Connector Industry Roadmap Report

Table of Contents

Executive Summary

• S.1 Findings
• S.2 Forecast
• S.3 Market Trends
• S.4 Technology Trends
• S.5 Product Roadmaps
• S.6 Categories
• Tables
  • S.1 Connector Barriers
  • S.2 Industry Trends 1985-2015
  • S.3 Industry Trends ? Bar Chart
  • S.4 Sales by Market 1999-2009
  • S.5 Mech. Parameters
  • S.6 IC Socket Roadmap Example

Overview

• O.1 Introduction
• O.1 Interconnect Level
• O.2 Market Segments
• O.3 Connector Designs
• O.4 Business Forces
• O.5 Roadmap
• O.6 Industry Trends
• O.7 Outsourcing
• O.8 Major Trends
• O.9 Critical Areas NA, EU, JP
• O.10 US Gov Initiatives
• O.11 NEMI Roadmap

Chapter 1 - Technology Trends:

• 1.1 Connectors vs Other Comp.
• 1.2 Connecting Circuits
• 1.3 Electrical vs Electronic
• 1.4 Simpler Technology
• 1.5 Industry Standards
• 1.6 Electronics Technology
• 1.7 Moore's Law
• 1.8 Applications
• 1.9 Core Technologies
• 1.10 Mfg trends
• 1.11 Technology Roadblocks
• 1.12 Key Areas for Development
• 1.13 Key Takeaways
• Tables
  • 1.1 Design Pressures

Chapter 2 - Technology Road Mapping

• 2.1 What is a Roadmap
• 2.2 Roadmap Examples
• 2.3 Why Roadmap Long Term
• 2.4 Trade Secret Issues
• 2.5 Best Use of Roadmaps
• 2.6 Fundamentals of Road Mapping
• 2.7 Solving Real Problems - iNEMI
• 2.8 Connector Roadmap Outline
• 2.9 Sandia Labs Report
• Tables
  • 2.1 Packaged MPU Chips
  • 2.2 Processor Socket Roadmap
  • 2.3 MPU Roadmap
  • 2.4 Portable Sys Connector Roadmap
  • 2.5 Memory Socket Example

Chapter 3 - Industry Trends

• 3.1 Scope
• 3.2 Definition
• 3.3 Market Characteristics
• 3.4 Future Market Characteristics
• 3.5 Market Size & Scope
• 3.6 Regional Mix
• 3.7 Long Term Growth Rates
• 3.8 IC vs Connector Market Performance.
• 3.9 Connector Markets 2004, 2009
• 3.10 Market Segment Trends
• 3.11 Regional Dynamics
• 3.12 Engineering Location Trends
• 3.13 Survey - Key Roadmap Trends
• 3.14 Key Trends & Roadblocks
• 3.15 Summary of Connector Trends
• 3.16 Other Key Points
• 3.17 Connectors in Wireless World
• 3.18 Connector Background
• 3.19 Outsourcing
• 3.20 Barriers to North Amer. Mfg
• 3.21 Forecast Scenarios 1985-2015
• Tables
  • 3.1 Worldwide Connector Sales 2004-5
  • 3.2 Connector Sales by Region 2005
  • 3.3 % - 5 Yr Increments 1980-2010
  • 3.4 $ - 5 Yr Growth Rates 1980-2005
  • 3.5 $ 35 Yr Growth Cyclical 1980-2015
  • 3.6 World Semi vs Connector Revenues
  • 3.7 Industry Sales Performance. '95-05
  • 3.8 Semi vs Connector Yr-Yr Change
  • 3.9 Yr-Yr Change by Month
  • 3.10 Connector Markets 2004
  • 3.11 Connector Markets 2009
  • 3.12 Sales Performance by Market 1999-2009
  • 3.13 Global Sales by Market 1999-2009
  • 3.14 Market Trends 01-05 vs. 05-09
  • 3.15 Trends in OEM Markets
  • 3.16 Taiwan IT Hardware Prod. in China
  • 3.17 % Connector Engrg by Region
  • 3.18 Roadmap Trends ? Survey Results
  • 3.19 Mechanical Parameters 1985-2015
  • 3.20 Connector Type Summary
  • 3.21 Key Issues by Type
  • 3.22 WiFi Bluetooth Penetration '05-'10
  • 3.23 Offshoring of NA Assy 2000-'15
  • 3.24 1985-2015 Forecast - Optimistic
  • 3.25 1985-2015 Forecast ? Nominal
  • 3.26 1985-2015 Forecast - Recession
  • 3.27 Forecasting Turbulence
  • 3.28 Forecasting Paradigms

Chapter 4 - Product Roadmaps

• 4.1 Test Sockets
• 4.2 Burn-In Sockets
• 4.3 IC Sockets for Production
• 4.4 Memory Sockets DIMM
• 4.5 Memory Sockets SODIMM
• 4.6 Intel Motherboards
• 4.7 Memory Card Receptacles
• 4.8 PCB Connectors ? PCI Express
• 4.9 PCB New Card/Express Card
• 4.10 Generic PC Board Connectors
• 4.11 Min Wire-to-Board FEC/FPC
• 4.12 Other WTB Connectors
• 4.13 Min Board Stacking
• 4.14 2mm Backplane Connectors
• 4.15 High Performance. Backplane Conn.
• 4.16 Fiber Optic Connectors
• 4.17 RF Coaxial Connectors
• 4.18 Electronic Power Connectors
• 4.19 PCB Terminal Blocks
• 4.20 IEC/NEMI Terminal Blocks
• 4.21 RJ11-45 IO Connectors
• 4.22 Ind. Ethernet Connectors
• 4.23 Automotive Connectors
• 4.24 USB/IEEE1394 IO Connectors
• 4.25 WiFi Bluetooth Penetration
• 4.26 More on Backplanes
• Tables
  • 4.1 Test Sockets
  • 4.2 Burn-In Sockets
  • 4.3 IC Sockets for Production
  • 4.4 Memory Sockets DIMM
  • 4.5 Memory Sockets SODIMM
  • 4.6 Intel Motherboards
  • 4.7 Memory Card Receptacles
  • 4.8 PCB Connectors ? PCI Express
  • 4.9 PCB New Card/Express Card
  • 4.10 Generic PC Board Connectors
  • 4.11 Min Wire-to-Board FEC/FPC
  • 4.12 Other WTB Connectors
  • 4.13 Min Board Stacking
  • 4.14 2mm Backplane Connectors
  • 4.15 High Performance. Backplane Conn.
  • 4.16 Fiber Optic Connectors
  • 4.17 RF Coaxial Connectors
  • 4.18 Electronic Power Connectors
  • 4.19 PCB Terminal Blocks
  • 4.20 IEC/NEMI Terminal Blocks
  • 4.21 RJ11-45 IO Connectors
  • 4.22 Ind. Ethernet Connectors
  • 4.23 Automotive Connectors
  • 4.24 USB/IEEE1394 IO Connectors
  • 4.25 WiFi Bluetooth Penetration
  • 4.26 Industry Standards - Backplanes
  • 4.27 Impact of SMT
  • 4.28 Market Forecast 2001-2006
  • 4.29 Captive vs Outsourced Backplanes
  • 4.30 Backplane Pricing Trend
  • 4.31 Connectorized BP Roadmap

Chapter 5 - Forecast

• Tables
  • 5.1 1985-2015 Forecast - Optimistic
  • 5.2 1985-2015 Forecast - Nominal
  • 5.3 1985-2015 Forecast - Recessionary
  • 5.4 1985-2015 Comparisons
  • 5.5 1985-2015 Cyclical Growth
  • 5.6 Market Segment Performance. 2000-05
  • 5.7 Market Segment Performance. 2005-10
  • 5.8 Market Segment Performance. 2010-15

Chapter 6 - Electronics Market Roadmap

• 6.1 World Economic Trends
• 6.2 Automotive
• 6.3 Aerospace/Defense Systems
• 6.4 Board Assembly
• 6.5 Consumer Electronics
• 6.6 Digital Silicon
• 6.7 Displays
• 6.8 MEMS/Micro-Interconnect
• 6.9 Energy Storage - Batteries
• 6.10 Environmental Electronics
• 6.11 Final Assembly
• 6.12 Interconnect Substrates - PCBs
• 6.13 Interconnect Substrates ? Ceramic
• 6.14 Large Business Systems
• 6.15 Mass Data Storage
• 6.16 Modeling Simulation Design Tools
• 6.17 Fiber Optics
• 6.18 Electronic Packaging
• 6.19 Passive Devices
• 6.20 Portable Products
• 6.21 Thermodynamics
• Tables
  • 6.1 GDP + Exchange Rates 2003-05
  • 6.2 Per Capita Incomes 2005
  • 6.3 China Auto Exports 2000-2010
  • 6.4 Selected PCB Parameters 2003-15
  • 6.5 NA & World Consumer 2002-14
  • 6.6 Package Attributes 2003-15
  • 6.7 CE Market Segments 2005-15
  • 6.8 Top 20 Worldwide OEMs
  • 6.9 Cell Phone Shipments 2002-15
  • 6.10 On Chip Interconnects 2003-15
  • 6.11 Chip Package Roadmap 2001-15
  • 6.12 Semicon vs Connector $ 1980-15
  • 6.13 Industry Sales Performanceorm. 1995-05
  • 6.14 Display Market 2005-10
  • 6.15 Battery Market Dynamics
  • 6.16 Environmental Needs
  • 6.17 Current PCB Mfg Capability
  • 6.18 HDD Market 2005
  • 6.19 Areal Density 1970-2010
  • 6.20 Simulation Focus Areas
  • 6.21 Periph Bus Speed 2005-15
  • 6.22 IC Package IO Count 2005-15
  • 6.23 IPD Features
  • 6.24 Portable Roadmap 2003-15
  • 6.25 Notebook PC Wattage