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[Report]

Bluetooth 2007: Silicon Integration and New Standards Complicate the Worldwide Market

Published: 2007/07

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Table of Contents

Abstract

Summary

Bluetooth had another successful year in 2006, and will have continued success in 2007. Mobile phones continued to be the dominant application for Bluetooth in 2006, representing over three-quarters of Bluetooth-enabled device shipments. Mono headsets and notebook PCs were the next largest applications.

The Bluetooth silicon market is beginning to see some consolidation, as larger silicon vendors add new capabilities, such as Wi-Fi and GPS, to their chip portfolios, either by internal development or acquisition. The goal is to create combined radio silicon that is being demanded by mobile phone vendors. In addition, new standards, such as Ultra Low Power (ULP) Bluetooth (also known as Wibree) and high data rate Bluetooth (also called Bluetooth 3.0) are coming.

This report contains analysis and five-year forecasts for all Bluetooth-enabled products, including those in the PC, Communications, CE, Automotive, and Industrial/Medical segments. Annual Bluetooth chip shipments and revenue forecasts by Bluetooth type through 2011 are also provided, including shipment and revenue forecasts for Bluetooth over UWB and ULP Bluetooth silicon. In addition, the report also contains responses on Bluetooth and wireless headsets from three separate In-Stat surveys: domestic phone and web surveys, and an international web survey of Japanese, Korean, German, French, and British consumers. Brief profiles of major Bluetooth silicon suppliers are also provided.

Table of Contents

[Report]
Bluetooth 2007: Silicon Integration and New Standards Complicate the Worldwide Market
Published: 2007/07
Published by : In-Stat In-Stat

Price:
US $ 3,495.00 PDF and Excel File by E-mail (Single User License)
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Product Code : CG53895
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