Electronic Thermal Management

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

• Study Reliability and Reporting Limitations
• Disclaimers
• Data Interpretation & Reporting Level
• Quantitative Techniques & Analytics
• Product Definitions and Scope of Study
• End-Use Segments
• Computers
• Telecom
• Medical/Office Equipment
• Industrial/Military
• Consumer Electronics
• Automotive
• Product Segments
• Hardware
• Software
• Interfaces and Substrates

II. EXECUTIVE SUMMARY

1. Industry Overview

• Sophisticated Technology Needs Effective Thermal Management
• Current and Future Analysis
• Regional Perspective
• End-Use Perspective
• Product Segment Perspective

2. Market Trends

• Rising Complexities Present Lucrative Opportunities for Electronic Thermal Management
• PC Market Stimulates Growth
• Thermal Management Subsystems Set for Robust Growth
• New Technologies Under Development
• Liquid Cooling Gaining Foothold
• Semiconductor Manufacturers Look for Thermal Management Technology
• Heat Pipe Gains Popularity among PC Manufacturers
• Imminent Growth for Ics

3. Product Overview

• Thermal Management - A Critical Function
• Electronic Thermal Management Products
• Hardware
• Heat Sinks
• Heat Pipes
• Micro Channels
• Spray Cooling
• Electronic Cooling Fans
• Metal Backplanes
• BGAs
• Software
• Computational Methods of Heat Transfer (CHT) and Fluid Dynamics (CFD)
• Electronic Design Automation (EDA) Software, Electronic Computer Aided Design (ECAD) Software, and Technology Computer Aided Design (TCAD) Software
• Interfaces and Substrates
• Thermal Compounds and Thermal Interface Materials
• Thermal Management Applications
• Computers
• Notebooks/Laptops
• Servers
• Embedded PCs
• Telecom
• Medical
• Industrial Electronics
• Aerospace/Military
• Consumer Electronics
• Automotive

4. Competitive Environment

• Thermal Management - A Fragmented Market
• Table 1: Leading Vendors in the Worldwide Thermal Management Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Aavid Thermalloy, Fluent, Chomerics, Kyocera, and Others (includes corresponding Graph/Chart)
• Thermal Management Hardware Market
• Table 2: Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Breakdown by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and Others (includes corresponding Graph/Chart)
• Fluent - The Undisputed Thermal Management S/W Market Leader
• Table 3: Leading Players in the Worldwide Thermal Management Software Market (2006 & 2007) - Percentage Breakdown by Value Sales for Fluent, Ansys, Flomerics, Daat, and Others (includes corresponding Graph/Chart)
• Chomerics and Bergquist Lead Thermal Management Interface Market
• Table 4: Leading Players in the Worldwide Thermal Management Interface Market (2006 & 2007) - Percentage Breakdown by Value Sales for Chomerics, Bergquist, Aavid Thermalloy, Lytron, and Others (includes corresponding Graph/Chart)
• Amkor Dominates Thermal Management Substrate Market
• Table 5: Leading Players in the Worldwide Thermal Management Substrate Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Kyocera, ST ChipPAC, OSE, ASAT, and Others (includes corresponding Graph/Chart)

5. Technological Development

• Heat Alleviation Technologies for Electronics

6. Product Developments/Introductions

• SMART Releases Liquid-Cooled VLP DDR2 Registered DIMMs
• LORD Develops Materials for Thermal Management
• Dow Corning Introduces New Thermally Conductive Compound
• Astrosyn Unveils a Range of Slide-fit Heatsink Enclosures
• Dell Develops a Liquid-Cooled Heat Sink
• Fujipoly America Develops an Innovative Thermal Interface Material
• Flomerics to Offer T3Ster Thermal Testing System
• Andigilog® Develops ThermalEdge™ Cooling Technology
• Andigilog® Introduces Thermal Management Solutons
• Celsia Releases MicroSpreader™
• Sunon Develops Liquid Circulation Cooling System
• EBM-PAPST Develops Advanced Liquid Cooling System
• EBM-PAPST Introduces New Fan-Cooling Technology
• Hybricon Introduces Liquid-Cooled ATR Chassis
• Ansoft Launches Latest Version of ePhysics as ePhysics v2
• CTS Launches New Line of Low-Profile Forged Heat Sinks
• Honeywell Introduces Screen Printable Phase Change Material in Chip Manufacture
• Laird Launches Thermally Conductive, Electrically Insulating T-preg™ HTD for PCBs
• Laird Introduces Deep Drawing Capability for Shielding Applications
• Laird Introduces Low-Cost T-Gard™ for SMPS Devices
• Laird Introduces T-Gard™ 500 High Performance Insulator for Automotive Industry
• Jaro Develops 450 CFM AC Cooling Fan for Industrial Use
• Jaro Develops IC Cooling Fan With High Flow and Cooling Value
• Mathis Develops Mathis Tci™ For Improved Thermal Conductivity Testing
• Melcor Introduces Extrusion Heat Sinks With Improved Performance
• Fluent Launches New Environmental Thermal Audit Solution for Data Centers
• Kooltronic Introduces Advanced Enclosure Accessories
• Pfannerberg Develops Filterfan®
• Vette Introduces BGA Thermal Solutions
• Sp3 Launches New DiaThermm™ Diamond Heat Spreaders
• Andigilog Releases SC7511 as First in the Series of Intelligent Thermal Management Products
• Degree Controls’ Develops Cooling Products
• Dow Corning Launches Innovative Thermal Management Solutions
• CPS’ Metal Matrix Combination Delivers Sophisticated Thermal Management

7. Recent Industry Activity

• Moog Takes Over Thermal Control Products
• Rensselaer Teams Up with Varsities to Develop Cooling Techniques
• Laird Partners with Sager Electronics
• Honeywell to Expand R&D Facility
• Modine to Divest Thermacore
• Vette Adds ERM
• Laird Takes Over Supercool
• Arlington Capital Acquires Woven Electronics Through Thermal Solutions
• Parker Hannifin Purchases Acofab and Adecem
• Ametek Adds Land Instruments
• Lytron Adds Lockhart Industries
• Seki Technotron Purchases 10% Interest in sp3 Inc.
• OnScreen Purchases Patent of WayCool Thermal Cooling Technology
• Flomerics Acquires NIKA
• Aavid Merges with Ansys and Spins-Off Thermal Management Business
• Celsia and Yeh-Chiang Sign Agreement
• Nextreme Inks License Deal with Caltech
• Celsia Signs Sales & Development Pact with Lighting Science
• Celsia Contracts with Kubo to Expand in Japan
• Hybricon and Parker Hannifin Sign Pact for Cooling Solutions
• Rogers and Thermal Transfer Composites Partner
• sp3 Partners with CPS
• Celsia Teams Up with AET
• Mathis Forms Distribution Partnership with Setaram Instrumentation
• Pentair Takes Over APW’s Thermal Management Operations
• Helix Acquires IGC Polycold
• iCurie Signs Marketing and Sales Agreement with Advanced Energy Technology
• ISR Enters into Agreement with US Air Force to Develop Advanced Thermal Management System for Military Aircrafts
• Symmetry Electronics to Market Andigilog’s Thermal Management System
• ISR Starts Commercial Division for Advanced Electronics
• Vette Takes Over Shun Fu Metal Products
• Laird Acquires Thermagon
• AMETEK Acquires Hughes-Treitler

8. Focus on Select Global Players

• II-VI, Incorporated (USA)
• Marlow Industries (USA)
• Aavid Thermalloy, LLC (USA)
• Advanced Thermal Solutions, Inc. (USA)
• Alcoa, Inc. (USA)
• Alpha Metals (USA)
• Alpha Technologies Group, Inc. (USA)
• Ametek, Inc. (USA)
• Amkor Technology, Inc. (USA)
• Ansoft Corporation (USA)
• Ansys, Inc. (USA)
• Fluent, Inc. (USA)
• ASAT Holdings Ltd. (Hong Kong)
• Brush Engineered Materials, Inc. (USA)
• CTS Corporation (USA)
• Comair Rotron, Inc. (USA)
• Ceramics Process Systems Corporation (USA)
• Chomerics (USA)
• Cool Innovations, Inc. (USA)
• Cooler Master Co., Ltd. (UK)
• Daat Research Corp. (USA)
• Degree Controls, Inc. (USA)
• Dow Corning Corporation (USA)
• Dynatron Corporation (USA)
• Enertron, Inc. (USA)
• Flomerics (UK)
• Fujikura Ltd. (Japan)
• Henkel Loctite Corporation (USA)
• Honeywell Electronic Materials (USA)
• Isonics Corporation (USA)
• Intricast Company Inc (USA)
• ITW Vortec (USA)
• JARO Components, Inc. (USA)
• Kooltronic, Inc. (USA)
• Kyocera Corporation (Japan)
• Laird Technologies (USA)
• Liebert Corporation (USA)
• Lord Corporation (USA)
• Lytron Incorporated (USA)
• Mathis Instruments Ltd (Canada)
• Melcor Corporation (USA)
• Metal Matrix Cast Composites, LLC (USA)
• Micronel U.S. (USA)
• Netzsch Instruments, Inc. (USA)
• Netzsch Thermal Analysis (Germany)
• NMB Technologies Corporation (USA)
• Noren Products, Inc. (USA)
• Orient Semiconductor Electronics Ltd. (Taiwan)
• PC Power & Cooling, Inc. (USA)
• Pfannenberg, Inc. (USA)
• PLANSEE Thermal Management Solutions (USA)
• R-Theta Thermal Solutions, Inc. (Canada)
• Sumitomo Electric Industries, Ltd. (Japan)
• Tech Spray, L. P. (UK)
• Tellurex Corp. (USA)
• The Bergquist Company (USA)
• The Filter Factory, Inc. (USA)
• Thermacore (USA)
• Transene Company, Inc. (USA)
• Tennmax United (USA)
• U.S. Toyo Fan Corporation (USA)
  • United Thermal Engineering Corporation (USA)
  • Vette Corp. (USA)
  • Wakefield Thermal Solutions, Inc. (USA)

9. Global Market Perspective

• Table 6: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management by Product Segment- Hardware, Software, and Interfaces & Substrates Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 7: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 8: World 10-Year Perspective for Electronic Thermal Management by Product Segment - Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 9: World 10-Year Perspective for Electronic Thermal Management by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 10: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Computers by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 11: World 10-Year Perspective for Electronic Thermal Management in Computers by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 12: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Telecom by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 13: World 10-Year Perspective for Electronic Thermal Management in Telecom by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 14: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Medical/Office Equipment by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 15: World 10-Year Perspective for Electronic Thermal Management in Medical/Office Equipment by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 16: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Industrial/Military by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 17: World 10-Year Perspective for Electronic Thermal Management in Industrial/Military by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 18: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Consumer Electronics by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 19: World 10-Year Perspective for Electronic Thermal Management in Consumer Electronics by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 20: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Automotive by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 21: World 10-Year Perspective for Electronic Thermal Management in Automotive by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)

III. MARKET

1. United States

• A. Market Analysis
  • Current and Future Analysis
  • By End-Use Segment
  • By Product Segment
  • Rising Complexities Present Lucrative Opportunitiesfor Electronic Thermal Management
  • Price Pressures and Shifting of Manufacturing toAsia to Restrain Growth
  • Product Developments/Introductions
  • Strategic Corporate Developments
  • Key Players
• B. Market Analytics
  • Table 22: US Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 23: US Recent Past, Current & Future Analysis for Electronic Thermal Management by Product Segment - Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 24: US 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)
  • Table 25: US 10-Year Perspective for Electronic Thermal Management by Product Segment - Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

2. Canada

• A. Market Analysis
  • Current and Future Analysis
  • Product Development
  • Strategic Corporate Development
  • Key Players
• B. Market Analytics
  • Table 26: Canadian Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 27: Canadian 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

3. Japan

• A. Market Analysis
  • Current and Future Analysis
  • Strategic Corporate Development
  • Key Players
• B. Market Analytics
  • Table 28: Japanese Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 29: Japanese 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

4. Europe

• A. Market Analysis
  • Current and Future Analysis
  • Strategic Corporate Developments
  • Key Players
• B. Market Analytics
  • Table 30: European Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 31: European 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

5. Asia Pacific

• A. Market Analysis
  • Current and Future Analysis
  • Taiwan Market Scenario
  • Strategic Corporate Developments
  • Key Players
• B. Market Analytics
  • Table 32: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/ Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 33: Asia-Pacific 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

6. Rest of World

• Market Analysis
• Current and Future Analysis
• Table 34: Rest of World Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 35: Rest of World 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)