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[Report]

Evolving High Speed Connectors

Published: 2006/08

Contact 24 hrs/day
Description

Table of Contents

Chapter 1 - Report Scope and Methodology

  • Report objectives
  • Study methodology
  • Data collection forms
  • Connector manufacturer survey
  • Connector user survey

Chapter 2 - Introduction and Definitions

  • Preface
  • Introduction
  • Connector definitions / technologies

Chapter 3 - High Speed Connector Basics

  • Common backplane architectures
  • High-speed transmission line issues
  • Defining features of high speed connectors
  • The second sourcing imperative
  • Performance measurement systems

Chapter 4 - The Need for Speed

  • Market drivers to higher speed interfaces
  • Speed vs. density
  • The influence of industry standards
  • Market trends

Chapter 5 - High Speed Interconnect System Elements

  • Driver and receiver technology
  • Printed circuit board materials
  • Printed circuit board design and fabrication

Chapter 6 - Overview of current high-speed backplane/midplane connectors

  • Amphenol TCS - VHDM, VHDM-HSD, GbX,
  • Ventura, Aptera, Crossbow
  • ERNI Components - ERmet ZD, ERmet zeroXT
  • FCI - Metral 4000, AirMax VS
  • Hirose - Hx2
  • 3M- HSHM
  • Molex - VHDM, VHDM-HSD
  • Tyco Electronics -HS3, HM Zd, MultiGig RT
  • Micro TCA Connectors

Chapter 7 - High-Speed Mezzanine Connectors

  • Mezzanine connector architecture
  • Advantages of mezzanine packaging
  • Interface types/ configurations
  • Mezzanine connector applications
  • The role of standards

Chapter 8 - Overview of current High-Speed Mezzanine Connectors

  • Amphenol TCS - VHDM Stacker, NeXLev
  • ERNI - MicroSpeed, Stacking ERmet Zd
  • FCI - Meg / Gig Array, Stacking AirMax VS
  • Fujitsu - MicroGiGaCN
  • HARTING - AMC Connector
  • Hirose - IT1, IT-2, IT-4 Series
  • Interconnect Systems - HILo
  • Molex - Plateau HS Mezz, AMC connector
  • Samtec - Rise-Up, Q Pairs, Sam Array
  • Tyco Electronics - Mictor, STEP-Z, AMC
  • Yamaichi Electronics - AMC

Chapter 9 - High-Speed Backplane Cable Assemblies

  • Bringing Cable to the backplane
  • Cable assembly characteristics
  • Typical applications

Chapter 10 - Overview Of Selected High-Speed Backplane Cable Assembly Suppliers

  • WL Gore & Associates
  • Meritec
  • Molex
  • Samtec
  • Sanmina SCI
  • Tensolite
  • Tyco Electronics
  • Other suppliers

Chapter 11 - Connector Design Features

  • Introduction
  • Backplane Connectors
  • Amphenol TCS - Aptera L Series
  • Amphenol TCS -CrossBow 2mm+
  • Amphenol TCS - GbX1
  • Amphenol TCS - GbX- L Series
  • Amphenol TCS - GbX -E Series
  • Amphenol TCS - Ventura
  • Amphenol TCS - VHDM - H Series
  • ERNI - ERmet Zero XT
  • FCI - Metral 40001
  • FCI - AirMax VS1
  • Hirose - HX-2
  • Tyco - Z-Pack HS-3
  • Tyco - Z-Pack HM-Zd
  • Tyco - Z-Pack Max
  • Tyco - MultiGig RT
  • 3M - Met Pak HSHM
  • Orthogonal Midplane Connectors
  • Amphenol TCS - CrossBow Matrix
  • Tyco - Z-Pack Max Orthogonal
  • Mezzanine Connectors
  • Amphenol TCS - VHDM Stacker
  • Amphenol TCS - NexLev
  • ERNI - MicroSpeed
  • FCI - Meg-Array
  • FCI - Gig-Array
  • Fujitsu - MicroGigaCN
  • Hirose - IT-2 Series
  • Hirose - IT-4 Series
  • Molex - Plateau HS Mezz
  • Samtec - Q Series
  • Samtec - Sam Array
  • Samtec - DP Array
  • Samtec - SeaRay
  • Tyco - Mictor
  • Tyco - 05 FH Shielded Giga
  • High Speed Cable Assemblies
  • Comparison of physical attributes
  • Comparison of electrical performance

Chapter 12 - Market Analysis / Forecasts

  • Measurement criteria
  • High-Speed backplane / midplane connectors
  • World market 2004 -2010 by bandwidth segment
  • World market 2004 - 2010 by geographic region
  • World market 2004 - 2010 by end user
  • High Speed Mezzanine Connectors
  • World market 2004 -2010 by bandwidth segment
  • World market 2004 -2010 by geographic region
  • World market 2004 -2010 by end user
  • High Speed Copper Cable Assemblies
  • World market 2004 -2010 by bandwidth segment
  • World market 2004 -2010 by geographic region
  • World market2004 -2010 by end user

Chapter 13 - The Fiber Optic Option

  • Fiber optic backplane development status

Chapter 14 - High-Speed connector innovation

  • Efficere Technologies
  • Particle interconnects
  • SiliconPipe contact design
  • Foxconn FX-VMP Orthogonal connector

Chapter 15 - Major Findings And Conclusions

Appendix - List Of Contributors

Description

[Report]
Evolving High Speed Connectors
Published: 2006/08
Published by : Bishop & Associates, Inc. Bishop & Associates, Inc.

Price:
US $ 4,550.00 PDF on CD-ROM (Multi-User Corporate License) & Hard Copy
US $ 3,850.00 Hard Copy + 1 Additional Print Copy
US $ 3,500.00 Hard Copy
>
Product Code : BS43963
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