Sub 100-nm Lithography: Market Analysis and Strategic Issues

Table of Contents

Chapter 1 Introduction

• 1.1 The Need For This Report

Chapter 2 Executive Summary

• 2.1 Summary of Major Issues
• 2.2 Summary of Market Opportunities

Chapter 3 Lithography Issues And Trends

• 3.1 Optical Systems
  • 3.1.1 Step-and-Repeat Aligners
  • 3.1.2 248nm DUV Resist
  • 3.1.3 193nm DUV Resist
  • 3.1.4 Mix-and-Match
  • 3.1.5 Immersion Lithography
  • 3.1.6 EUV
• 3.2 X-Ray Systems
  • 3.2.1 X-Ray Sources
  • 3.2.2 X-Ray Masks
  • 3.2.3 X-Ray Steppers
  • 3.2.4 X-Ray Resists
• 3.3 Electron Beam Systems
• 3.4 Ion Beam Systems
  • 3.4.1 Direct Write
  • 3.4.2 Ion Channel Masking
  • 3.4.3 Ion Projection
• 3.5 Nano-Imprint Lithography
• 3.6 New Technologies
  • 3.6.1 Mulith Reference Distribution Aerial Image Formation
  • 3.6.2 Holograms
  • 3.6.3 X-Ray Laser
  • 3.6.4 Atom Lithography
  • 3.6.5 Microlenses
  • 3.6.7 EWL Lithography
• 3.7 Evaluation of Lithography Cost of Ownership
  • 3.7.1 Introduction
  • 3.6.2 Cost of Ownership Model
  • 3.6.3 Results of Cost of Ownership Calculation
  • 3.6.4 Individual Cost Estimation
    • Lithography System Cost
    • Process Costs
    • Mask Costs
• 3.7 Conclusion

Chapter 4 User - Supplier Strategies

• 4.1 Determining Lithography Needs
• 4.2 Benchmarking a Vendor
  • 4.2.1 Pricing
  • 4.2.2 Vendor Commitment and Attitudes
  • 4.2.3 Vendor Capabilities
  • 4.2.4 System Capabilities
  • 4.2.5 Vendor Feedback During Equipment Evaluation
  • 4.2.6 Vendor Feedback During Device Production
• 4.3 Competitive Environment
• 4.4 Equipment For Class 1 Cleanrooms
• 4.5 Equipment For the Factory of the Future
• 4.6 Opportunities

Chapter 5 Market Forecast

• 5.1 Driving Forces
  • 5.1.1 Technical Trends
  • 5.1.2 Economic Trends
  • 5.1.3 Optical Limitations
• 5.2 Market Forecast Assumptions
• 5.3 Market Forecast

LIST OF FIGURES

• 1.1 Lithographic Equipment Requirements for DRAMs
• 3.1 Lithography Roadmap
• 3.2 Lens Arrangement For Submicron Features
• 3.3 Advanced Optical Lithography Scenarios
• 3.4 Mix-and-Match Approaches
• 3.5 High Index Refractive Materials
• 3.6 EUV Lithography
• 3.7 Illustration of X-Ray Lithography
• 3.8 Schematic Of Scalpel Electron Beam System
• 3.9 Multi-Source E-Beam Lithography
• 3.10 Principles of LEEPL
• 3.11 Ion Projection Lithography System
• 3.12 Hermoplastic Nanoimprint Lithography Process
• 3.13 Step And Flash Nanoimprint Lithography Process
• 3.14 Mulith Reference Distribution Aerial Image Formation
• 3.15 Schematic of Microlens
• 3.16 Mapper Mask-Based Lithography
• 3.17 Mapper Maskless Lithography
• 3.18 CoO Value in DRAM Mass Production
• 3.19 Lithography Costs for 40,000 Wafers/Mask
• 3.20 Lithography Costs for 1,000 Wafers/Mask
• 4.1 Manufacturing Costs Per Exposure Station
• 5.1 Lithography Market Vs Equipment Market
• 5.2 Lithography Requirements
• 5.3 Segmentation of Stepper/Scan Shipments
• 5.4 Market Shares of Vendors (Units)
• 5.5 Unit Market Shares of Vendors
• 5.6 Worldwide I-Line Market Shares
• 5.7 Worldwide 248nm Market Shares
• 5.8 Worldwide 193nm Market Shares
• 5.9 Market Shares of Vendors (Revenues)

LIST OF TABLES

• 3.1 Lithography Requirements for IC Production
• 3.2 Characteristics of X-Ray Systems
• 3.3 Basic Conditions of CoO Model
• 3.4 Calculation List of Lithography System Cost
• 3.5 Throughput Estimation of X-Ray Lithography
• 3.6 Cost of Reticle/X-Ray Mask
• 3.7 Phase Shift Mask and X-Ray Mask Manufacturing
• 5.1 Worldwide Capital Spending
• 5.2 DRAM Lithographic Requirements
• 5.3 Worldwide Optical Stepper Market
• 5.4 Worldwide Stepper Market Shares