Abstract
Bishop and Associates, Inc. has just released a new 15 chapter research report
providing a complete analysis of Evolving High-Speed Connectors. This new
report details backplane, midplane, and mezzanine connectors as well as
high-speed backplane cable assemblies. Connector values are provided for each
category for the years 2004, 2005, 2006, and 2010, as well as each region of
the world.
The market for high-speed connectors has experienced extensive changes over
the past two years from both the technology, as well as business perspectives.
This report includes background information on the evolution of high-speed
circuits and connectors, and includes data on key electrical and mechanical
characteristics for each of the leading interfaces on the market today. The
influences of printed circuit board designs, materials, and advanced silicon
chips on multigigabit circuit performance are reviewed. Advances in circuit
modeling and simulation along with performance testing methods are also
covered. Common applications as well as the future direction of the market is
discussed along with statistical data on market size and forecasts by
bandwidth, end user, and region of the world.
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