUCTS, THROUGH 2011 ($ BILLIONS)
• Table 20 SHARE OF TOTAL AND OUTSOURCED SEMICONDUCTOR PACKAGING AND SERVICES, THROUGH 2011 (%)
• Figure 15 SHARE OF TOTAL AND OUTSOURCED SEMICONDUCTOR PACKAGING AND SERVICES, 2004-2011 (%)
  • COMPETITION
  • CYCLICALITY
  • FUNDAMENTALS
    • DEMAND FLUCTUATIONS IN THE END PRODUCTS
    • CAPACITY UTILIZATION FLUCTUATIONS
    • PRICING PRESSURES
    • CHANGE IN MIX OF SEMICONDUCTOR PACKAGES
    • SHORT TERM CUSTOMER COMMITMENT DURATIONS
    • RAW MATERIAL AVAILABILITY AND PRICING FLUCTUATIONS
    • IP DISPUTES
    • NATURAL CALAMITIES
    • RISKS ASSOCIATED WITH OPERATIONS IN MULTIPLE NATIONS
  • BUYER/ SUPPLIER INTERPLAY
    • PACKAGING SERVICES
    • TESTING SERVICES
    • OSPT SERVICE PROVIDER-IDM INTERPLAY
  • RAW MATERIALS and value added components FOR ADVANCED PACKAGING
    • DIELECTRICS AND SUBSTRATES
      • Market Overview and Update
  • SOLDERS
    • Market Overview and Update
  • SOCKETS AND INTERCONNECTS
    • Market Overview and Update
  • UNDERFILLS
  • THERMAL MANAGEMENT SOLUTIONS
    • Market Overview and Update
  • WHY OUTSOURCE?
• Table 21 SHARES OF OSPT SERVICES AND IN-HOUSE SEMICONDUCTOR PACKAGING AND TESTING SERVICES MARKETS, THROUGH 2011 (%)
• Figure 16 SHARES OF OSPT SERVICES SALES AND IN-HOUSE SEMICONDUCTOR PACKAGING AND TESTING SERVICES MARKETS, 2004-2011 (%)
  • QUICKER TURNAROUND TIMES
  • FAVORABLE ECONOMIES OF SCALE
  • EMERGENCE OF ATTRACTIVE OUTSOURCING DESTINATIONS
  • FAVORABLE SUPPLY CHAIN
• MARKETS FOR OSPT SERVICES
  • END USER DEVICE APPLICATION MARKET BY SECTOR
• Table 22 GLOBAL SHARE FORECAST OF OSPT SALES, BY SECTOR, THROUGH 2011 (%)
• Figure 17 GLOBAL SHARE FORECAST OF OSPT SALES, BY SECTOR, 2004-2011 (%)
  • Application Market Analysis-Telecommunications
  • Application Market Analysis-Consumer Electronics
  • Application Market Analysis-PC
• Regional Markets
  • Table 23 GLOBAL MARKET SHARE FORECAST FOR OSPT SALES, BY REGION, THROUGH 2011 (%)
• Figure 18 GLOBAL MARKET SHARE FOR OSPT SALES, BY REGION, 2004-2011 (%)
  • Regional Market Analysis-APAC
    • South East Asian Region
    • China
• India
  • Regional Market Analysis-Americas
  • Regional Market Analysis-EMEA
  • DRIVERS
• PORTABILITY AND MINIATURIZATION OF DEVICES
• Table 24 CAGR COMPARISON-OSPT SALES VERSUS OSPT TELECOMMUNICATIONS SALES, THROUGH 2011
• Figure 19 CAGR COMPARISON-OSPT SALES VERSUS OSPT TELECOMMUNICATIONS SALES, 2006-2011 (CAGR%)
• SHRINKING TURNAROUND TIMES
• EMERGENCE OF THE APAC REGION
• Table 25 CAGR COMPARISON-OSPT SALES VERSUS OSPT APAC SALES THROUGH 2011 (CAGR%)
• Table 25 (CONTINUED)
• Figure 20 CAGR COMPARISON-OSPT SALES VERSUS OSPT APAC SALES, 2006-2011 (CAGR%)
• COST-EFFECTIVENESS OF ADVANCED PACKAGING SOLUTIONS
  • ASIC
  • SoC
  • Advantages of SiP and MCM
• Table 26 COMPARISON OF SALES OF ASIC, SOC, MCM AND SIP, THROUGH 2011 ($ BILLIONS)
• Figure 21 COMPARISON OF CAGRS OF ASIC, SOC, MCM AND SIP (CAGR%)
  • STANDARDS BODIES AND ROLE OF INDUSTRY CONSORTIA
    • HIGH DENSITY PACKAGING USER GROUP (HDPUG)
    • INTERNATIONAL ELECTRONICS MANUFACTURING INITIATIVE (INEMI)
    • JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (FORMERLY JOINT ELECTRON DEVICE ENGINEERING COUNCIL)
      • Jedec Solid State ...(Continued)
      • Microelectronics Packaging and Test Engineering Council (MEPTEC)
• REGULATORY CONDITIONS
  • U.S. REGULATIONS
  • ASIAN REGULATIONS
  • WASTE FROM ELECTRICAL AND ELECTRONIC EQUIPMENT (WEEE) DIRECTIVE
  • RESTRICTION ON HAZARDOUS SUBSTANCES (ROHS)
• CHALLENGES
  • IP RELATED DISPUTES
  • IP Related Disputes (Continued)
• CHALLENGES POSED BY REGULATIONS
  • Revamp of the Supply Chain
• Figure 22 TEMPERATURE PROFILE OF EUTECTIC AND PB-FREE SOLDERS
  • Semiconductor Company Strategies
  • Backward Compatibility
  • Wafer Bumping Challenges
• Figure 23 "LEAD FREE" SEAL
  • Tin Whiskers
• CASE STUDY-NATIONAL SEMICONDUCTOR
  • Case Study-National Semiconductor (Continued)
  • Case Study-National Semiconductor (Continued)
• STAKEHOLDER DETAILS
  • CRITERIA FOR STAKEHOLDER CLASSIFICATION
  • CRITICAL REASONS FOR INDIVIDUAL STAKEHOLDER SELECTION
    • CRITICAL REASONS FOR INDIVIDUAL...(CONTINUED)
    • CRITICAL REASONS FOR INDIVIDUAL...(CONTINUED)
    • CRITICAL REASONS FOR INDIVIDUAL...(CONTINUED)
    • CRITICAL REASONS FOR INDIVIDUAL...(CONTINUED)
  • STAKEHOLDER CLASSIFICATION SUMMARY
• Table 27 SUMMARY OF SUPPLIERS AND THEIR PRINCIPAL ACTIVITIES
• Table 27 (CONTINUED)
  • STAKEHOLDER Profiles
• ADVANCED INTERCONNECTIONS
  • Introduction
  • Packaging and Testing Function Value Additions
• ADVANCED SEMICONDUCTOR ENGINEERING (ASE)
  • Introduction
  • Packaging and Testing Function Value Additions
  • Customers
  • Financial Performance
• AMKOR TECHNOLOGIES, INC.
  • Introduction
  • Packaging and Testing Function Value Additions
    • Packaging and ... (Continued)
  • Customers
  • Locations of Operations
  • Financial Performance
• ANSOFT CORP.
  • Introduction
  • Packaging and Testing Function Value Additions
  • Packaging and Testing ... (Continued)
  • Customers
  • Financial Performance
• ASAT HOLDINGS
  • Introduction
  • Packaging and Testing Function Value Additions
  • Customers
  • Locations of Operations
  • Financial Performance
• BRIDGE SEMICONDUCTOR
  • Introduction
  • Packaging and Testing Function Value Additions
• CADENCE DESIGN SYSTEMS
  • Introduction
  • Packaging and Testing Function Value Additions
  • Locations of Operations
  • Financial Performance
• CHARTERED SEMICONDUCTOR MANUFACTURING
  • Introduction
  • Packaging and Testing Function Value Additions
  • Customers
  • Locations of Operations
  • Financial Performance
• CHIPMOS TECHNOLOGIES
  • Introduction
  • Packaging and Testing Function Value Additions
  • Customers
  • Locations of Operations
  • Financial Performance
• FLIPCHIP INTERNATIONAL (FCI)
  • Introduction
  • Packaging and Testing Function Value Additions
    • Packaging and Testing ... (Continued)
  • Customers
  • Locations of Operations
  • Financial Performance
• FUJITSU, LTD.
  • Introduction
  • Packaging and Testing Function Value Additions
  • Locations of Operations
  • Financial Performance
• IBM
  • Introduction
  • Packaging and Testing Function Value Additions
  • Financial Performance
• INTEL
  • Packaging and Testing Function Value Additions
  • Financial Performance
• MICRON TECHNOLOGY, INC.
  • Introduction
  • Packaging and Testing Function Value Additions
  • Financial Performance
• M-SYSTEMS (ACQUIRED BY SANDISK)
  • Introduction
  • Packaging and Testing Function Value Additions
  • Financial Performance
• NATIONAL SEMICONDUCTOR CORP.
  • Introduction
  • Packaging and Testing Function Value Additions
  • Locations of Operations
  • Financial Performance
• NEOCONIX, INC.
  • Introduction
  • Packaging and Testing Function Value Additions
  • Locations of Operations
• PSI Technologies Holdings
  • Introduction
  • Packaging and Testing Function Value Additions
  • Customers
  • Locations of Operations
  • Financial Performance
• SAMSUNG SEMICONDUCTOR, INC.
  • Introduction
  • Packaging and Testing Function Value Additions
  • Locations of Operations
  • Financial Performance
• SILICONWARE PRECISION INDUSTRIES (SPIL)
  • Introduction
  • Packaging and Testing Function Value Additions
  • Packaging And Testing ... (Continued)
  • Locations of Operations
  • Financial Performance
• STMICROELECTRONICS (ST)
  • Introduction
  • Packaging and Testing Function Value Additions
  • Customers
  • Locations of Operations
  • Financial Performance
• STAKTEK
  • Introduction
  • Packaging and Testing Function Value Additions
  • Customers
  • Locations of Operations
  • Financial Performance
• STATS CHIPPAC
  • Introduction
  • Packaging and Testing Function Value Additions
  • Packaging and Testing ... (Continued)
  • Packaging and ...(Continued)
  • Financial Performance
• SYNOPSYS
  • Introduction
  • Packaging and Testing Function Value Additions
  • Customers
  • Financial Performance
• TESSERA TECHNOLOGIES
  • Introduction
  • Packaging and Testing Function Value Additions
  • Packaging and ...(Continued)
  • Figure 24 WLP FOR IMAGE SENSORS
  • Customers
  • Financial Performance
• TOSHIBA AMERICA ELECTRIC COMPONENTS AND SEMICONDUCTORS (TAEC)
  • Introduction
  • Packaging and Testing Function Value Additions
  • Financial Performance
• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TSMC)
  • Introduction
  • Packaging and Testing Function Value Additions
  • Locations of Operations
  • Financial Performance
• UNITED MICROELECTRONICS CORP.
  • Introduction
  • Packaging and Testing Function Value Additions
  • Financial Performance
• XRADIA
  • Introduction
  • Packaging and Testing Function Value Additions
  • Financial Performance
• U.S. PATENT ANALYSIS
  • INTRODUCTION
  • GENERAL TRENDS
• Table 28 ADVANCED ELECTRONIC PACKAGING TECHNIQUES: U.S. PATENT TRENDS, 1976-2006
• TRENDS BY COUNTRY
• Figure 25 SHARES OF U.S. PATENTS RELATED TO ADVANCED ELECTRONIC PACKAGING TECHNIQUES, BY COUNTRY, 1976-2006
• Figure 25 (CONTINUED)
  • TRENDS BY ASSIGNEE
• Table 29 ASSIGNEES OF 10 OR MORE U.S. PATENTS RELATED TO ADVANCED ELECTRONIC PACKAGING, 1976-2006
• TRENDS BY CATEGORY
• Table 30 CLASSIFICATION OF U.S. PATENTS RELATED TO ADVANCED ELECTRONIC PACKAGING BY CATEGORY, 1976-2006
• LIST OF TABLES
  • Summary Table:
  • GLOBAL MARKET FOR IN-HOUSE AND OUTSOURCED PACKAGING AND TESTING, THROUGH 2011 ($ BILLIONS)Table 1 GLOBAL MARKET FORECAST FOR OSPT CSP/WLP SALES, THROUGH 2011 ($ BILLIONS)
  • Table 2 GLOBAL MARKET FORECAST FOR OSPT CSP, BY SECTOR, THROUGH 2011 ($ BILLIONS)
  • Table 3 GLOBAL MARKET FORECAST FOR OSPT CSP: DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • Table 4 GLOBAL MARKET FORECAST FOR OSPT BGA SALES, THROUGH 2011 ($ BILLIONS)
  • Table 5 GLOBAL MARKET FORECAST FOR BGA: DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)
  • Table 6 GLOBAL MARKET FORECAST FOR OSPT BGA, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • Table 7 GLOBAL MARKET FORECAST FOR OSPT FC, THROUGH 2011 ($ BILLIONS)
  • Table 8 GLOBAL MARKET FORECAST FOR OSPT FC, DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)
  • Table 9 GLOBAL MARKET FORECAST FOR OSPT FC, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • Table 10 GLOBAL MARKET FORECAST FOR OSPT MCM, THROUGH 2011 ($ BILLIONS)
  • Table 11 GLOBAL MARKET FORECAST FOR OSPT MCM, DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)
  • Table 12 GLOBAL MARKET FORECAST FOR OSPT MCM, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • Table 13 GLOBAL MARKET FORECAST FOR OSPT SIP, THROUGH 2011 ($ BILLIONS)
  • Table 14 GLOBAL MARKET FORECAST FOR OSPT SIP, DISTRIBUTION, BY SECTOR, THROUGH 2011 ($ BILLIONS)
  • Table 15 GLOBAL MARKET FORECAST FOR OSPT SIP, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • Table 16 GLOBAL MARKET FORECAST FOR OSPT POP, THROUGH 2011 ($ BILLIONS)
  • Table 17 GLOBAL MARKET FORECAST FOR OSPT POP, DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)
  • Table 18 GLOBAL MARKET FORECAST FOR OSPT POP, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)
  • Table 19 GLOBAL MARKET FORECAST FOR SEMICONDUCTOR CHIPS TO ALL INDUSTRY SECTOR END PRODUCTS, THROUGH 2011 ($ BILLIONS)
  • Table 20 SHARE OF TOTAL AND OUTSOURCED SEMICONDUCTOR PACKAGING AND SERVICES, THROUGH 2011 (%)
  • Table 21 SHARES OF OSPT SERVICES AND IN-HOUSE SEMICONDUCTOR PACKAGING AND TESTING SERVICES MARKETS, THROUGH 2011 (%)
  • Table 22 GLOBAL SHARE FORECAST OF OSPT SALES, BY SECTOR, THROUGH 2011 (%)
  • Table 23 GLOBAL MARKET SHARE FORECAST FOR OSPT SALES, BY REGION, THROUGH 2011 (%)
    • Table 24 CAGR COMPARISON-OSPT SALES VERSUS OSPT TELECOMMUNICATIONS SALES, THROUGH 2011
  • Table 25 CAGR COMPARISON-OSPT SALES VERSUS OSPT APAC SALES THROUGH 2011 (CAGR%)
  • Table 26 COMPARISON OF SALES OF ASIC, SOC, MCM AND SIP, THROUGH 2011 ($ BILLIONS)
  • Table 27 SUMMARY OF SUPPLIERS AND THEIR PRINCIPAL ACTIVITIES
  • Table 28 ADVANCED ELECTRONIC PACKAGING TECHNIQUES: U.S. PATENT TRENDS, 1976-2006
  • Table 29 ASSIGNEES OF 10 OR MORE U.S. PATENTS RELATED TO ADVANCED ELECTRONIC PACKAGING, 1976-2006
  • Table 30 CLASSIFICATION OF U.S. PATENTS RELATED TO ADVANCED ELECTRONIC PACKAGING BY CATEGORY, 1976-2006
• LIST OF FIGURESSummary Figure:
  • GLOBAL MARKET FOR IN-HOUSE AND OUTSOURCED PACKAGING AND TESTING SALES, 2006 AND 2011 ($ BILLIONS)
  • Figure 1 POSITION OF PACKAGING AND TESTING IN SEMICONDUCTOR MANUFACTURING CYCLE
  • Figure 2 GLOBAL MARKET FORECAST FOR OSPT CSP, BY SECTOR, 2004-2011 ($ BILLIONS)
  • Figure 3 WLP CROSS SECTION
  • Figure 4 WLP-COMPLIANT LAYER
  • Figure 5 GLOBAL MARKET FORECAST FOR BGA, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)
  • Figure 6 GLOBAL MARKET FORECAST FOR OSPT FC, DISTRIBUTION, BY SECTOR, 2004-2011 ($ BILLIONS)
  • Figure 7 OERLIKON MICRON5003 FC BONDER
  • Figure 8 GLOBAL MARKET FORECAST FOR OSPT MCM, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)
  • Figure 9 SIP IN ULTRA-THIN HARD DRIVE
  • Figure 10 SIP IN MOBILE PHONE
  • Figure 11 GLOBAL MARKET FORECAST FOR OSPT SIP, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)
  • Figure 12 CROSS SECTIONS OF FC AND WIRE-BONDED SIPS
  • Figure 13 GLOBAL MARKET FORECAST FOR OSPT POP, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)
  • Figure 14 CROSS SECTION AND TOP VIEW OF PSVFBGA
  • Figure 15 SHARE OF TOTAL AND OUTSOURCED SEMICONDUCTOR PACKAGING AND SERVICES, 2004-2011 (%)
  • Figure 16 SHARES OF OSPT SERVICES SALES AND IN-HOUSE SEMICONDUCTOR PACKAGING AND TESTING SERVICES MARKETS, 2004-2011 (%)
  • Figure 17 GLOBAL SHARE FORECAST OF OSPT SALES, BY SECTOR, 2004-2011 (%)
  • Figure 18 GLOBAL MARKET SHARE FOR OSPT SALES, BY REGION, 2004-2011 (%)
  • Figure 19 CAGR COMPARISON-OSPT SALES VERSUS OSPT TELECOMMUNICATIONS SALES, 2006-2011 (CAGR%)
  • Figure 20 CAGR COMPARISON-OSPT SALES VERSUS OSPT APAC SALES, 2006-2011 (CAGR%)
  • Figure 21 COMPARISON OF CAGRS OF ASIC, SOC, MCM AND SIP (CAGR%)
  • Figure 22 TEMPERATURE PROFILE OF EUTECTIC AND PB-FREE SOLDERS
  • Figure 23 "LEAD FREE" SEAL
  • Figure 24 WLP FOR IMAGE SENSORS
  • Figure 25 SHARES OF U.S. PATENTS RELATED TO ADVANCED ELECTRONIC PACKAGING TECHNIQUES, BY COUNTRY, 1976-2006