Abstract
Bishop and Associates has just released the new ten-chapter research report
analyzing Power Connectors For The Computer And Communications Markets. This
comprehensive report provides detail on all aspects of the computer and
communication power connector market, including connector statistics by
region, market, power rating and connector type the years 2005-2006 and 2011
(including five-year CAGRs).
Beyond detailing the factors that are driving the increase in power demand,
this new report includes detailed data covering contact physics, power
connector types, test methodology, the status of industry standards that
define power connectors, as well as connector failure mechanisms. The issue
of thermal management along with current and anticipated cooling options is
discussed. A detailed review of existing as well as recently introduced power
connectors from 17 leading suppliers is also included.
Market demand for products that offer greater functionality and faster
processing speed while consuming less space has been the mantra driving the
electronics industry for many years. Satisfying these objectives have
resulted in remarkable improvements in performance and packaging density, but
have also created new challenges in managing increasing levels of power as
well as resulting heat. Individual processors can draw several hundred watts
driving ambient temperatures within the box to levels that can raise serious
concerns about system reliability. Closely space daughtercards packed with
heat generating devices pose serious challenges to traditional passive and fan
based cooling schemes. The semiconductor industry has recognized the threat
that power and heat pose to the continuation of Moore' s Law, and are
developing new devices that feature reduced power consumption. Multi-core
processors for instance can run at slower, less power intensive speeds while
increasing processing throughput. Current trends indicate that power
reduction at the device level will only slow the overall rate of increase at
the system level. The need for efficient power distribution in this
environment is having a significant impact on the design and application of
connectors for next generation equipment.
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