Abstract
This IDC study examines all application-specific wired semiconductors (including
application-specific standard products [ASSPs] and application-specific integrated circuits [ASICs])
for the datacom/telecom equipment markets. This includes market rankings for T/E, ATM, SONET/SDH,
network processing, and switch fabric/backplane semiconductor suppliers.
"The increased demand for the deployment of more efficient IP-based designs including IP
DSLAMs, newer 3G basestations, metro Ethernet switches, and next-generation EoS optical transport
will continue to be the major chip innovations in the datacom/telecom semiconductor segment.
Adoption of higher-performance IP, Ethernet, and multiprotocol label switching (MPLS)-capable
infrastructure will also provide increased motivation for service providers to deliver consumer and
business service offerings that are able to increasingly aggregate digitized voice, data, and video
traffic." - Sean Lavey, program manager, Semiconductors: Networking and Storage Systems
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