Cleanrooms and Contamination Control in VLSI Manufacturing

Table of Contents

Chapter 1 Introduction

• 1.1 The Need For This Report

Chapter 2 Executive Summary

• 2.1 Summary of Major Findings
• 2.2 Summary of Market Forecast

Chapter 3 Cleanroom Design

• 3.1 Types of Cleanrooms
• 3.2 Minienvironments
  • 3.2.1 200mm
  • 3.2.2 300mm
• 3.3 Airflow Filtering
• 3.4 Electrostatic Discharge
• 3.5 Impact of ASIC Devices
• 3.6 Impact of VLSI Devices
• 3.7 Impact of Factory Automation and 300mm Wafers

Chapter 4 Worldwide Semiconductor Fabs

• 4.1 North American Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Plant Area
  • Cleanroom Area
• 4.2 European Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Plant Area
  • Cleanroom Area
• 4.3 Japanese Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Cleanroom Area
• 4.4 Korean Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Cleanroom Area
  • Total Sales
• 4.5 Taiwan Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Cleanroom Area
• 4.6 ROW Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Cleanroom Area

Chapter 5 Contamination Issues

• 5.1 Liquid Chemicals
  • 5.1.1 Purification Methods
  • 5.1.2 Particulates
    • Effects on Yield
    • Particulate Removal
    • Particle Monitoring
  • 5.1.3 Bulk Distribution vs Bottles
  • 5.1.4 Piping System Construction
    • Materials of Construction
    • Cost Analysis
• 5.2 Gases
  • 5.2.1 Technology Issues
  • 5.2.2 Requirements
    • Purification Alternatives
    • Purity Trends
    • Particulate Considerations
• 5.3 Deionized Water
  • 5.3.1 Purification Specifications
  • 5.3.2 Purification Specification
  • 5.3.3 Purity Measurement Techniques
  • 5.3.4 Filtration And Ultrafiltration
  • 5.3.5 Piping System Construction
  • 5.3.6 DI Water System Costs
• 5.4 Processing Equipment
  • 5.4.1 Detection Methods
  • 5.4.2 Removal Techniques

Chapter 6 Market Forecast

• 6.1 Market Forecast Assumptions
• 6.2 Cleanroom Construction
  • 6.2.1 Cleanroom Design Criteria
  • 6.2.2 Class 1 Construction Costs
  • 6.2.3 Cleanroom Forecast
• 6.3 Wet Stations And Spray Processors
• 6.3 Forecasts of Liquid and Gas Filters
• 6.4 Gas Purification Systems Market

Chapter 7 Strategic User Issues

• 7.1 Cleanroom Personnel
• 7.2 User Requirements
  • 7.2.1 Benchmarking a Vendor
• 7.3 Need for Standardization

Chapter 8 Strategic Supplier Issues

• 8.1 Process Equipment Cleanliness
• 8.2 Supplier Strategies
• 8.3 Supplier Opportunities

LIST OF TABLES

• 3.1 Cleanroom HVAC Requirements
• 3.2 General Cleanroom Operating Cost Breakdown
• 3.3 Equipment Minienvironments
• 3.4 Comparison Table of DRAM Production Factors
• 5.1 Advantages and Disadvantages of Various Cleaning Metho
• 5.2 Chemical and Material Compatibility
• 5.3 Piping System Economic Analysis for Positive Developer
• 5.4 Gas Control System Issues
• 5.5 Range of Purity of CVD Gases
• 5.6 Potential Hazards of Processing Gases
• 5.7 Particle Sources
• 5.8 Location of In-Situ Monitors By Equipment Type
• 6.1 Worldwide Wafer Fab Projects -- U.S.
• 6.2 Worldwide Wafer Fab Projects -- Japan
• 6.3 Worldwide Wafer Fab Projects -- Europe
• 6.4 Worldwide Wafer Fab Projects -- Korea
• 6.5 Worldwide Wafer Fab Projects - Taiwan
• 6.6 Worldwide Wafer Fab Projects - Asia
• 6.7 Market Shares Of Automated Wet Station Suppliers
• 6.8 Market Shares Of Spray Processor Suppliers
• 6.9 Market For Large Gas Purification Systems
• 6.10 Market For POU Gas Purification Systems
• 6.11 Market For Catalytic Absorption Purification Systems
• 6.12 Market For Catalytic Absorption Purification Systems
• 6.13 Market For Palladium Purification Systems
• 6.14 Market For Palladium Purification Systems
• 6.15 Market For Getter Purification Systems
• 6.16 Market For Getter Purification Systems
• 6.17 Market For Resin Purification Systems
• 6.18 Market For Resin Purification Systems

LIST OF FIGURES

• 1.1 Cleanroom Class Vs Feature Size
• 3.1 Fab Cost Versus Year
• 3.2 Contamination Levels With and Without SMIF Box
• 3.3 FOUP in Cluster Tool
• 3.4 Contamination Levels During Cleanroom Work Cycles
• 5.1 Relationship Between Device Yield and Particles
• 5.2 Relationship Between Die Yield and Chip Size
• 5.3 Sources of Particles
• 6.1 Cleanroom Class Vs Feature Size
• 6.2 Cost of a Semiconductor Facility
• 6.3 Equipment and Facility Cost Ratio
• 6.4 Fab Operational Cost Structure Versus Feature Size
• 7.1 Example of a QC Flow Chart