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[Report]

Chemicals and Materials for Sub-100 nm IC Manufacturing

Published: 2008/06

Contact 24 hrs/day
Description

Table of Contents

Chapter 1 Introduction

Chapter 2 Executive Summary

  • 2.1 Key Industry Trends
  • 2.2 Market Outlook
  • 2.3 Supplier Opportunities

Chapter 3 IC Industry Trends

  • 3.1 IC Industry Growth Forecast
  • 3.2 Trends in IC Processing Technology

Chapter 4 Liquid Chemicals

  • 4.1 Technology Issues
    • 4.1.1 Acids and Solvents
    • 4.1.2 Resists
  • 4.2 Purity Requirements
    • 4.2.1 Purification Methods
      • Trends For Purity - Trace Elements
    • 4.2.2 Particulates
      • Effects on Yield
      • Particulate Removal Techniques
      • Particle Monitoring
  • 4.3 Chemical Management
    • 4.3.1 Introduction
    • 4.3.2 Chemical Usage Reduction

Chapter 5 Gases

  • 5.1 Technology Issues
  • 5.2 Requirements
    • 5.2.1 Purification Alternatives
      • Historical Perspective
      • Trends For Purity - Consistency
    • 5.2.2 Particulate Considerations
      • Particle Monitoring
      • Filtration Methods
    • 5.2.3 Summary

Chapter 6 Sputtering and Evaporation Materials

  • 6.1 Technology Issues
  • 6.2 Purity Requirements

Chapter 7 Market Forecast

  • 7.1 Market Driving Forces & Assumptions
  • 7.2 Chemicals and Materials Forecast
    • 7.2.1 Forecast By Chemical and Material
    • 7.2.2 Chemical Use Per Unit Area Of Silicon Processed
  • 7.2.3 Market Shares

Chapter 8 Strategic Customer Issues

  • 8.1 Benchmarking a Vendor
    • 8.1.1 Statistical Quality Control
      • Assay and Related Items
      • Trace Elements
      • Particles
    • 8.1.2 Analytical Capabilities
    • 8.1.3 Product Manufacturing And/Or Sourcing
    • 8.1.4 General Considerations
      • Installation and Retrofitting Costs
  • 8.2 In-House Quality Control And Assurance
    • 8.2.1 Analytical Tools
    • 8.2.2 How Much Testing
    • 8.2.3 Exhaust Gas Analysis

LIST OF FIGURES

  • 4.1 Relationship Between Device Yield and Particles
  • 4.2 Relationship Between Die Yield and Chip Size
  • 4.3 Chemical Management Services Tasks
  • 6.1 ITRS Roadmap 2003
  • 6.2 Gate-Last Approach
  • 6.3 Gate-First Approach
  • 7.1 Chemical/Semiconductor Revenue Ratio
  • 7.2 Worldwide Resist Market - 2007
  • 7.3 Worldwide Resist Market by Geographic Region
  • 7.4 Resist/Semiconductor Revenue Ratio
  • 7.5 2004 Silicon Wafer Market
  • 7.6 2010 Silicon Wafer Market
  • 7.7 Cost of Chemicals Per Square Inch of Silicon
  • 7.8 2007 Worldwide Market Shares for Gas Suppliers
  • 7.9 2007 Worldwide Market Shares for Liquid Chemical Suppliers
  • 7.10 2007 Worldwide Market Shares for Photoresist Suppliers
  • 7.11 2007 Worldwide Market Shares for Sputtering Target Suppliers
  • 7.12 2007 Worldwide Market Shares for Silicon Wafer Companies

LIST OF TABLES

  • 4.1 Common Wafer Processing Chemicals
  • 4.2 Photoresist Stripping Solutions
  • 5.1 Gas Control System Issues
  • 5.2 Potential Hazards of Processing Gases
  • 7.1 Worldwide Forecast of Chemicals and Materials for IC Manufacture
  • 7.2 Worldwide Market Forecast of Si Wafers
  • 7.3 Worldwide Market Forecast of Sputtering Targets
  • 7.4 Pricing Trend And Forecast For Silicon Wafers
Description

[Report]
Chemicals and Materials for Sub-100 nm IC Manufacturing
Published: 2008/06
Published by : The Information Network The Information Network

Price:
US $ 2,545.00 PDF by E-mail & Hard Copy
US $ 2,495.00 PDF by E-mail
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Product Code : IF4959
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