Abstract
This report analyzes the worldwide markets for Thin Layer Deposition Equipment in Millions of US$. The major product segments analyzed are Physical Vapor Deposition (PVD) Equipment (Microelectronics, Cutting Tools, Industrial, Specialty Packaging, Storage, Optics, and Medical), and Chemical Vapor Deposition (CVD) Equipment(Microelectronics, Cutting Tools, Industrial, and Medical). The End-use segments discussed include Microelectronics, Cutting Tools, Industrial Applications, Specialty Packaging, Data Storage, Optoelectronic Components, and Medical Technology Applications. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period of 2001 through 2010. A ten-year historic analysis is also provided for these markets with annual market analytics. The report profiles 95 companies including players such as AIXTRON, Applied Materials, ASM International N.V., Axcelis Technologies, Inc., Canon ANELVA Corporation, BOC Edwards, CHA Industries, CVD Equipment Corporation, Denton Vacuum, IBIS Technology Corporation, Implant Sciences Corp., IONBOND, INC., Jusung Engineering Co., Ltd., KDF Electronic & Vacuum Services, Kokusai Semiconductor Equipment Corporation, Kookje Electric, Novellus Systems, Inc., RIBER SA, Seki Technotron, Silicon Genesis Corporation, Sumitomo Eaton Nova Corp., Tecvac Ltd., Tegal Corporation, Ti-Coating, Inc., Tokyo Electron Ltd., Ultramet, ULVAC Technologies, Inc., Unaxis Holding AG, Vapor Technologies, Inc., and Veeco Instruments. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.
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