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[Report]

Semiconductor Manufacturing Capacity Trends in Asia

Published: 2007/12

Contact 24 hrs/day
Description

Table of Contents

  • Executive Summary
  • Introduction
  • Asia Foundry Overview
    • Factors Driving Semiconductor Capacity in Asia
  • 300mm Fabs in Asia
  • Semiconductor Process Development Alliances and Joint Ventures
  • Asia Capex Overview
    • Asia Semiconductor Manufacturing Capacity by Country, 2006- 2011
    • Asia Semiconductor Manufacturing Capacity
  • Foundry Process Technology Comparison
  • Taiwan Semiconductor Manufacturing Overview
    • TSMC
    • UMC
    • Powerchip Semiconductor Corporation (PSC)
    • ProMOS Technologies
    • Winbond
    • Nanya Technology and Inotera Memory
  • South Korea Semiconductor Manufacturing Overview
    • Samsung
    • Hynix
    • MagnaChip
    • DongbuAnam
      • Drivers
      • Challenges
  • China Semiconductor Manufacturing Overview
    • SMIC
      • Drivers
      • Challenges
  • Singapore Semiconductor Manufacturing Overview
    • Chartered
      • Drivers
      • Challenges
  • Japan Semiconductor Manufacturing Overview
    • Drivers
    • Challenges
  • Malaysia Semiconductor Manufacturing Overview
    • Drivers
    • Challenges
  • Others
    • India
      • Drivers
      • Challenges
    • Vietnam
      • Drivers
      • Challenges
  • Conclusion
  • Methodology
  • Related In-Stat Reports

List of Tables

  • Table 1. Asia 300mm Fabs, 2006
  • Table 2. Asia Upcoming 300mm Fabs
  • Table 3. Asia Foundry Capital Expenditure, 2003- 2007, (US$ in Billions)
  • Table 4. Asia Memory Capital Expenditure, 2003- 2007 (US$ in Billions)
  • Table 5. TSMC Fabs Overview
  • Table 6. TSMC Process Technology Trend, 2003- 2007
  • Table 7. UMC Fabs Overview
  • Table 8. UMC Process Technology Trend, 2003- 2007
  • Table 9. Taiwan Memory Fabs Overview
  • Table 10. Samsung Fabs Overview
  • Table 11. Hynix Fabs Overview
  • Table 12. MagnaChip Fabs Overview
  • Table 13. DongbuAnam Fabs Overview
  • Table 14. SMIC Fabs Overview
  • Table 15. SMIC Process Technology Trend, 2003- 2007
  • Table 16. Other Leading Fabs in China
  • Table 17. Chartered Fabs Overview
  • Table 18. Chartered Process Technology Trend, 2003- 2007
  • Table 19. Singapore Other Leading Fabs
  • Table 20. Japan 300mm Fabs Overview
  • Table 21. Malaysia Fabs Overview

List of Figures

  • Figure 1. Asia Semiconductor Manufacturing Capacity, 2006 (200mm-eq. Wafers⁄Month, in Thousands)
  • Figure 2. 300mm Wafer Share in Asia Semiconductor Manufacturing Capacity, 2006 (in 200mm-eq. Wafers)
  • Figure 3. Asia Foundry Capital Expenditure, 2003- 2007, (US$ in Billions)
  • Figure 4. Asia Memory Capital Expenditure, 2003- 2007, (US$ in Billions)
  • Figure 5. Asia Semiconductor Manufacturing Capacity, 2006- 2011 (200mm-eq. Wafers⁄Month, in Thousands)
  • Figure 6. Foundry Capacity Comparison by Process Technology, 2006
  • Figure 7. Taiwan Semiconductor Manufacturing Capacity, 2006- 2011 (200mm-eq. Wafers⁄Month, in Thousands)
  • Figure 8. TSMC Process Technology Trend, 2003- 2007
  • Figure 9. UMC Process Technology Trend, 2003- 2007
  • Figure 10. South Korea Semiconductor Manufacturing Capacity, 2006- 2011 (200mm-eq. Wafers⁄Month, in Thousands)
  • Figure 11. China Semiconductor Manufacturing Capacity, 2006- 2011 (200mm-eq. Wafers⁄Month, in Thousands)
  • Figure 12. SMIC Process Technology Trend, 2003- 2007
  • Figure 13. Singapore Semiconductor Manufacturing Capacity, 2006- 2011 (200mm-eq. Wafers⁄Month, in Thousands)
  • Figure 14. Chartered Process Technology Trend, 2003- 2007
  • Figure 15. Japan Semiconductor Manufacturing Capacity, 2006- 2011 (200mm-eq. Wafers⁄Month, in Thousands)
  • Figure 16. Malaysia Semiconductor Manufacturing Capacity, 2006- 2011 (8-inch-eq. Wafers⁄Month, in Thousands)
Description

[Report]
Semiconductor Manufacturing Capacity Trends in Asia
Published: 2007/12
Published by : In-Stat In-Stat

Price:
US $ 2,995.00 PDF and Excel File by E-mail (Single User License)
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Product Code : CG58176
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